I-Optical Module HDI PCB I-Optical Module Gold Finger PCB
Imiyalelo yokwenziwa kwemveliso
| Uhlobo | i-HDI eneeleya ezimbini, i-impedance, umngxuma weplagi ye-resin |
| Izinto | I-Laminate yeCopper-Clod yePanasonic M6 |
| Inani leleya | 10L |
| Ubukhulu beBhodi | 1.2mm |
| Ubungakanani obunye | 150 * 120mm / 1SET |
| Ukugqitywa komphezulu | I-ENEPIC |
| Ubukhulu bobhedu bangaphakathi | 18um |
| Ubukhulu bobhedu bangaphandle | 18um |
| Umbala wemaski yesolder | oluhlaza (GTS, GBS) |
| Umbala wesikrini sesilika | emhlophe (GTO,GBO) |
| Ngonyango | 0.2mm |
| Ubuninzi bomngxuma wokugrumba ngoomatshini | 16W/㎡ |
| Ubuninzi bomngxuma wokugrumba nge-laser | 100W/㎡ |
| Ubungakanani obuncinci | 0.1mm |
| Ububanzi bomgca/indawo encinci | 3/3ml |
| Umlinganiselo wokuvula | 9mil |
| Amaxesha okucinezela | Izihlandlo ezi-3 |
| Amaxesha okubhola | Ixesha eli-5 |
| I-PN | E240902A |
Amanqaku Aphambili Olawulo Ekuvelisweni Kwee-PCB Zeminwe Zegolide ze-Optical Module HDI
- 1. Ulawulo Lokugcagca Ngokuchanekileyo Ucingo lweminwe yegolide kunye nee-HDI PCB luyinkimbinkimbi kakhulu, nto leyo eyenza ulawulo lwenkqubo yokugcagca lube lubaluleke kakhulu. Ukugcagca okungalunganga kunokukhokelela kububanzi bemigca engalinganiyo, iisekethe ezimfutshane, okanye iisekethe ezivulekileyo. Ke ngoko, kufuneka kusetyenziswe izixhobo zokugcagca ngokucokisekileyo, kwaye kufuneka kulinganiswe rhoqo ukuqinisekisa ukuchaneka kunye nokuhambelana kwenkqubo yokugcagca.
3, Ulawulo lweNkqubo yokuLamination Ukulamination linyathelo elibalulekileyo apho iileya ezininzi zePCB zicinezelwa kunye. Ukulawula ubushushu, uxinzelelo, kunye nexesha ngexesha lokulamination kubalulekile ukuqinisekisa ukuqina kweeleya kunye nobukhulu bebhodi obufanayo. Ukulamination okungekho semgangathweni kunokubangela ukuqhekeka okanye imingxuma, okuchaphazela ukusebenza kombane kunye namandla oomatshini.
4, Ulawulo Lobukhulu Beplati Yeminwe Yegolide Ubukhulu beplati yegolide kwiminwe yegolide buchaphazela ngokuthe ngqo ubomi bokufakelwa kunye nokuthembeka koqhagamshelwano. Ukuba iplati yegolide incinci kakhulu, inokuguga ngokukhawuleza; ukuba inzima kakhulu, inyusa iindleko. Ke ngoko, ngexesha lenkqubo yeplati, ixesha leplati yegolide kunye noxinano lwangoku kufuneka kulawulwe ngokungqongqo ukuqinisekisa ukuba ubukhulu beplati buhlangabezana nemigangatho (ngesiqhelo yi-30-50 microintshi).
5. Ulawulo lwe-Impedance kunye noVavanyo lweeModule ze-Optical HDI PCB zihlala zisingatha imiqondiso yesantya esiphezulu, nto leyo eyenza ulawulo lwe-impedance lube lubalulekile. Ngexesha lokuvelisa, izixhobo zovavanyo lwe-impedance kufuneka zisetyenziswe ukujonga nokulinganisa umkhondo wesignali ebalulekileyo ngexesha langempela, ukuqinisekisa ukuba i-impedance ingaphakathi koluhlu loyilo (umz., i-100 ohms). I-impedance engahambelaniyo inokubangela imiba yokuthembeka kwesignali, njengokubonakalisa kunye nokuthetha ngokulandelelana.
6,Ulawulo loMgangatho wokuSoldering Ngenxa yoxinano olukhulu lwezinto ezibandakanyekayo kwi-PCBs ze-optical module, inkqubo yokusoldering kufuneka ibe chanekileyo kakhulu. Izixhobo zokusoldering eziphucukileyo kunye nezixhobo zokusoldering zamaza ziyafuneka, kwaye iiprofayili zobushushu zokusoldering kufuneka zilawulwe ngokungqongqo ukuqinisekisa ukuqina kwamalungu okusolder kunye nokuthembeka konxibelelwano lombane.
7、Ukucocwa nokuKhuselwa komphezulu Kuzo zonke izigaba zemveliso, umphezulu we-PCB kufuneka ugcinwe ucocekile ukuze kuthintelwe uthuli, iminwe, okanye iintsalela ze-oxidation. Ezi zinto zingcolisayo zinokubangela ii-shorts zombane okanye zichaphazele umgangatho we-plating. Emva kwemveliso, kufuneka kusetyenziswe izinto ezifanelekileyo zokukhusela ukuthintela ukufuma kunye nokungcola ukuba kungangeni.
8, Ukuhlolwa koMgangatho kunye noQinisekiso Ukuhlolwa komgangatho okupheleleyo, kubandakanya ukuhlolwa okubonakalayo, uvavanyo lombane, kunye novavanyo olusebenzayo, kubalulekile. Iindlela zokuhlola eziqhelekileyo ziquka uVavanyo oluzenzekelayo lwe-Optical (AOI), uvavanyo lwe-flying probe, kunye nokuhlolwa kwe-X-ray ukuqinisekisa ukuba i-PCB nganye iyahlangabezana neemfuno zoyilo kunye nemigangatho yomgangatho.
Ukubaluleka kokuhambisa umzila kwii-PCB ze-Optical Module HDI
- Ubukhulu kunye nesithuba: Ububanzi kunye nesithuba seminwe yegolide kufuneka kulawulwe ngokungqongqo ukuqinisekisa ukuba ihambelana kakuhle nezihlanganisi. Ngokubanzi, ububanzi beminwe yegolide yi-0.5mm, kunye nesithuba se-0.5mm.
- Ukuchopha umphetho: Ukuchopha umphetho kudla ngokufuneka emaphethelweni e-PCB apho kukho khona iminwe yegolide ukuze kube lula ukufaka izinto ezithambileyo kwiindawo ezivulekileyo.
Ukubalwa kweLayer kunye nokuQokelelwa kweStacking: Ii-HDI PCB zihlala ziquka uyilo lwe-multilayer ukubonelela ngeendlela ezininzi zokunxibelelana ngombane. Ukubalwa kweLayer kunye noyilo lweStacking kufuneka kuqwalaselwe ukuqinisekisa ukuthembeka kwesignali kunye nokuthembeka kwamandla.
IiMicrovias: Ukusebenzisa itekhnoloji ye-microvia, efana nee-vias ezingaboniyo nezingcwatywe ngasemva, kunokunciphisa ngokufanelekileyo ubude bonxibelelwano phakathi kweeleya, ngaloo ndlela kunciphisa ukulibaziseka kwesignali kunye nokulahleka kwayo. Ezi microvias zifuna ulawulo oluchanekileyo lwendawo yazo kunye nobukhulu bazo.
Uxinano lweNdlela: Ngenxa yoxinano oluphezulu lweebhodi ze-HDI, kufuneka kuqwalaselwe ngokukodwa ububanzi kunye nesithuba seendlela ezilandelwayo. Ngokwesiqhelo, ububanzi beendlela ezilandelwayo yi-3-4 mil, kwaye isithuba sikwayi-3-4 mil.
3,Ukunyaniseka kweSignali
Indlela Yokuhambisa Iindidi Ezihlukeneyo: Ukuhanjiswa kwesignali yesantya esiphezulu esetyenziswa rhoqo kwiimodyuli ze-optical kufuna indlela yokuhambisa iindidi ezahlukeneyo ukunciphisa ukuphazamiseka kwe-electromagnetic kunye nokubonakaliswa kwesignali. Ubude kunye nesithuba seendidi ezahlukeneyo kufuneka zihambelane, ukuqinisekisa ulawulo lwe-impedance ngaphakathi koluhlu olufanelekileyo (umz., i-100 ohms).
Ulawulo Lokungathinteli: Kwindlela yokuhambisa isignali ngesantya esiphezulu, ulawulo oluqinileyo lokungathinteli lubalulekile. Ukuthelekiswa kokungathinteli kunokufezekiswa ngokulungelelanisa ububanzi bomkhondo, isithuba, kunye nokufakwa kweengqimba.
Ngokusebenzisa: Ukusetyenziswa kwee-vias kufuneka kuncitshiswe, njengoko kungenisa amandla kunye nokungena kwe-parasitic, okuchaphazela umgangatho wesiginali. Xa kuyimfuneko, kufanelekile ngokusebenzisa iintlobo (ezifana nee-vias ezingaboniyo nezingcwatyiweyo) kunye neendawo kufuneka zikhethwe.
IiCapacitors zokuSusa: Ukubekwa ngokufanelekileyo kweeCapacitors zokuSusa kunceda ukuzinzisa i-voltage yombane kunye nokunciphisa ingxolo yamandla.
Uyilo lwePlanethi yamandla: Ukwamkela uyilo lweplane yamandla aqinileyo kuqinisekisa ukusasazwa kombane okufanayo kwaye kunciphisa ukuphazamiseka kwe-electromagnetic (EMI).
Ulawulo lobushushu: Ekubeni iimodyuli ze-optical zivelisa ubushushu obukhulu ngexesha lokusebenza, izisombululo zolawulo lobushushu kufuneka ziqwalaselwe kuyilo, njengokusebenzisa ii-thermal vias, izixhobo eziqhuba ubushushu, okanye ii-heat sinks ukuphucula ukusebenza kakuhle kokusasazwa kobushushu.
6,Ukukhetha Izinto
Izinto ezisetyenziswa kwi-substrate: Khetha ii-substrate ezifanelekileyo kwizicelo ezisetyenziswa rhoqo, ezifana ne-polyimide (PI) okanye i-fluoropolymers, ukuqinisekisa ukuhanjiswa kwesignali okuthembekileyo nokuzinzileyo.
Imaski yeSolder: Sebenzisa izixhobo zemaski yesolder ezinobushushu obuphezulu nezingenalahleko kangako ukuqinisekisa ukhuseleko lwemikhondo kunye nokusebenza kombane.
Ii-PCB ze-Gold finger HDI zisetyenziswa kakhulu kwiindawo ezahlukeneyo ngenxa yoxinano lwazo oluphezulu kunye neempawu zazo zokusebenza okuphezulu:
5. Izixhobo zonyango: Kwizixhobo zonyango ezifunwa kakhulu njengee-CT scanners, oomatshini be-MRI, kunye nezinye izixhobo zokuxilonga, ii-gold finger HDI PCBs ziqinisekisa ukuhanjiswa kwedatha ngokuchanekileyo kunye nokusebenza okuthembekileyo kwezixhobo.
- 6、Indawo yomoya: Ezi PCB zisetyenziswa kwiinkqubo zolawulo lweesathelayithi, iinqwelomoya, kunye neenqanawa zomoya, njengoko zinokumelana neemeko ezinzima zokusingqongileyo ngelixa zigcina ukusebenza okuphezulu.
- 7、Ulawulo lweShishini: Kwicandelo le-automation yemizi-mveliso, ii-PLC (iiProgrammable Logic Controllers), kunye neerobhothi zemizi-mveliso, ii-gold finger HDI PCB zibonelela ngolawulo oluthembekileyo kunye nokudluliselwa kwesignali.
Umnwe wegolide
Intshayelelo eneenkcukacha kwiMinwe yeGolide
Iminwe yegolide ibhekisa kwiindawo ezigqunywe ngegolide emaphethelweni ebhodi yesekethe eprintiweyo (i-PCB). Ziqhele ukusetyenziselwa ukwenza uqhagamshelo lombane ngee-connectors. Igama elithi "iminwe yegolide" livela kwimbonakalo yazo: iindawo ezigqunywe ngegolide ezifana ne-strip zifana neminwe. Iminwe yegolide idla ngokusetyenziswa kwii-PCB ezifakelwayo, ezifana nee-memory stick, amakhadi emizobo, kunye nezinye izixhobo, ukuze ziqhagamshele ngeendawo zokufaka. Umsebenzi ophambili weminwe yegolide kukubonelela ngoqhagamshelo lombane oluthembekileyo ngokusebenzisa umaleko we-gold plating oqhuba kakhulu ngelixa kuqinisekiswa ukumelana nokuguguleka kunye nokumelana nokugqwala.
Ulwahlulo lweMinwe yeGolide
Iminwe yegolide inokwahlulwa ngokwemisebenzi yayo, isikhundla, kunye nenkqubo yokuvelisa:
Uqhagamshelo loMbane Iminwe yeGolide: Le minwe yegolide isetyenziselwa kakhulu ukubonelela ngoqhagamshelo lombane oluzinzileyo, njengakwii-memory sticks, amakhadi emizobo, kunye nezinye iimodyuli ze-plug-in. Zidlulisela imiqondiso yombane ngokufakwa kwiindawo ezikwibhodi yomama okanye kwezinye izixhobo.
Iminwe yeGolide yoNikezo lwaMandla: Ezi zisetyenziselwa ukubonelela ngoqhagamshelo lwamandla okanye ulwelo oluphantsi komhlaba, ukuqinisekisa ukuba izixhobo zifumana umbane ozinzileyo.
2,Isekelwe kwisikhundla:
Iminwe yeGolide yoMphetho: Ngokwesiqhelo ifumaneka kumphetho wePCB, isetyenziselwa uqhagamshelo lweslothi kwaye ifumaneka rhoqo kwii-memory sticks, amakhadi emizobo, kunye neemodyuli zonxibelelwano. Olu lolona hlobo luqhelekileyo lweminwe yegolide.
Iminwe yeGolide Engengomphetho: Le minwe yegolide ayifumanekanga kumphetho wePCB kodwa ibekwe ngaphakathi ukuze iqhagamshelane okanye imisebenzi ethile, njengeendawo zovavanyo okanye uqhagamshelo lwangaphakathi lwemodyuli.
3,Ngokusekelwe kwiNkqubo yoMveliso:
Iminwe yeGolide yokuntywiliselwa: Ezi zenziwe kusetyenziswa inkqubo yokubeka iikhemikhali ukuze kufakwe umaleko wegolide kwifoyile yobhedu. Zinomphezulu ogudileyo nocolekileyo kodwa umaleko wegolide obhityileyo, odla ngokusetyenziselwa uqhagamshelo lombane olusebenzisa imitha esezantsi.
Iminwe yeGolide efakwe ngombane: Yenziwe kusetyenziswa inkqubo yokufakelwa ngombane, le minwe yegolide inomaleko wegolide otyebileyo kwaye ayigugi ngakumbi, ifanelekile kwiintambo zombane ezithembekileyo ezifuna ukufakwa nokususwa rhoqo, njengakwiimemori kunye namakhadi emizobo. Le nkqubo idla ngokusebenzisa ubukhulu bomaleko wegolide obuyi-30-50 microintshi ukuqinisekisa ukuqina kunye nokuqhuba kakuhle.
4,Ngokusekelwe kwiNdlela yoQhagamshelo:
Iminwe yeGolide eQondisiweyo: Xa ifakwe ngqo kwindawo yokugcina izinto, ukuthamba kwesithuba kubamba iminwe yegolide. Le ndlela isetyenziswa kakhulu kwiimemori sticks kunye namakhadi emizobo.
Iminwe yeGolide yeLatch: Iqhagamshelwe kusetyenziswa iilatshi okanye ezinye izixhobo zokubopha, inika ukufakelwa okongeziweyo koomatshini, okuqhele ukusetyenziswa kwiimodyuli ezinkulu kunye nezicelo ezifuna uqhagamshelo oluzinzileyo ngakumbi.
Iimpawu zokusetyenziswa kweMinwe yeGolide
- Ukuqhuba Okuphezulu Nokuzinza: Eyona nto iphambili eyenziwe ngeminwe yegolide yigolide, eqhuba kakuhle kwaye izinzile, enika ukusebenza kakuhle kombane.
- Ukumelana Nokuguguleka: Ukufakwa okubandakanya ukufakwa nokususwa rhoqo kufuna ukuba iminwe yegolide ibe nokumelana nokuguguleka okuhle. Umaleko weplati yegolide ubonelela ngolu khuselo, ukuqinisekisa ukuba iminwe yegolide ayigugi okanye ayivuthi lula ngexesha lokusetyenziswa.
- Ukumelana Nokugqwala: Umaleko wegolide kwiminwe yegolide awuboneleli nje kuphela ngokuhambisa umbane kodwa ukwamelana nezinto ezirhabaxa kwindalo esingqongileyo, wandisa ubomi beminwe yegolide.
Uhlu lweeModyuli zoBuchule
1,Ngokusekelwe kwisantya soThumelo:
Iimodyuli ze-10G Optical: Zisetyenziselwa usetyenziso lwe-10 Gigabit Ethernet.
Iimodyuli ze-25G Optical: Zenzelwe i-25 Gigabit Ethernet.
Iimodyuli ze-40G Optical: Zisetyenziswa kwiinethiwekhi ze-Ethernet ezingama-40 zeGigabit.
Iimodyuli ze-Optical ze-100G: Zifanelekile kwiinethiwekhi ze-100 Gigabit Ethernet.
Iimodyuli ze-400G Optical: Zezicelo ze-400 Gigabit Ethernet ezinesantya esiphezulu kakhulu.
2,Ngokusekelwe kumgama woThumelo:
IiModyuli ze-Optical ze-Short-Range (SR): Ngokwesiqhelo zixhasa umgama ofikelela kwiimitha ezingama-300 kusetyenziswa i-multimode fiber (MMF).
IiModyuli ze-Optical eziLude (LR): Zenzelwe umgama ofikelela kwiikhilomitha ezili-10 kusetyenziswa ifayibha yemowudi enye (SMF).
Iimodyuli ze-Extended Range Optical (ER): Zingathumela ukuya kuthi ga kwiikhilomitha ezingama-40 ngaphezulu kwe-SMF.
IiModyuli ze-Optical eziLude kakhulu (ZR): Ixhasa umgama ongaphezulu kweekhilomitha ezingama-80 ngaphezulu kwe-SMF.
3,Ngokusekelwe kwiWavelength:
Iimodyuli ze-850nm: Zisetyenziselwa ngokubanzi ukusasazwa komgama omfutshane ngefayibha ye-multimode.
Iimodyuli ze-1310nm: Zifanelekile ukusasazwa komgama ophakathi ngaphezulu kwefayibha yemowudi enye.
Iimodyuli ze-1550nm: Zisetyenziselwa uthumelo olude, ngakumbi phezu kwefayibha yemowudi enye.
4,Ngokusekelwe kwiFomu Factor:
I-SFP (I-Small Form-Factor Pluggable): Isetyenziswa rhoqo kwiinethiwekhi ze-1G kunye ne-10G.
I-SFP+ (Enhanced Small Form-Factor Pluggable): Isetyenziselwa iinethiwekhi ze-10G ezisebenza kakuhle kakhulu.
I-QSFP (iQuad Small Form-Factor Pluggable): Ifanelekile kwizicelo ze-40G.
I-QSFP28: Yenzelwe iinethiwekhi ze-100G, inikezela ngesisombululo soxinano oluphezulu.
I-CFP (C Form-Factor Pluggable): Isetyenziswa kwizicelo ze-100G kunye ne-400G, ezinkulu kuneemodyuli ze-SFP/QSFP.
5,Ngokusekelwe kwiSicelo:
Iimodyuli ze-Optical zeZiko leDatha: Zenzelwe ukuhanjiswa kwedatha ngesantya esiphezulu ngaphakathi kwamaziko edatha.
Iimodyuli zeTelecom Optical: Zisetyenziswa kwiziseko zonxibelelwano zokusasaza idatha kumgama omde.
Iimodyuli ze-Industrial Optical: Zakhelwe iindawo eziqinileyo, ezinokumelana okuphezulu nokuguquguquka kobushushu kunye nokuphazamiseka kwe-electromagnetic.
Indlela yokwahlula ii-HDI Step Counts
IiVias ezingcwatywe ngaphakathi: Imingxunya efakwe ngaphakathi kwebhodi, engabonakali ngaphandle.
Ii-Blind Vias: Iimbobo ezibonakalayo ngaphandle kodwa ezingabonakaliyo.
Ukubalwa kwamanyathelo: Inani leentlobo ezahlukeneyo zee-vias ezingaboniyo, njengoko zijongwa kwelinye icala lebhodi, linokuchazwa njengokubalwa kwamanyathelo.
Inani leLamination: Inani lezihlandlo ii-vias ezingaboniyo/ezingcwatywe ngazo zidlula kwii-cores ezininzi okanye kwiileya ze-dielectric.
I-PCB yenziwe kusetyenziswa i-Panasonic M6 copper-clad laminate
I-PCB yenziwe kusetyenziswa i-Panasonic M6 copper-clad laminate. Sinamava amaninzi kweli candelo kwaye siyazi indlela yokusebenzisa ngokupheleleyo ukusebenza kwezixhobo zePanasonic M6 ngokugxila kwezi ndawo zilandelayo:
1. Ukukhethwa kwezinto kunye nokuhlolwa kwazo
Ukukhetha Ababoneleli Ngokungqongqo: Khetha ababoneleli be-laminate ye-Panasonic M6 egqunywe ngobhedu abathembekileyo nabathembekileyo ukuqinisekisa ukuba izixhobo ezizinzileyo nezihambelana nomgangatho. Oku kungenziwa ngokuvavanya iziqinisekiso zomthengisi, amandla emveliso, kunye neenkqubo zokulawula umgangatho. Amava ethu eminyaka emininzi asincede sakwazi ukuseka ubudlelwane bexesha elide nobuzinzileyo nababoneleli abakumgangatho ophezulu, siqinisekisa umgangatho wezinto ezivela kumthombo.
Ukuhlolwa kwezinto: Emva kokufumana izinto ze-laminate ezigqunywe ngobhedu, yenza uhlolo olucokisekileyo ukujonga iziphene ezifana nomonakalo okanye amabala kunye nokulinganisa iiparameter ezifana nobukhulu kunye nobukhulu ukuqinisekisa ukuba ziyahlangabezana neemfuno. Izixhobo zovavanyo ezikhethekileyo zingasetyenziselwa ukuvavanya iimpawu zombane zezinto, ukuqhuba kobushushu, kunye nezinye izalathisi zokusebenza ukuqinisekisa ukuba ziyahlangabezana neemfuno zoyilo. Iqela lethu lovavanyo lobuchwephesha lisebenzisa izixhobo eziphambili kunye neenkqubo ezingqongqo ukuqinisekisa ukuba akukho nkcukacha ijongwayo.
2. Ukuphucula uYilo
Uyilo lweSekethe: Ngokusekelwe kwiimpawu ze-Panasonic M6 copper-clad laminate, yila uyilo lwebhodi yesekethe ngokufanelekileyo. Kwiisekethe ezisebenzisa i-frequency ephezulu, mfutshane iindlela zesignali ukuze unciphise ukubonakaliswa kwesignali kunye nokuphazamiseka. Kwiisekethe ezinamandla aphezulu, qwalasela ngokupheleleyo imiba yokusasazwa kobushushu, cwangcisa izinto zokufudumeza, kunye neendlela zokusasazwa kobushushu ngokufanelekileyo ukuze wandise ukuhanjiswa kobushushu kwe-copper-clad laminate. Iqela lethu loyilo liyaqonda iipropati ze-Panasonic M6 laminate kwaye linokuyila ngokuchanekileyo ngokweemfuno ezahlukeneyo zesekethe.
Uyilo lweStack-Up: Lungiselela ulwakhiwo lwestack-up yebhodi yesekethe ngokusekelwe kubunzima kunye neemfuno zokusebenza kwesekethe. Khetha inani elifanelekileyo leeleya, isithuba phakathi kweeleya, kunye nezixhobo zokuthintela ubushushu ukuqinisekisa ukuthembeka kwesignali kunye nokuzinza kokusebenza kombane. Kwakhona, cinga ngemiphumo yokudluliselwa kobushushu kunye nokusasazwa phakathi kweeleya ukuze uphephe ubushushu obugqithisileyo bendawo. Ngokuziqhelanisa ngokubanzi kunye nokwenza ngcono okuqhubekayo, siye saphuhlisa isisombululo soyilo lwestack-up esisengqiqweni nesisengqiqweni.
3. Ulawulo lweNkqubo yoMveliso
Inkqubo Yokugcaba: Lawula ngokuchanekileyo iiparameter zokugcaba ukuqinisekisa ukuchaneka kunye nomgangatho weempawu zebhodi yesekethe. Khetha izinto zokugcaba ezifanelekileyo kunye neemeko zokugcaba ukuze uphephe ukugcaba kakhulu okanye ukugcaba ngaphantsi. Ukongeza, lumka ukhuseleko lokusingqongileyo ngexesha lenkqubo yokugcaba ukuze uthintele ungcoliseko lwe-laminate egqunywe ngobhedu. Sinamava amaninzi kwiinkqubo zokugcaba kwaye sinokulawula ngokuchanekileyo inkqubo ukuqinisekisa umgangatho webhodi yesekethe.
Inkqubo yokubhola: Sebenzisa izixhobo zokubhola ezichanekileyo kakhulu kunye neeparamitha zokulawula ukubhola ukuqinisekisa ubungakanani bomngxuma kunye nokuchaneka kwendawo. Kufuneka kuthathwe unonophelo ukuze kuthintelwe ukonakalisa i-laminate egqunywe lubhedu, enokuchaphazela ukusebenza kwayo. Izixhobo zethu zokubhola eziphambili kunye nabaqhubi abanobuchule baqinisekisa ukuchaneka kwenkqubo yokubhola.
Inkqubo yokuLamination: Lawula ngokungqongqo iiparameter zokuLamination ukuqinisekisa ukunamathelana phakathi kweeleya kunye nokusebenza kombane. Khetha ubushushu obufanelekileyo bokulamination, uxinzelelo, kunye nexesha ukuqinisekisa ukubopha okuhle phakathi kwelaminate egqunywe ngobhedu kunye nezinye izinto zokukhusela. Kwakhona, qwalasela imiba yokukhupha umoya ngexesha lenkqubo yokuLamination ukuze uphephe amaqamza kunye nokuqhekeka. Ulawulo lwethu oluqinileyo lwenkqubo yokuLamination luqinisekisa ukusebenza okuzinzileyo kwebhodi yesekethe.
4. Uvavanyo loMgangatho kunye nokulungisa iimpazamo
Uvavanyo Lokusebenza Kombane: Sebenzisa izixhobo zovavanyo ezikhethekileyo ukuvavanya iimpawu zombane zebhodi yesekethe, kubandakanya ukumelana, amandla, i-inductance, ukumelana nobushushu, kunye nesantya sokuhambisa isignali. Qinisekisa ukuba ukusebenza kombane kuyahlangabezana neemfuno zoyilo kwaye iimpawu ze-dielectric ezingapheliyo neziphantsi zokulahleka kwe-dielectric ye-Panasonic M6 copper-clad laminate zisetyenziswa ngokupheleleyo. Izixhobo zethu zovavanyo eziphambili nezibanzi zinokuvavanya zonke iinkalo zokusebenza kombane kwebhodi yesekethe.
Uvavanyo Lokusebenza Ngobushushu: Sebenzisa izixhobo zomfanekiso wobushushu ukujonga ubushushu obusebenzayo bebhodi yesekethe kwaye ujonge ukusebenza kakuhle kokusasazwa kobushushu. Yenza uvavanyo loxinzelelo lobushushu ukuvavanya uzinzo lokusebenza kwebhodi yesekethe phantsi kweemeko zobushushu ezahlukeneyo. Uvavanyo lwethu oluqinileyo lokusebenza kobushushu luqinisekisa uzinzo lwebhodi yesekethe kwiindawo ezahlukeneyo zokusebenza.
Ukulungisa iimpazamo kunye nokuphucula: Emva kokugqiba ukuvelisa ibhodi yesekethe, yenza ukulungisa iimpazamo kunye nokwenza ngcono. Lungisa iiparameter zesekethe ngokusekelwe kwiziphumo zovavanyo ukuphucula ukusebenza kunye nokuzinza kwebhodi yesekethe. Ukongeza, hlala ushwankathela amava kunye nezifundo ezifunyenweyo ukuphucula rhoqo iinkqubo zokuvelisa kunye noyilo lwezisombululo ukuze usebenzise ngcono iingenelo ze-Panasonic M6 copper-clad laminate. Iqela lethu lokulungisa iimpazamo kunye nokwenza ngcono linokwenza ngokukhawuleza nangokuchanekileyo ukulungisa iimpazamo ukuze liphucule rhoqo umgangatho wemveliso.
Ngamafutshane, ngamava ethu amakhulu emveliso kunye nokuqonda okunzulu kwezinto ze-laminate ezigqunywe ngobhedu zePanasonic M6, siqinisekile ukuba siya kubonelela abathengi bethu ngeemveliso ze-PCB ezikumgangatho ophezulu.