| Item |
Rigid PCB（HDI） |
Flexible PCB |
Rigid-Flex PCB |
| Max Layer |
2-68L |
12L |
68L |
| Inner Layer Min Trace/Space |
1.4/1.4mil |
2/2mil |
2/2mil |
| Out Layer Min Trace/Space |
1.4/1.4mil |
3/3mil |
3/3mil |
| Inner Layer Max Copper |
6oz |
2oz |
6oz |
| Out Layer Max Copper |
6oz |
3oz |
6oz |
| Min Mechanical Drilling |
0.15mm/6mil |
0.15mm |
0.15mm |
| Min Laser Drilling |
0.05mm/3mil |
0.05mm |
0.05mm |
| Max Aspect Ratio(Mechanical Drilling) |
20：1 |
/ |
20：1 |
| Max Aspect Ratio(Laser Drilling) |
1:1 |
1:1 |
1:1 |
| Interlayer Alignment |
+/-0.254mm(1mil) |
±0.05mm |
±0.05mm |
| PTH Tolerance |
±0.075mm |
±0.075mm |
±0.075mm |
| NPTH Tolerance |
±0.05mm |
±0.05mm |
±0.05mm |
| Countersink Tolerance |
+0.15mm |
±0.15mm |
±0.15mm |
| Board Thickness |
0.20-12mm |
0.1-0.5mm |
0.4-3mm |
| Board Thickness Tolerance(＜1.Omm) |
±0.1mm |
±0.05mm |
±0.1mm |
| Board Thickness Tolerance(≥1.Omm) |
±8% |
/ |
±10% |
| Min Board Size |
10*10mm |
5*5mm |
10*10mm |
| Max Board Size |
1200mm*750mm |
500*1200mm |
500*500mm |
| Outline Alignment |
+/-0.075mm(3mil) |
±0.05mm |
±0.1mm |
| Min BGA |
0.125mm(5mil) |
7mil |
7mil |
| Min SMT |
0.177*0.254mm(7*10mil) |
7*10mil |
7*10mil |
| Min Solder Mask Clearance |
1.5mil |
2mil |
1.5mil |
| Min Solder Mask Dam |
3mil |
3mil |
3mil |
| Legend |
White,Black,Red,Yellow |
White,Black,Red,Yellow |
White,Black,Red,Yellow |
| Min Legend Width/Height |
4/23mil |
4/23mil |
4/23mil |
| Min Bending Radius(Single Board) |
/ |
3-6 x Board Thickness |
3-7 x Flexbile Board Thickness |
| Min Bending Radius(Double Side Board) |
/ |
6-10 x Board Thickness |
6-11 x Flexbile Board Thickness |
| Min Bending Radius(Multilayer Board) |
/ |
10-15 x Board Thickness |
10-16 x Flexbile Board Thickness |
| Min Bending Radius(Dynamic Bending) |
/ |
20-40 x Board Thickness |
20-40 × Board Thickness |
| Strain Fillet Width |
/ |
1.5+0.5mm |
1.5+0.5mm |
| Bow & Twist |
0.005 |
/ |
0.0005 |
| Impedance Tolerance |
Single-Ended: ±5Ω(≤50Ω)，±7%(＞50Ω) |
Single-Ended: ±5Ω(≤50Ω),±10%(＞50Ω) |
Single-Ended: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Impedance Tolerance |
Differential: ±5Ω(≤50Ω)，±7%(＞50Ω) |
Differential: ±5Ω(≤50Ω),±10%(＞50Ω) |
Differential: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Solder Mask |
Green,Black,Blue,Red,Matt Green,Yellow,White,Purple |
Green Solder Mask/Black PI/Yellow PI |
Green,Black,Blue,Red, Matt Green |
| Surface Finish |
Eiectronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,ImmersionTin,HASL LF,OSP,ENEPIG,Soft gold plating |
Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,OSP,ENEPIG,Soft gold plating |
Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersio Tin,HASL LF,OSP,ENEPIG,Soft gold plating |
| Special Process |
Buried/blind via, step groove, oversized, buried resistance/capacity, mixed pressure, R-F, gold finger, N+N structure, thick copper, back drilling，HDI(5+2N+5) |
gold finger、lamination、Conductive adhesive、Shielding film、metal dome |
Buried/blind via, step groove, oversized, buried resistance/capacity, mixed pressure, R-F, gold finger, N+N structure, thick copper, back drilling |
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