Ingancin da ake iya gani tare da 3D SPI - Inganta daidaiton buga man shafawa na solder da kashi 60%
2025-06-06
Ingancin da ake iya gani - 3D SPI yana tabbatar da haɗin gwiwa masu aminci na solder
1. Gabatarwa
Tare da rage girman kayan lantarki, kayan da aka yi da kyau kamar fakitin 01005 (0.4×0.2mm) da BGAs masu girman 0.3mm suna buƙatar ƙarin buƙatu akan buga manna mai solder.
📊 Fahimtar Bayanai: Bincike ya nuna cewa amfani da fasahar SPI ta 3D na iya rage yawan lahani a bugu da fiye da kima. kashi 60% (IPC-7527).

2. Ka'idojin Fasaha da Ƙarfin Dubawa
2.1 Ka'idojin Ma'auni na 3D
- ·Fasahar Haske Mai Tsari: Canjin yanayin haske mai launin shuɗi tare da daidaiton ±1μm.
- ·Triangulation na Laser: Yana da tasiri ga saman haske mai ƙarfi.
- ·Hoto Mai Sauƙi: Yana ɗaukar bayanai na 2D + 3D a lokaci guda.
2.2 Sigogin Duba Maɓalli
| Sigogi | Nisan Ganowa | Daidaito | Tsarin IPC |
|---|---|---|---|
| Ƙarar girma | 50–200% na asali | ±5% | IPC-7527 |
| Yanki | 70–130% na asali | ±3% | IPC-A-610 |
| Tsawo | ±25μm | ±1μm | J-STD-001 |
| Canjin Matsayi | ±50μm | ±5μm | IPC-7351 |

3. Binciken Kwatancen Aikin Kayan Aiki
3.1 Bayanin Tsarin SPI
| Samfuri | ƙuduri | Saurin Dubawa | Ƙaramin Sashe | Daidaito |
|---|---|---|---|---|
| Koh Young KY8030 | 5μm | 45cm²/s | 01005 | ±1μm |
| Omron VT-S730 | 7μm | 35cm²/s | 0201 | ±2μm |
| Saki 3D-SPI | 10μm | 50cm²/s | 01005 | ±1.5μm |
3.2 Aikace-aikacen Algorithm Mai Wayo
- ·Daidaiton rarrabuwar AI: >99%
- ·Inganta Tagar Aiki ta Ainihin Lokaci (PWO)
- ·Kulawa kai tsaye da faɗakarwa na SPC
4. Aikace-aikacen Inganta Tsarin Aiki
4.1 Daidaita Sigogi na Bugawa
- ·Inganta matsi da saurin squeegee
- ·Daidaita saurin rabuwar stencil
- ·Tsarin diyya ta gibi
4.2 Binciken Yanayin Inganci
- ·Cpk > 1.67
- ·Tsarin sarrafa tsari na 6σ
- ·Rarraba tsarin lahani ta atomatik

5. Lambobin Aikace-aikacen Masana'antu
5.1 Kayan Lantarki na Motoci
- ·An tabbatar da IATF 16949
- ·0km na lahani
- ·An yi gwajin zafi mai zagaye 3,000
5.2 Sadarwa ta 5G
- 📶 Yawan amfani da na'urar > 99.9%
- 📡 An tabbatar da ingancin sigina
- ⚡ Bambancin juriya a cikin ±5%
6. Binciken Fa'idodin Tattalin Arziki
✅ Sakamako: Tsarin SPI na 3D yana ba da damar yin amfani da waɗannan ƙa'idodi:
- ✅ Kashi 25–40% mafi girma na yawan amfanin farko
- ✅ Rage farashin gyaran fuska kashi 60%
- ✅ Ƙarancin koke-koke 50%
7. Takaitawa - Darajar Fasahar SPI ta 3D
- ·Ma'aunin matakin Micron-3D
- ·Madaurin amsawa tare da tsarin bugawa
- ·Tsarin ingancin tsari na gaba-gaba
🎯 Manufar Samun Yawa: >99.95% Ingancin Bugawa
Nassoshi
- [1] IPC-7527B, 2022
- [2] J-STD-001H, 2023
- [3] IATF 16949:2021
- [4] Takardun Fasaha na SMTA, 2023
- [5] IPC-A-610H, 2020











