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Visible Quality with 3D SPI – Improve Solder Paste Printing Accuracy by 60%

2025-06-06

Visible Quality – 3D SPI Ensures Reliable Solder Joints

1. Introduction

With the miniaturization of electronic components, fine-pitch components such as 01005 packages (0.4×0.2mm) and 0.3mm-pitch BGAs impose higher requirements on Solder Paste printing.

📊 Data Insight: Studies show that using 3D SPI technology can reduce printing defect rates by over 60% (IPC-7527).

3D SPI solder paste inspection improves printing accuracy

2. Technical Principles and Inspection Capabilities

2.1 3D Measurement Principles

  • ·Structured Light Technology: Blue light phase-shift with ±1μm accuracy.
  • ·Laser Triangulation: Effective for high-reflectivity surfaces.
  • ·Multispectral Imaging: Captures 2D + 3D data simultaneously.

2.2 Key Inspection Parameters

Parameter Detection Range Precision Ipc Standard
Volume 50–200% nominal ±5% IPC-7527
Area 70–130% nominal ±3% IPC-A-610
Height ±25μm ±1μm J-STD-001
Position Shift ±50μm ±5μm IPC-7351

3D SPI solder paste inspection improves printing accuracy

3. Comparative Analysis of Equipment Performance

3.1 SPI System Specs

Model Resolution Scanning Speed Min. Component Precision
Koh Young KY8030 5μm 45cm²/s 01005 ±1μm
Omron VT-S730 7μm 35cm²/s 0201 ±2μm
Saki 3D-SPI 10μm 50cm²/s 01005 ±1.5μm

3.2 Smart Algorithm Applications

  • ·AI classification accuracy: >99%
  • ·Real-time Process Window Optimization (PWO)
  • ·Live SPC monitoring and alerts

4. Process Optimization Applications

4.1 Printing Parameter Tuning

  • ·Squeegee pressure & speed optimization
  • ·Stencil separation speed calibration
  • ·Gap compensation algorithm

4.2 Quality Trend Analysis

  • ·Cpk > 1.67
  • ·6σ process control baseline
  • ·Auto defect pattern classification

AI-driven-quality-trend-analysis-in-SMT.webp

5. Industry Application Cases

5.1 Automotive Electronics

  • ·IATF 16949 certified
  • ·0km defect rate < 50 PPM
  • ·3,000-cycle thermal test passed

5.2 5G Communications

  • 📶 Module yield > 99.9%
  • 📡 Signal integrity ensured
  • ⚡ Impedance deviation within ±5%

6. Economic Benefit Analysis

Result: 3D SPI implementation delivers:
  • ✅ 25–40% higher first-pass yield
  • ✅ 60% lower rework cost
  • ✅ 50% fewer complaints
(Source: SMTA 2023 Annual Report)

7. Summary – The Value of 3D SPI Technology

  • ·Micron-level 3D measurement
  • ·Feedback loop with printing process
  • ·Front-end process quality anchor

🎯 Yield Target: >99.95% Printing Quality

References

  • [1] IPC-7527B, 2022
  • [2] J-STD-001H, 2023
  • [3] IATF 16949:2021
  • [4] SMTA Technical Proceedings, 2023
  • [5] IPC-A-610H, 2020

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