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Nayiphi na i-PCB edibeneyo enoxinano oluphezulu
INGQONDO ESESISEKO YE-HDI
I-HDI imele i-High Density Interconnector, uhlobo lokwenziwa kwe-PCB (iteknoloji), esebenzisa i-micro blind/efihliweyo ngetekhnoloji ukuze kufezekiswe uxinano losasazo oluphezulu. Ingafikelela kubukhulu obuncinci, ukusebenza okuphezulu kunye neendleko eziphantsi. I-HDI PCB kukusukela kwabayili, abaphuhlisa rhoqo ukuya kuxinano oluphezulu kunye nokuchaneka. Okubizwa ngokuba "kuphezulu" akuphuculi kuphela ukusebenza komatshini, kodwa kunciphisa nobukhulu bomatshini. Itekhnoloji ye-High Density Integration (HDI) inokwenza uyilo lwemveliso yokugqibela lube luncinci ngakumbi, ngelixa ihlangabezana nemigangatho ephezulu yokusebenza kwe-elektroniki kunye nokusebenza kakuhle.
I-HDI PCB idla ngokuquka i-laser drilling blind via kunye ne-mechanical drilling blind via. Itekhnoloji yokuqhuba phakathi kweengqimba zangaphakathi nezangaphandle ifumaneka ngeenkqubo ezifana ne-bybed via, i-blind via, imingxunya edibeneyo, imingxunya edibeneyo, i-cross blind/buryed via, i-through holes, i-blind via filling electroplating, i-fine wire small space kunye ne-micro holes kwidiski, njl.njl.
Kukho iintlobo ezahlukeneyo ze-HDI PCB: umaleko omnye, umaleko omibini, umaleko omithathu, umaleko omine kunye naluphi na uqhagamshelo lomaleko.
● Ulwakhiwo lwe-HDI yomaleko omnye: 1+N+1 (ucinezela kabini, ukubhola nge-laser kube kanye).
● Ulwakhiwo lwe-HDI enamaleko ama-2: 2+N+2 (ucinezela izihlandlo ezi-3, ukubhoboza nge-laser kabini).
● Ulwakhiwo lwe-HDI enamaleko ama-3: 3+N+3 (ucinezela amaxesha ama-4, ukubhola nge-laser amaxesha ama-3).
● Ulwakhiwo lwe-HDI enamaleko ama-4: 4+N+4 (ucinezele izihlandlo ezi-5, ukubhola nge-laser izihlandlo ezi-4).
Ukusuka kwizakhiwo ezingentla, kunokugqitywa kwelokuba ukubhola nge-laser kube kanye yi-HDI yomaleko omnye, kabini yi-HDI yomaleko amabini, njalo njalo. Naluphi na uqhagamshelo lwemaleko lunokuqalisa ukubhola nge-laser ukusuka kwibhodi engundoqo. Ngamanye amazwi, into ekufuneka ibholwe nge-laser ngaphambi kokuba icinezelwe yiyo nayiphi na i-HDI yomaleko.
Ingcamango yoYilo lwe-HDI
1. Xa sidibana noyilo olunemingxuma kwindawo ye-BGA ye-PCB enamaleko amaninzi, kodwa ngenxa yemida yendawo, kufuneka sisebenzise ii-BGA pads ezincinci kakhulu kunye nemingxuma emincinci kakhulu ukuze sifikelele ekungeneni ngokupheleleyo kwebhodi, sifanele siyenze njani? Ngoku singathanda ukwazisa i-HDI high precision PCB ekhankanywa rhoqo kwii-PCB ngolu hlobo lulandelayo.
Ukubhola kwePCB kwendabuko kuyachaphazeleka sisixhobo sokubhola. Xa ubungakanani bomngxuma wokubhola bufikelela kwi-0.15mm, ixabiso sele liphezulu kakhulu kwaye kunzima ukuphucula ngakumbi. Nangona kunjalo, ngenxa yendawo encinci, xa kuphela ubungakanani bomngxuma we-0.1mm bunokwamkelwa, ingcamango yoyilo lwe-HDI iyafuneka.
2. Ukugrumba kwe-HDI PCB akusaxhomekekanga ekugrumbeni oomatshini bendabuko, kodwa kusebenzisa ubuchwepheshe bokugrumba nge-laser (ngamanye amaxesha okwaziwa ngokuba yibhodi ye-laser). Ubungakanani bomngxuma wokugrumba we-HDI ngokubanzi yi-3-5mil (0.076-0.127mm), ububanzi bomgca yi-3-4mil (0.076-0.10mm), ubungakanani bee-solder pads bunokuncipha kakhulu, ngoko ke ukusasazwa komgca okuninzi kunokufunyanwa kwindawo nganye yeyunithi, okubangela uqhagamshelo oluphezulu.
Ukuvela kwetekhnoloji ye-HDI kuye kwaqhelana nophuhliso lweshishini le-PCB, nto leyo eyenza ukuba i-BGA, i-QFP, njl.njl. ibekwe kwi-HDI PCB. Okwangoku, itekhnoloji ye-HDI isetyenziswa kakhulu, phakathi kwayo i-HDI yomaleko omnye isetyenziswa kakhulu kwimveliso ye-PCB ene-0.5pitch BGA. Uphuhliso lwetekhnoloji ye-HDI luqhuba uphuhliso lwetekhnoloji ye-chip, nto leyo eqhuba uphuculo kunye nenkqubela phambili yetekhnoloji ye-HDI.
Namhlanje iitships ze-BGA ze-0.5pitch ziye zamkelwe kancinci kancinci ziinjineli zoyilo, kwaye iindawo zokudibanisa i-BGA ziye zatshintsha kancinci kancinci ukusuka kwimo embindini ogqunywe okanye osekelwe phantsi ukuya kwimo enendawo yokufaka kunye nokuphuma kwesignali embindini ofuna intambo.
3. I-HDI PCB ngokubanzi yenziwa ngendlela yokubeka imithwalo. Okukhona imithwalo isenziwa rhoqo, kokukhona inqanaba lobugcisa lebhodi liphakama. I-HDI PCB eqhelekileyo ibekwa imithwalo kube kanye, ngelixa i-HDI ephezulu isebenzisa ubuchwepheshe bokubeka imithwalo kabini nangaphezulu, kunye nobuchwepheshe obuphambili be-PCB obufana nokubeka imithwalo, ukuzaliswa kwemingxunya nge-electroplating kunye nokubhola nge-laser ngqo, njl.
I-HDI PCB ilungele ukusetyenziswa kwetekhnoloji yokuhlanganisa ephucukileyo, kwaye ukusebenza kombane kunye nokuchaneka kwesignali kuphezulu kune-PCB yendabuko. Ukongeza, i-HDI inophuculo olungcono kwi-radio frequency interference, i-electromagnetic wave interference, i-electrostatic discharge kunye ne-thermal conduction, njl.
Isicelo
I-HDI PCB ineendlela ezahlukeneyo zokusetyenziswa kwicandelo le-elektroniki, ezinje ngezi:
-Idatha Enkulu kunye ne-AI: I-HDI PCB inokuphucula umgangatho wesiginali, ubomi bebhetri kunye nokuhlanganiswa okusebenzayo kweefowuni eziphathwayo, ngelixa inciphisa ubunzima kunye nobukhulu bazo. I-HDI PCB inokuxhasa uphuhliso lweetekhnoloji ezintsha ezifana nonxibelelwano lwe-5G, i-AI kunye ne-IoT, njl.
-Imoto: I-HDI PCB inokuhlangabezana neemfuno ezinzima nezithembekileyo zeenkqubo ze-elektroniki zeemoto, ngelixa iphucula ukhuseleko, intuthuzelo kunye nobukrelekrele beemoto. Ingasetyenziswa nakwimisebenzi efana neradar yeemoto, ukuhambahamba, ukuzonwabisa kunye noncedo lokuqhuba.
-Ezonyango: I-HDI PCB inokuphucula ukuchaneka, uvakalelo kunye nokuzinza kwezixhobo zonyango, ngelixa inciphisa ubungakanani bazo kunye nokusetyenziswa kwamandla. Ingasetyenziswa nakwiinkalo ezifana nemifanekiso yezonyango, ukubeka esweni, ukuxilongwa kunye nonyango.
Iinkqubo eziphambili ze-HDI PCB zikwiifowuni eziphathwayo, iikhamera zedijithali, ii-AI, ii-IC carriers, iilaptops, ii-elektroniki zeemoto, iirobhothi, iidrone, njl.njl., ezisetyenziswa kakhulu kwiindawo ezininzi.
