Mekhoa e Bohlale ea Tlhahlobo ea PCBA: AOI, SPI, X-Ray, ICT le FCT

1. Selelekela

Ha dihlahiswa tsa elektroniki di ntse di fetoha ho ya ho kopanyo ya bongata bo boholo le ho rarahana ho hoholo, tlhahlobo ya boleng ba PCBA e tobana le diphephetso tse ntseng di eketseha—haholoholo tlhahlobong ya micro-pitch ya dikarolo tsa 0201 (0.6×0.3mm) le tlhahlobo ya manonyeletso a patilweng a solder ka hara dipakete tsa BGA/CSP. IPC-A-610H, tlhahiso ea sejoale-joale e tlameha ho boloka sekhahla sa sekoli se ka tlase ho 500 DPPM. Sengoloa sena se hlalosa tlhahlobo e hlophisitsoeng ea litsamaiso tsa tlhahlobo tsa maemo a mangata, tse kopanyang taolo ea ts'ebetso, mahlale a tlhahlobo a bohlale, le ho latela ha nako ea sebele.

2. Moralo oa Sistimi ea Theknoloji ea Tlhahlobo

2.1 Moralo oa Li-Node tsa Tlhahlobo ea Ts'ebetso e Felletseng

Moralo oa tlhahlobo ea maemo a mane o netefatsa kakaretso ea boleng bo akaretsang:

• ·Pele ho Ts'ebetso: 3D SPI (± 5μm) + AOI bakeng sa ho hokahanya sebaka
• ·Kamora ho Fetoha Botjha: AOI e mahlakore a mabedi + X-Ray ea 3D (qeto ea 5μm)
• ·Teko ea Motlakase: ICT (kabo ea ≥95%) + FCT
• ·Tlhahlobo ea ho Qetela: AVI + liteko tse senyang tsa ho nka sampole

2.2 Matšoao a Bohlokoa a Tshebetso

• ·Nako ea netefatso ea sengoloa sa pele: ≤metsotso e 15 (ha ho bapisoa le lihora tse 2 ka tloaelo)
• ·Sekhahla se setle sa ho phonyoha sekoli:
• ·Ho boloka data ka mokhoa oa ho latela mohlala: Lilemo tse ≥10

3. Tlhahlobo ea Litheknoloji tsa Tlhahlobo ea Motheo

3.1 Papiso ea Litheknoloji tsa Tlhahlobo ea Optical

3.2 Bokgoni ba Tlhahlobo ya X-Ray

• ·Setšoantšo sa CT Tomographic: E lemoha karolelano ea BGA e se nang letho IPC-7095
• ·Ts'ebetso ea Nako ea Sebele: Ts'ebetso ea setšoantšo ea ≥25fps
• ·Ho nepahala ha Tlhophiso e Phethahetseng ea Liphoso: >98% ka li-algorithms tse sebelisoang ke AI

4. Mekhoa ea Teko ea Motlakase

4.1 Meralo ea Teko ea ICT

• ·Teko e fokolang ka ho fetisisa: ≥0.8mm
• ·Mefuta ea motlakase: 0–50V
• ·Ho nepahala ha tekanyo: ± 1% (ho hanyetsa), ± 2% (bokgoni)

4.2 Litharollo tsa Teko ea FCT

• ·Dikanale tsa I/O: E tšehetsa liteishene tse fetang 1000
• ·Sekhahla sa Maqhubu: DC–6GHz
• ·Phoso ea Sebaka se Nepahetseng: ± 5mm

5. Sistimi ea Tsamaiso ea Lintlha ea Boleng

5.1 Dashboard ea Tlhokomelo ea Nako ea Sebele

• ·Tlhokomelo ea chai e phelang (hlahisa metsotso e meng le e meng e 1)
• ·Tlhahlobo e phethahetseng ea 'mapa oa mocheso
• ·Pono ea OEE ea lisebelisoa

5.2 Sistimi ea ho Latela Moralo

• ·Barcode e ikhethang kapa UID bakeng sa boto e 'ngoe le e 'ngoe
• ·Kamano e felletseng ea data ea ts'ebetso
• ·Kopanyo ea MES/QMS e se e loketse

6. Linyeoe tsa Kopo ea Indasteri

6.1 Di-elektronike tsa Dikoloi

• ·E netefalitsoe tlas'a AEC-Q100
• ·Sekhahla sa ho hloleha ha 0km
• ·Ho latela melao ea litlaleho tsa 8D

6.2 Lisebelisoa tsa Bongaka

• ·Ho latela melao ea ISO 13485 bakeng sa lisebelisoa tsa elektroniki tsa bongaka
• ·Tlhahlobo ea 100% ea likarolo tse kotsi haholo
• ·Teko ea ho hloekisa le ho lumellana le tikoloho

7. Tlhahlobo ea Melemo

Ho latela Sekolo se Phahameng sa 2022, ho kenngwa tshebetsong ha ditsamaiso tse bohlale tsa tlhahlobo tsa maemo a mangata ho lebisa ho:

• ·30% keketseho ea chai ea pele ea ho pasa
• ·40% phokotso ea litšenyehelo tsohle tse amanang le boleng
• ·60% litletlebo tsa bareki tse fokolang

8. Kakaretso: Nako e Ncha ea Tlhahlobo e Bohlale ea PCBA

• ·Meralo ea tlhahlobo ea theknoloji e mengata (AOI + SPI + X-Ray + ICT/FCT)
• ·Li-algorithms tse bohlale tsa kahlolo ea liphoso tse tsamaisoang ke AI
• ·Ho latela boleng ba dijithale ka botlalo le kopanyo ya MES

Ka mokhoa ona o hlophisehileng, bahlahisi ba ka fihlella maemo a boleng ba Six Sigma (), ho beha litekanyetso tse ncha bakeng sa ts'epo ea PCBA ea lefats'e.

Litšupiso

1. 1.IPC-A-610H, 2020
2. 2. Ditsamaiso tsa Tekheniki tsa SMTA, 2022
3. 3.AEC-Q100 Rev-H, 2014
4. 4.ISO 13485:2016
5. 5.IPC-7095D, 2021