0102030405
Boleng bo Bonahalang ka 3D SPI - Ntlafatsa ho Nepahala ha ho Hatisa ha Solder Paste ka 60%
2025-06-06
Boleng bo Bonahalang - 3D SPI e Netefatsa Li-Solder Joints tse Tšepahalang
1. Selelekela
Ka ho fokotsa likarolo tsa elektroniki, likarolo tse nang le molumo o mosesaane tse kang liphutheloana tsa 01005 (0.4×0.2mm) le BGA tsa molumo o mosesaane oa 0.3mm li beha litlhoko tse phahameng khatisong ea solder paste.
📊 Temoho ea Lintlha: Lithuto li bontša hore ho sebelisa theknoloji ea 3D SPI ho ka fokotsa sekhahla sa liphoso tsa khatiso ka ho feta 60% (IPC-7527).
2. Melao-motheo ea Tekheniki le Bokhoni ba Tlhahlobo
2.1 Melao-motheo ea Tekanyo ea 3D
- ·Theknoloji ea Leseli le Hlophisitsoeng: Phetoho ea mohato oa khanya e putsoa ka ho nepahala ha ±1μm.
- ·Triangulation ea Laser: E sebetsa hantle bakeng sa libaka tse nang le khanya e phahameng.
- ·Litšoantšo tsa Multispectral: E hapa data ea 2D + 3D ka nako e le 'ngoe.
2.2 Liparamente tsa Tlhahlobo ea Bohlokoa
| Paramethara | Sebaka sa ho lemoha | Ho nepahala | Tekanyetso ea IPC |
|---|---|---|---|
| Molumo | 50–200% ka karolelano | ± 5% | IPC-7527 |
| Sebaka | 70–130% ka karolelano | ± 3% | IPC-A-610 |
| Bolelele | ± 25μm | ± 1μm | J-STD-001 |
| Phetoho ea Boemo | ± 50μm | ± 5μm | IPC-7351 |
3. Tlhahlobo ea Papiso ea Tshebetso ea Lisebelisoa
3.1 Litlhaloso tsa Sistimi ea SPI
| Mohlala | Qeto | Lebelo la ho Sekena | Karolo e nyenyane | Ho nepahala |
|---|---|---|---|---|
| Koh Young KY8030 | 5μm | 45cm²/s | 01005 | ± 1μm |
| Omron VT-S730 | 7μm | 35cm²/s | 0201 | ± 2μm |
| Saki 3D-SPI | 10μm | 50cm²/s | 01005 | ± 1.5μm |
3.2 Lisebelisoa tsa Algorithm e Bohlale
- ·Ho nepahala ha sehlopha sa AI: >99%
- ·Ntlafatso ea Lifensetere tsa Ts'ebetso ea Nako ea 'Nete (PWO)
- ·Tlhokomelo le litemoso tsa SPC tse phelang
4. Likopo tsa Ntlafatso ea Ts'ebetso
4.1 Ho Lokisa Liparamente tsa Khatiso
- ·Khatello ea Squeegee le ntlafatso ea lebelo
- ·Tekanyo ea lebelo la karohano ea stensele
- ·Algorithm ea puseletso ea sekheo
4.2 Tlhahlobo ea Mokhoa oa Boleng
- ·Cpk > 1.67
- ·Motheo oa taolo ea ts'ebetso ea 6σ
- ·Tlhophiso ea paterone ea sekoli se iketsang
5. Linyeoe tsa Kopo ea Indasteri
5.1 Di-elektronike tsa Dikoloi
- ·Setifikeiti sa IATF 16949
- ·Sekhahla sa sekoli sa 0km
- ·Teko ea mocheso ea lipotoloho tse 3,000 e fetisitsoe
5.2 5G Communications
- 📶 Poelo ea mojule > 99.9%
- 📡 Botšepehi ba lets'oao bo tiisitsoe
- ⚡ Phapang ea Impedance ka hare ho ± 5%
6. Tlhahlobo ea Melemo ea Moruo
✅ Sephetho: Ho kenya tshebetsong 3D SPI ho fana ka:
- ✅ Palo e phahameng ea ho pasa pele ke 25–40%
- ✅ Litšenyehelo tsa ho lokisa bocha li theohile ka 60%
- ✅ Litletlebo tse fokolang ka 50%
7. Kakaretso - Boleng ba Theknoloji ea 3D SPI
- ·Tekanyo ea 3D ea boemo ba micron
- ·Sekotwana sa ditshwaelo ka mokhoa wa ho hatisa
- ·Ankora ea boleng ba ts'ebetso ea pele
🎯 Sepheo sa ho hlahisa: >99.95% Boleng ba ho Hatisa
Litšupiso
- [1] IPC-7527B, 2022
- [2] J-STD-001H, 2023
- [3] IATF 16949:2021
- [4] Ditsamaiso tsa Tekheniki tsa SMTA, 2023
- [5] IPC-A-610H, 2020
0102