Ibhodi yovavanyo ye-IC, iBhodi yoVavanyo ye-16L Nayiphi na iLayer HDI PCB
Imiyalelo yokwenziwa kwemveliso
| Uhlobo | Naluphi na umaleko we-HDI impedance resin plug hole hole step groove |
| Izinto | Uthotho lwe-EM370D olunesantya esiphezulu |
| Inani leleya | 16L |
| Ubukhulu beBhodi | 1.6mm |
| Ubungakanani obunye | 70*91.89mm/1PCS |
| Ukugqitywa komphezulu | I-ENEPIC |
| Ubukhulu bobhedu bangaphakathi | 35um |
| Ubukhulu bobhedu bangaphandle | 35um |
| Umbala wemaski yesolder | oluhlaza (GTS, GBS) |
| Umbala wesikrini sesilika | emhlophe (GTO,GBO) |
| Ngonyango | umngxuma weplagi ye-resin + ukugcwalisa nge-microvia |
| Ubuninzi bomngxuma wokugrumba ngoomatshini | 19W/㎡ |
| Ubuninzi bomngxuma wokugrumba nge-laser | 100W/㎡ |
| Ubungakanani obuncinci | 0.1mm |
| Ububanzi bomgca/indawo encinci | 2/2ml |
| Umlinganiselo wokuvula | 12mil |
| Amaxesha okucinezela | Izihlandlo ezi-6 |
| Amaxesha okubhola | Ixesha lesi-7 |
| I-PN | E1691047 |
Ukuqonda ulwakhiwo lwe-PCB Stacking: Isikhokelo esipheleleyo
3. Iileya zokuvala ubushushu
Iileya zokwambathisa, eziqhele ukwenziwa ngezinto ezifana ne-polyimide okanye i-FR-4, zibekwe phakathi kweeleya zokuqhuba. Umsebenzi wazo oyintloko kukubonelela ngokwahlulwa kombane, ukuthintela iisekethe ezimfutshane kunye nokuphazamiseka kwesignali phakathi kweeleya. Umgangatho weeleya zokwambathisa uchaphazela ngokuthe ngqo ukusebenza kombane we-PCB, ngakumbi kwizicelo ze-frequency ephezulu okanye ezinoxinano olukhulu.
4. Umaleko weMaski yeSolder
Umaleko ongaphandle we-PCB ngumaleko wemaski yesolder, odla ngokuba luhlaza, okhusela ibhodi kwiisekethe ezimfutshane zesolder kunye nomonakalo ongqongileyo. Olu maleko luphucula umgangatho wesolder ngokuqinisekisa ukuba i-solder inamathela kuphela kwiipads ezifunekayo, nto leyo enciphisa umngcipheko weziphene zesolder ezifana namalungu e-solder abandayo kunye neebridges zesolder.
5. Umaleko weSilkscreen
Ukongeza kwiileya eziphambili, ii-PCB ezininzi ziquka umaleko we-silkscreen. Olu maleko lusetyenziselwa ukuprinta iileyibhile zecandelo, amanani, kunye nolunye ulwazi olubalulekileyo ebhodini. Lunceda ekubekeni icandelo ngokufanelekileyo ngexesha lokuhlanganiswa kwaye lubonelela ngereferensi ebalulekileyo yokugcinwa nokulungiswa.
Amagama angundoqo e-SEO: Ulwakhiwo lwe-PCB stacking, umaleko we-PCB substrate, iileya eziqhubayo ze-PCB, iileya zokugquma ze-PCB, umaleko wemaski ye-solder ye-PCB, umaleko we-silkscreen ye-PCB, uyilo lweBhodi yeSekethe ePrintiweyo
Ngokuqonda nokwenza ngcono ulwakhiwo lwe-PCB stacking, abavelisi banokufikelela kunxibelelwano oluntsonkothileyo lombane kwaye baqinisekise ukusebenza okuphezulu kunye nobude bexesha leemveliso ze-elektroniki. Umaleko ngamnye ngaphakathi kwesakhiwo se-stacking udlala indima ebalulekileyo ekusebenzeni kwe-PCB, ukuqinisekisa ukusebenza okuthembekileyo kwiindawo ezahlukeneyo zokusebenza.
Iprojekthi yoHlolo lweCandelo lePCB: Ukuqonda okuBanzi kunye nokuChongwa kweziphene
Uqhagamshelo lwe-Interlayer: Hlola imeko yoqhagamshelo lwe-interlayer ukujonga uqhagamshelo olubi okanye ii-short circuits.
Ububanzi kunye noBukhulu boMgca: Linganisa ububanzi kunye nobukhulu bemigca ukuqinisekisa ukuba iyahlangabezana neemfuno zoyilo. Imigca ebanzi kakhulu okanye ebhityileyo kakhulu inokuchaphazela ukusebenza komqhubi wamandla.
Umgangatho Wemingxunya: Hlola ubungakanani kunye nendawo yemingxunya ebholiweyo, kwaye uqinisekise ukuba iindonga zigudile kwaye azinazimfa. Iingxaki zemingxunya zinokubangela uqhagamshelo olubi lombane okanye amandla angonelanga oomatshini.
Ukungaguquguquki kwezinto: Vavanya ukuhambelana kwezinto ze-PCB, kubandakanya ubukhulu kunye nokufana kwezinto zokwambathisa. Izinto ezingaguquguqukiyo zinokubangela ukuguquguquka kokusebenza kwebhodi yesekethe.
Indlela Yokuchonga Iimveliso Ezineengxaki:
Ngokuhlola iindawo ezahlukeneyo, iimveliso ezineziphene zinokuchongwa ngokusekelwe kwiimpawu ezilandelayo:
Ukuxobula okanye ukuDilamination: Ukudilamination kweeleya kudla ngokubonisa ukusetyenziswa kwezinto zokuncamathelisa ezikumgangatho ophantsi okanye iingxaki zenkqubo ngexesha lokuvelisa.
Ukucocwa kweFoyile yeCopper: Ukuqhekeka kwefoyile yeCopper kusenokubangelwa kukulawulwa kobushushu okungafanelekanga okanye iingxaki zomgangatho wezinto ngexesha lemveliso.
Ukonakala kwePad: Ukonakala kwepad kudla ngokubangelwa kukuphathwa ngendlela engafanelekanga okanye iziphene zezinto ezisetyenzisiweyo ngexesha lokwenziwa.
Iingxaki zeMingxunya: Imingxunya engachanekanga okanye eneziphene inokuchaphazela ukusebenza kunye nokuthembeka kwebhodi yesekethe.
Ngokuhlolwa okubanzi kwamacandelo ahlukeneyo, sinokufumanisa ngokukhawuleza size silungise ezi ngxaki, siqinisekise umgangatho kunye nokuthembeka kweemveliso ze-PCB ukuhlangabezana nemigangatho ephezulu yabathengi. Ukuhlolwa ngokuchanekileyo akupheleli nje ekuphuculeni ukusebenza kwemveliso kodwa kunciphisa iindleko zokulungisa nokulungisa kamva, kubonelela abathengi ngezisombululo zebhodi yesekethe ezikumgangatho ophezulu.
Ukusetyenziswa kwee-PCB eziDibeneyo zokuXhumana
Izixhobo zonyango
Kwizixhobo zonyango ezifana noomatshini be-electrocardiogram (ECG), ii-ultrasound scanners, kunye neemonitha, ii-PCB ezidibeneyo ngokungacwangciswanga zibonelela ngonxibelelwano oluntsonkothileyo lwesekethe ukuqinisekisa ukulinganiswa okuchanekileyo kunye nokukwazi ukucubungula idatha.
Izixhobo zombane zeemoto
Iinkqubo ezahlukeneyo ze-elektroniki kwizithuthi zanamhlanje, ezifana neenkqubo zokuzonwabisa, iinkqubo zokuhamba, kunye neenkqubo zoncedo lomqhubi eziphambili (i-ADAS), zixhomekeke kwii-PCB ezidibeneyo ezingacwangciswanga ukuze ziphathe idatha enkulu ye-sensor kunye nemiqondiso yokulawula. Ezi PCB kufuneka zinyamezele amaqondo obushushu aphezulu kunye nokungcangcazela.
Iinkqubo zoLawulo lweShishini
Kwiinkqubo zolawulo kunye noomatshini abasebenza ngokuzenzekelayo kwimizi-mveliso, ii-PCB ezidityanisiweyo ngokungacwangciswanga zisetyenziselwa ukuqhagamshela ii-sensors, ii-actuators, kunye neeyunithi zolawulo. Ezi PCB zilawula imisebenzi enzima yokulawula kunye nokucubungula imiqondiso.
Izixhobo ze-elektroniki zabathengi
Oku kuquka iimveliso ezinje ngoomabonakude, iinkqubo zesandi, kunye nezixhobo zasekhaya ezikrelekrele, ezidla ngokufuna i-high-density routing ukuxhasa imisebenzi emininzi kunye ne-interfaces. Ii-PCB ezidibeneyo ngokungakhethiyo zibonelela ngezisombululo zoyilo eziguquguqukayo kwezi mfuno.
Umkhosi kunye neenqwelo-moya
Izixhobo zomkhosi nezeenqwelo-moya zifuna ukuthembeka okuphezulu nokusebenza kakuhle. Ii-PCB ezidityanisiweyo ngokungacwangciswanga zisetyenziswa kwezi ndawo kwiinkqubo ze-elektroniki ezintsonkothileyo, ukuqinisekisa ukusebenza okuzinzileyo kwiindawo ezixineneyo.
Ezi ndawo zesicelo zibonisa ukusetyenziswa ngokubanzi kunye nokubaluleka kwee-PCB ezidibeneyo ngokungacwangciswanga ekuhlangabezaneni neemfuno zeemfuno zendlela ezixineneyo nezintsonkothileyo.
Imingeni yoYilo lwee-PCB eziDibeneyo ngokungacwangciswanga
Ukuyila ii-PCB ezidibanisa ngokungacwangciswanga kuzisa imingeni emininzi:
Ukunyaniseka kweSignali
Indlela entsonkothileyo yokuhambisa imiyalezo ingakhokelela kwiingxaki zesignali ezifana nokuphazamiseka kunye nokulibaziseka. Ulawulo oluchanekileyo lwendlela yesignali lubalulekile, ingakumbi kwizicelo ezisetyenziswa rhoqo, ukuqinisekisa ukucaca kunye nozinzo lwesignali.
Ukuhambelana kwe-Electromagnetic (EMC)
Ukujikeleza okuxineneyo kunokubangela ukuphazamiseka kwe-electromagnetic (EMI). Ukukhusela, ukumisa umhlaba, kunye nokucoca okusebenzayo kubalulekile ukuze kuhlangatyezwane nemigangatho ye-EMC kunye nokunciphisa ukuphazamiseka kwezinye izixhobo.
Ulawulo lobushushu
Uyilo oluxineneyo lunokubangela ukwakheka kobushushu phakathi kwezinto. Ukusasazwa kobushushu ngokufanelekileyo kunye nezisombululo zokupholisa, ezifana nezitya zobushushu, ziyimfuneko ukuthintela ubushushu obugqithisileyo nokuqinisekisa ukusebenza kakuhle kwesekethe.
Ubunzima bokuHamba
Ukulawula uqhagamshelo oluntsonkothileyo kunye nokunqumla iileya kongeza ubunzima kuyilo nakwimveliso. Ukuhambisa ngendlela ecacileyo nethembekileyo kuyafuneka ukuze kuthintelwe ii-short circuits kunye neengxaki zemveliso.
Uyilo lwe-Layer Stack-Up
Ii-PCB ezinamanqwanqwa amaninzi zifuna ulawulo oluchanekileyo lokufakwa kwe-insulation kumanqwanqwa, ubukhulu be-copper, kunye nokulungelelaniswa ukuqinisekisa ukwahlulwa kombane okufanelekileyo kunye nozinzo loomatshini.
Ukunyamezela kweMveliso
Ii-PCB ezinoxinano oluphezulu zifuna ukunyamezelana okungqongqo kokwenziwa kwemveliso. Nakuphi na ukuphambuka okuncinci kunokuchaphazela ukusebenza, ngoko ke uyilo kufuneka luqwalasele amandla okuvelisa kunye nokunyamezelana.
Ulawulo lweendleko
Uyilo oluntsonkothileyo ludla ngokunyusa iindleko zezinto zokwakha, ukucubungula, kunye nokuvavanya. Ukulinganisela iimfuno zokusebenza kunye nemida yohlahlo-lwabiwo mali kubalulekile.
Uvavanyo kunye nokulungisa iimpazamo
Indlela yokusebenza enzima yenza kube nzima ukuvavanya nokulungisa iimpazamo. Iindlela zoyilo lokuvavanya (DFT) zinceda ekwenzeni lula ezi nkqubo.
Le mingeni ifuna abayili abanamava kunye nezixhobo eziphambili ukuqinisekisa ukusebenza okuphezulu kunye nokuthembekileyo kwee-PCB ezidibeneyo ngokungacwangciswanga.
Ukutyhila Amandla eTekhnoloji ye-PCB yoXinzelelo oluPhezulu
Kwihlabathi elikhula ngokukhawuleza le-elektroniki, itekhnoloji ye-High-Density Interconnect PCB (HDI PCB) ivelele njengotshintsho olukhulu. I-HDI PCB Manufacturing iguqule indlela eziyilwe kwaye ziveliswa ngayo iinkqubo ze-elektroniki ezintsonkothileyo, inika iingenelo ezingenakuthelekiswa nanto ngokubhekiselele ekusebenzeni kakuhle.
Ukuqonda iTekhnoloji ye-HDI
Uyilo lweBhodi ye-HDI lugxile ekuphuculeni unxibelelwano lwezixhobo ze-elektroniki. ITekhnoloji ye-HDI ibandakanya iindlela eziphambili ezifana nee-microvias kunye nee-blind/buryed vias, ezivumela uyilo lweesekethe oluntsonkothileyo kunye nokuphuculwa kokuthembeka kwesignali. Le teknoloji ixhasa iTekhnoloji ye-High-Density Interconnect, evumela ukudalwa kweebhodi zeesekethe ezincinci nezisebenza kakuhle.
Iimpawu eziphambili kunye neenzuzo
Iimpawu ze-HDI PCB ziquka ukwanda koxinano lwezixhobo, ukusebenza kombane okuphuculweyo, kunye nobukhulu bebhodi obuncitshisiweyo. Uyilo lwe-Advanced HDI PCB ludibanisa ezi mpawu, lubonelela ngeeNzuzo ezibalulekileyo ze-HDI PCB ezifana nokuthembeka okuphuculweyo kunye nolawulo olungcono lobushushu. Iibhodi zeSekethe ze-HDI zenzelwe ukuphatha imiqondiso yesantya esiphezulu ngaphandle kokuphazamiseka okuncinci, okwenza ukuba zilungele ukusetyenziswa kwezixhobo eziphambili.
Ukuvelisa kunye neNkqubo
Inkqubo ye-HDI PCB ibandakanya amanyathelo aliqela abalulekileyo, kuquka ukubhola ngokuchanekileyo ii-microvias kunye nokubeka ii-layer stacking ngononophelo. Ukwenziwa kwe-HDI PCB kufuna izixhobo eziphucukileyo kunye nobuchule ukuqinisekisa iziphumo ezisemgangathweni ophezulu. Ii-Microvias kwii-HDI PCBs zidlala indima ebalulekileyo ekudibaniseni ii-layer ezahlukeneyo kwi-PCB, zinegalelo ekusebenzeni ngokubanzi kunye nokuthembeka kwebhodi.
Izicelo kunye neZakhono
Ii-HDI PCB Applications zigubungela amashishini ahlukeneyo, kuquka unxibelelwano, iimoto, kunye nezixhobo zonyango. Amandla e-HDI PCB avumela ukudityaniswa kweesekethe ezintsonkothileyo kwimo encinci, nto leyo eyenza ukuba zifaneleke kwizixhobo ze-elektroniki zanamhlanje ezifuna ukusebenza okuphezulu kunye nobukhulu obuncinci.
Ngamafutshane, iteknoloji ye-HDI PCB imele inyathelo elikhulu phambili kwicandelo le-elektroniki, inika ukusebenza okuphezulu, ukuthembeka, kunye nokuguquguquka koyilo. Njengoko i-HDI PCB Manufacturing iqhubeka nokutshintsha, ivula indlela yezisombululo ze-elektroniki eziphucukileyo nezisebenzayo.