0102030405
Ubwiza bugaragara hamwe na 3D SPI - Kunoza uburyo bwo gucapa Solder Paste neza ku kigero cya 60%
2025-06-06
Ubwiza bugaragara - 3D SPI igenzura ko ingingo z'umugozi zizewe
1. Intangiriro
Bitewe no kuba ibice by'ikoranabuhanga bito bikoreshwa mu gupima neza, ibice by'icyuma gipima neza nka paki za 01005 (0.4 × 0.2mm) na BGA za 0.3mm zishyiraho ibisabwa byinshi ku icapiro rya solder paste.
📊 Gusobanukirwa amakuru: Ubushakashatsi bwerekana ko gukoresha ikoranabuhanga rya 3D SPI bishobora kugabanya umubare w'abakora amakosa mu icapiro ku kigero kirenga 60% (IPC-7527).
2. Amahame ya tekiniki n'ubushobozi bwo kugenzura
2.1 Amahame yo gupima 3D
- ·Ikoranabuhanga ry'urumuri rwubatswe mu buryo buteye imbere: Ihinduka ry'urumuri rw'ubururu rifite ubuziranenge bwa ±1μm.
- ·Impandeshatu ya Lazeri: Ikora neza ku buso bugaragaza urumuri rwinshi.
- ·Ishusho ya Multispectral: Ifata amakuru ya 2D + 3D icyarimwe.
2.2 Ibipimo by'ingenzi by'igenzura
| Igipimo | Ingano yo Gutahura | Uburyo bwo gukora neza | Ihame rya IPC |
|---|---|---|---|
| Ingano | 50–200% by'umubare w'ibice by'ingenzi | ± 5% | IPC-7527 |
| Akarere | 70–130% by'umubare w'ibice by'ingenzi | ± 3% | IPC-A-610 |
| Uburebure | ± 25μm | ± 1μm | J-STD-001 |
| Guhindura umwanya | ± 50μm | ± 5μm | IPC-7351 |
3. Isesengura ry'igereranya ry'imikorere y'ibikoresho
3.1 Ibisobanuro bya sisitemu ya SPI
| Icyitegererezo | Umusozo | Umuvuduko wo Gushakisha | Igice gito | Uburyo bwo gukora neza |
|---|---|---|---|---|
| Koh Young KY8030 | 5μm | 45cm²/s | 01005 | ± 1μm |
| Omron VT-S730 | 7μm | 35cm²/s | 0201 | ± 2μm |
| Saki 3D-SPI | 10μm | 50cm²/s | 01005 | ± 1.5μm |
3.2 Porogaramu za Algorithm y'ubwenge
- ·Ubuhanga bwo gushyira mu byiciro ubuhanga bwa siyansi (AI): >99%
- ·Gutunganya Idirishya ry'Imikorere mu Gihe Nyacyo (PWO)
- ·Gukurikirana no gutanga amakuru kuri SPC imbonankubone
4. Porogaramu zo kunoza imikorere
4.1 Gutunganya Ibipimo bya Capiro
- ·Gukoresha umuvuduko wa Squeegee no kunoza umuvuduko
- ·Gupima umuvuduko wo gutandukanya stencil
- ·Uburyo bwo kwishyura icyuho
4.2 Isesengura ry'Icyerekezo cy'Ubuziranenge
- ·Cpk > 1.67
- ·6σ ishingiro ryo kugenzura ibikorwa
- ·Ishyirwa mu byiciro ry'imiterere y'inenge mu buryo bwikora
5. Imanza zo Gusaba Ubusabe mu Nganda
5.1 Ibyuma by'ikoranabuhanga by'imodoka
- ·Icyemezo cya IATF 16949
- ·Igipimo cy'ubusembwa bwa 0km
- ·Ikizamini cy'ubushyuhe cy'amasaha 3,000 cyatsinze
5.2 Itumanaho rya 5G
- 📶 Umusaruro wa module > 99.9%
- 📡 Ubuziranenge bw'ikimenyetso burahamye
- ⚡ Gutandukana kw'impedansi muri ± 5%
6. Isesengura ry'inyungu mu bukungu
✅ Ibisubizo: Ishyirwa mu bikorwa rya 3D SPI ritanga:
- ✅ Umusaruro wa mbere uri hejuru ya 25–40%
- ✅ 60% by'ikiguzi cyo kuvugurura imirimo
- ✅ 50% by'ibirego bigabanuka
7. Incamake - Agaciro k'ikoranabuhanga rya 3D SPI
- ·Igipimo cya 3D cyo ku rwego rwa micron
- ·Uburyo bwo gutanga ibitekerezo hamwe n'uburyo bwo gucapa
- ·Igikoresho cy'ubuziranenge bw'imikorere y'imbere
🎯 Intego yo gutanga umusaruro: >99.95% Ubwiza bwo gucapa
Amareferensi
- [1] IPC-7527B, 2022
- [2] J-STD-001H, 2023
- [3] IATF 16949:2021
- [4] Imiterere ya tekiniki ya SMTA, 2023
- [5] IPC-A-610H, 2020
0102