Visible Quality with 3D SPI – Improve Solder Paste Printing Accuracy by 60%
2025-06-06
Visible Quality – 3D SPI Ensures Reliable Solder Joints
1. Introduction
With the miniaturization of electronic components, fine-pitch components such as 01005 packages (0.4×0.2mm) and 0.3mm-pitch BGAs impose higher requirements on Solder Paste printing.
📊 Data Insight: Studies show that using 3D SPI technology can reduce printing defect rates by over 60% (IPC-7527).
2. Technical Principles and Inspection Capabilities
2.1 3D Measurement Principles
- ·Structured Light Technology: Blue light phase-shift with ±1μm accuracy.
- ·Laser Triangulation: Effective for high-reflectivity surfaces.
- ·Multispectral Imaging: Captures 2D + 3D data simultaneously.
2.2 Key Inspection Parameters
Parameter | Detection Range | Precision | Ipc Standard |
---|---|---|---|
Volume | 50–200% nominal | ±5% | IPC-7527 |
Area | 70–130% nominal | ±3% | IPC-A-610 |
Height | ±25μm | ±1μm | J-STD-001 |
Position Shift | ±50μm | ±5μm | IPC-7351 |
3. Comparative Analysis of Equipment Performance
3.1 SPI System Specs
Model | Resolution | Scanning Speed | Min. Component | Precision |
---|---|---|---|---|
Koh Young KY8030 | 5μm | 45cm²/s | 01005 | ±1μm |
Omron VT-S730 | 7μm | 35cm²/s | 0201 | ±2μm |
Saki 3D-SPI | 10μm | 50cm²/s | 01005 | ±1.5μm |
3.2 Smart Algorithm Applications
- ·AI classification accuracy: >99%
- ·Real-time Process Window Optimization (PWO)
- ·Live SPC monitoring and alerts
4. Process Optimization Applications
4.1 Printing Parameter Tuning
- ·Squeegee pressure & speed optimization
- ·Stencil separation speed calibration
- ·Gap compensation algorithm
4.2 Quality Trend Analysis
- ·Cpk > 1.67
- ·6σ process control baseline
- ·Auto defect pattern classification
5. Industry Application Cases
5.1 Automotive Electronics
- ·IATF 16949 certified
- ·0km defect rate < 50 PPM
- ·3,000-cycle thermal test passed
5.2 5G Communications
- 📶 Module yield > 99.9%
- 📡 Signal integrity ensured
- ⚡ Impedance deviation within ±5%
6. Economic Benefit Analysis
✅ Result: 3D SPI implementation delivers:
- ✅ 25–40% higher first-pass yield
- ✅ 60% lower rework cost
- ✅ 50% fewer complaints
7. Summary – The Value of 3D SPI Technology
- ·Micron-level 3D measurement
- ·Feedback loop with printing process
- ·Front-end process quality anchor
🎯 Yield Target: >99.95% Printing Quality
References
- [1] IPC-7527B, 2022
- [2] J-STD-001H, 2023
- [3] IATF 16949:2021
- [4] SMTA Technical Proceedings, 2023
- [5] IPC-A-610H, 2020