PCB ASSEMBLY CAPABILITY
SMT, the full name is surface mount technology. SMT is a way to mount the components or parts onto the boards. Due to the better outcome and higher efficiency, SMT has become the primary approach used in the process of PCB assembly.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
BGA ASSEMBLY CAPABILITY
BGA assembly refers to the process of mounting a Ball Grid Array (BGA) onto a PCB using the reflow soldering technique. BGA is a surface-mounted component that utilizes an array of solder balls for electrical interconnection. As the circuit board passes through a solder reflow oven, these solder balls melt, forming electrical connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
black phosphating drywall screws
screws offer several advantages over other fastening methods. Unlike nails, screws provide a more secure and durable hold, as they create their own threading when being driven into a material.This threading ensures that the screw remains tightly in place, reducing the risk of loosening or disconnection over time. Furthermore. screws can be easily removed and replaced without causing damace to the material, making them a more practical option for temporary or adjustable connections.
read more
PCB Assembly Capability
SMT, the full name is surface mount technology. SMT is a way to mount the components or parts onto the boards. Due to the better outcome and higher efficiency, SMT has become the primary approach used in the process of PCB assembly.
The advantages of SMT assembly
1. Small size and lightweight
Using SMT technology to assemble the components onto the board directly helps to reduce the entire size and the weight of the PCBs. This assemble method allows us to place more components in a restricted space, which can achieve compact designs and better performance.
2. High reliability
After the prototype is confirming, the entire SMT assembly process is almost automated with precise machines, making it minimizes the errors that may be caused by manual involvement. Thanks to the automation, SMT technology ensures the reliability and consistency of the PCBs.
3. Cost-saving
SMT assemble usually realizes through automatic machines. Though the input cost of the machines is high, the automatic machines help to reduce manual steps during SMT processes, which significantly improves the production efficiency and lower the labor costs in the long-run. And there are fewer materials used than through-hole assemble, and the cost would be decreased, too.
| SMT Capability: 19,000,000 point/day | |
| Testing Equipment | X-RAY nondestructive detector,First Article Detector, A0I, ICT detector, BGA Rework Instrument |
| Mounting Speed | 0.036 S/pcs (Best Status) |
| Components Spec. | Stickable minimum package |
| Minimum equipment accuracy | |
| IC chip accuracy | |
| Mounted PCB Spec. | Substrate size |
| Substrate thickness | |
| Kickout Rate | 1.Impedance Capacitance Ratio : 0.3% |
| 2.IC with no kickout | |
| Board Type | POP/Regular PCB/FPC/Rigid-Flex PCB/Metal based PCB |
| DIP Daily Capability | |
| DIP plug-in line | 50,000 point/day |
| DIP post soldering line | 20,000 point/day |
| DIP test line | 50,000pcs PCBA/day |
| Manufacturing Capability of Main SMT Equipment | ||
| Machine | Range | Parameter |
| Printer GKG GLS | PCB printing | 50x50mm~610x510mm |
| printing accuracy | ±0.018mm | |
| Frame size | 420x520mm-737x737mm | |
| range of PCB thickness | 0.4-6mm | |
| Stacking integrated machine | PCB conveying seal | 50x50mm~400x360mm |
| Unwinder | PCB conveying seal | 50x50mm~400x360mm |
| YAMAHA YSM20R | in case of conveying 1 board | L50xW50mm -L810xW490mm |
| SMD theoretical speed | 95000CPH(0.027 s/chip) | |
| Assembly range | 0201(mm)-45*45mm component mounting height: ≤15mm | |
| Assembly accuracy | CHIP+0.035mmCpk ≥1.0 | |
| Quantity of components | 140 types (8mm scroll) | |
| YAMAHA YS24 | in case of conveying 1 board | L50xW50mm -L700xW460mm |
| SMD theoretical speed | 72,000CPH(0.05 s/chip) | |
| Assembly range | 0201(mm)-32*mm component mounting height: 6.5mm | |
| Assembly accuracy | ±0.05mm, ±0.03mm | |
| Quantity of components | 120types (8mm scroll) | |
| YAMAHA YSM10 | in case of conveying 1 board | L50xW50mm ~L510xW460mm |
| SMD theoretical speed | 46000CPH(0.078 s/chip) | |
| Assembly range | 0201(mm)-45*mm component mounting height: 15mm | |
| Assembly accuracy | ±0.035mm Cpk ≥1.0 | |
| Quantity of components | 48 types(8mm reel)/15 types of automatic IC trays | |
| JT TEA-1000 | Each dual track is adjustable | W50~270mm substrate/single track is adjustable W50*W450mm |
| Height of components on PCB | top/bottom 25mm | |
| Conveyor speed | 300~2000mm/sec | |
| ALeader ALD7727D AOI online | Resolution/Visual range/Speed | Option:7um/pixel FOV:28.62mmx21.00mm Standard:15um pixel FOV:61.44mmx45.00mm |
| Detecting speed | <230 millisecond/field of view | |
| Bar code system | automatic bar code recognition(bar code or QR code) | |
| Range of PCB size | 50x50mm(min)~510x300mm(max) | |
| 1 track fixed | 1 track is fixed,2/3/4 track is adjustable;the min. size between 2 and 3 track is 95mm; the max size between 1 and 4 track is 700mm. | |
| Single line | The max track width is 550mm. Double track : the max double track width is 300mm(measurable width); | |
| Range of PCB thickness | 0.2mm-5mm | |
| PCB clearance between top and bottom | PCB top side: 30mm / PCB bottom side: 60mm | |
| 3D SPI SINIC-TEK | Bar code system | automatic bar code recognition(bar code or QR code) |
| Range of PCB size | 50x50mm(min)~630x590mm(max) | |
| Accuracy | 1μm, height: 0.37um | |
| Repeatability | <1um (4sigma) Volume/Area<1%(4sigma), height>1um (4sigma) | |
| Speed of visual field | 0.3s/visual field | |
| Reference point detecting time | 0.5s/point | |
| Max height of detection | ±550um~1200μm | |
| Max measuring height of warping PCB | ±3.5mm~±5mm | |
| Minimum pad spacing | 100um(based on a soler pad with a height of 1500um) | |
| Minimum testing size | rectangle 150um, circular 200um | |
| Height of component on PCB | top/bottom 40mm | |
| PCB thickness | 0.4~7mm | |
| Unicomp X-Ray detector 7900MAX | Light tube type | enclosed type |
| Tube voltage | 90kV | |
| Max output power | 8W | |
| Focus size | 5μm | |
| Detector | high definition FPD | |
| Pixel size | <85μm | |
| Effective detection size | 130*130[mm] | |
| Pixel matrix | 1536*1536[pixel] | |
| Frame rate | 20fps | |
| System magnification | 600X | |
| Navigation positioning | Can quickly locate physical images | |
| Automatic measuring | Can automatically measure bubbles in packaged electronics such as BGA & QFN | |
| CNC automatic detection | Support single point and matrix addition, quickly generate projects and visualize them | |
| Geometric amplification | 300 times | |
| Diversified measurement tools | Support geometric measurements such as distance, angle, diameter, polygon, etc | |
| Can detect samples at a 70 degree angle | The system has a magnification of up to 6,000 | |
| BGA detection | Larger magnification, clearer image, and easier to see BGA solder joints and tin cracks | |
| Stage | Capable of positioning in X,Y and Z directions; Directional positioning of X-ray tubes and X-ray detectors | |
What is BGA Assembly?
BGA assembly refers to the process of mounting a Ball Grid Array (BGA) onto a PCB using the reflow soldering technique. BGA is a surface-mounted component that utilizes an array of solder balls for electrical interconnection. As the circuit board passes through a solder reflow oven, these solder balls melt, forming electrical connections.
Definition of BGA
BGA: Ball Grid Array
Classification of BGA
PBGA: plasticBGA plastic encapsulated BGA
CBGA: BGA for ceramic BGA packaging
CCGA: Ceramic column BGA ceramic pillar
BGA packaged in shape
TBGA: tape BGA with ball grid column
Steps of BGA Assembly
The BGA assembly process typically involves the following steps:
PCB Preparation: The PCB is prepared by applying solder paste to the pads where the BGA will be mounted. The solder paste is a mixture of solder alloy particles and flux, which helps with the soldering process.
Placement of BGAs: The BGAs, which consist of the integrated circuit chip with solder balls on the bottom, are placed onto the prepared PCB. This is typically done using automated pick-and-place machines or other assembly equipment.
Reflow Soldering: The assembled PCB with the placed BGAs is then passed through a reflow oven. The reflow oven heats the PCB to a specific temperature that melts the solder paste, causing the solder balls of the BGAs to reflow and establish electrical connections with the PCB pads.
Cooling and Inspection: After the solder reflow process, the PCB is cooled down to solidify the solder joints. It is then inspected for any defects, such as misalignment, shorts, or open connections. Automated optical inspection (AOI) or X-ray inspection may be used for this purpose.
Secondary Processes: Depending on the specific requirements, additional processes such as cleaning, testing, and conformal coating may be performed after BGA assembly to ensure the reliability and quality of the finished product.
Advantages of BGA Assembly
BGA Ball Grid Array
EBGA 680L
LBGA 160L
PBGA 217L Plastic Ball Grid Array
SBGA 192L
TSBGA 680L
CLCC
CNR
CPGA Ceramic Pin Grid Array
DIP Dual Inline Package
DIP-tab
FBGA
1. Small footprint
BGA packaging consists of the chip, interconnects, a thin substrate, and an encapsulation cover. There are few exposed components and the package has a minimal number of pins. The overall height of the chip on the PCB can be as low as 1.2 millimeters.
2. Robustness
BGA packaging is highly robust. Unlike QFP with a 20mil pitch, BGA does not have pins that can bend or break. Generally, BGA removal requires the use of a BGA rework station at high temperatures.
3. Lower parasitic inductance and capacitance
With short pins and low assembly height, BGA packaging exhibits low parasitic inductance and capacitance, resulting in excellent electrical performance.
4. Increased storage space
Compared to other packaging types, BGA packaging has only one-third of the volume and approximately 1.2 times the chip area. Memory and operational products using BGA packaging can achieve more than a 2.1-fold increase in storage capacity and operational speed.
5. High stability
Due to the direct extension of pins from the center of the chip in BGA packaging, the transmission paths for various signals are effectively shortened, reducing signal attenuation and improving response speed and anti-interference capabilities. This enhances the stability of the product.
6. Good heat dissipation
BGA offers excellent heat dissipation performance, with the chip temperature approaching the ambient temperature during operation.
7. Convenient for rework
The pins of BGA packaging are neatly arranged on the bottom, making it easy to locate damaged areas for removal. This facilitates the rework of BGA chips.
8. Avoidance of wiring chaos
BGA packaging allows for placing many power and ground pins in the center, with I/O pins positioned on the periphery. Pre-routing can be done on the BGA substrate, avoiding chaotic wiring of I/O pins.
RichPCBA BGA Assembly Capabilities
RICHPCBAis a globally renowned manufacturer for PCB fabrication and PCB assembly. BGA assembly service is one of the many service types we offer. PCBWay can provide you with high-quality and cost-effective BGA assembly for your PCBs. The minimum pitch for BGA assembly that we can accommodate is 0.25mm 0.3mm.
As a PCB service provider with 20 years of experience in PCB manufacturing, fabrication and assembly, RICHPCBA has a rich background. If there is a demand for BGA assembly, please feel free to contact us！