Kammala saman PCB
| Ƙarshen Fuskar | Darajar da Aka Saba | Mai Bayarwa |
| Sashen Kashe Gobara na Masu Sa-kai | 0.3~0.55µm, 0.25~0.35µm | Enthon |
| Shikoku Chemical | ||
| YARDA | Ko kuma: 0.03~0.12um, Ni: 2.5~5um | Fasaha ta ATO/Chuang Zhi |
| ENIG mai zaɓi | Ko kuma: 0.03~0.12um, Ni: 2.5~5um | Fasaha ta ATO/Chuang Zhi |
| ENEPIK | Au: 0.05~0.125µm, Pd: 0.05~0.3µm | Chuang Zhi |
| A cikin: 3 ~ 10um | ||
| Zinare Mai Tauri | Au : 0.127 ~ 1.5um , Ni : min 2.5um | Mai Biya/EEJA |
| Zinare Mai Laushi | Au : 0.127 ~ 0.5um , Ni : min 2.5um | KIFI |
| Tin Nutsewa | Mafi ƙaranci: 1um | Enthone / ATO tech |
| Azurfa Mai Nutsewa | 0.127~0.45um | Macdermid |
| HASL mara gubar | 1~25um | Nihon Superior |
Saboda kasancewar jan ƙarfe yana wanzuwa a cikin nau'in oxides a cikin iska, yana shafar ƙarfin soldering da aikin lantarki na PCBs sosai. Saboda haka, ya zama dole a aiwatar da kammala saman PCBs. Idan ba a gama saman PCBs ba, yana da sauƙi a haifar da matsalolin soldering na kama-da-wane, kuma a cikin mawuyacin hali, ba za a iya soldering pads da sassan ba. Kammala saman PCB yana nufin tsarin samar da Layer na saman PCB ta hanyar wucin gadi. Manufar gama PCB shine tabbatar da cewa PCB yana da kyakkyawan ikon soldering ko aikin lantarki. Akwai nau'ikan gama saman PCBs da yawa.
Matakan Solder Mai Zafi (HASL)
Tsarin aiki ne na shafa sinadarin da ke narkewa a saman PCB, a daidaita shi (a hura shi) da iska mai zafi da aka matse sannan a samar da wani shafi mai jure wa iskar shaka ta jan ƙarfe kuma yana ba da damar yin solder mai kyau. A yayin wannan aikin, ya zama dole a ƙware waɗannan muhimman sigogi: zafin solder, zafin wukar zafi, matsin lamba na wukar zafi, lokacin nutsewa, saurin ɗagawa, da sauransu.
Amfanin HASL
1. Tsawon lokacin ajiya.
2. Jika mai kyau da kuma rufewar jan ƙarfe.
3. Nau'in gubar da aka yi amfani da shi sosai (wanda ya dace da RoHS).
4. Fasaha mai girma, ƙarancin farashi.
5. Ya dace sosai don duba gani da gwajin lantarki.
Rashin ƙarfin HASL
1. Bai dace da haɗa waya ba.
2. Saboda yanayin da aka yi amfani da shi wajen narke solder, rashin lanƙwasa ba shi da kyau.
3. Ba ya aiki ga maɓallan taɓawa masu ƙarfin capacitive.
4. Ga musamman siririn bangarori, HASL bazai dace ba. Yawan zafin wanka na iya sa allon da'ira ya karkace.
2. Sashen Kashe Gobara na Masu Sa-kai
OSP ita ce taƙaitaccen bayanin Organic Solderability Preservative, wanda kuma aka sani da kowace solder. A takaice, OSP shine wanda za a fesa a saman faifan solder na jan ƙarfe don samar da fim mai kariya da aka yi da sinadarai na halitta. Wannan fim ɗin dole ne ya sami halaye kamar juriyar oxidation, juriyar girgizar zafi da juriyar danshi don kare saman jan ƙarfe daga tsatsa (oxidation ko vulcanization, da sauransu) a cikin yanayi na yau da kullun. Duk da haka, a cikin solder mai zafi mai zafi na gaba, dole ne a cire wannan fim ɗin kariya cikin sauƙi ta hanyar kwararar da sauri, don saman jan ƙarfe mai tsabta da aka fallasa zai iya haɗuwa nan da nan tare da solder mai narkewa don samar da haɗin solder mai ƙarfi cikin ɗan gajeren lokaci. A takaice dai, rawar OSP ita ce ta zama shinge tsakanin jan ƙarfe da iska.
Amfanin OSP
1. Mai sauƙi kuma mai araha; Feshi ne kawai ake fesawa a saman.
2. Faɗin murfin solder ɗin yana da santsi sosai, tare da faɗin da ya yi daidai da ENIG.
3. Ba ya ƙunshe da gubar (ya bi ƙa'idodin RoHS) kuma yana da kyau ga muhalli.
4. Mai iya sake aiki.
Rashin ƙarfin OSP
1. Rashin danshi sosai.
2. Fim ɗin a bayyane yake kuma siriri yana nufin yana da wuya a auna inganci ta hanyar duba gani da kuma yin gwaji ta yanar gizo.
3. Tsawon sabis na ɗan gajeren lokaci, manyan buƙatu don ajiya da sarrafawa.
4. Rashin kariya mai kyau ga ramukan da aka rufe ta cikin rami.
Azurfa Mai Nutsewa
Azurfa tana da sifofin sinadarai masu ƙarfi. PCB ɗin da aka sarrafa ta hanyar fasahar nutsewa ta azurfa har yanzu yana iya samar da kyakkyawan aikin lantarki ko da lokacin da aka fallasa shi ga yanayin zafi mai yawa, danshi da gurɓataccen yanayi, da kuma kiyaye ingantaccen narkewa koda kuwa yana iya rasa haskensa. Nutsewa Azurfa wani abu ne da ke haifar da matsi inda ake sanya Layer na azurfa tsantsa kai tsaye a kan jan ƙarfe. Wani lokaci, ana haɗa azurfar nutsewa da rufin OSP don hana azurfa yin martani da sulfides a cikin muhalli.
Fa'idar Nutsewa Azurfa
1. Babban ƙarfin soldering.
2. Kyakkyawan lanƙwasa a saman.
3. Mai rahusa kuma babu gubar (ya yi daidai da ƙa'idodin RoHS).
4. Ya dace da haɗin waya na Al.
Rashin ƙarfin Azurfa Mai Nutsewa
1. Bukatun ajiya masu yawa kuma suna da sauƙin gurɓata.
2. Tagar da aka haɗa ta ɗan gajeren lokaci bayan an cire ta daga marufi.
3. Yana da wahalar gudanar da gwajin lantarki.
Tin Nutsewa
Tunda duk wani mai solder an gina shi ne bisa tin, layin tin zai iya daidaita kowace irin mai solder. Bayan ƙara ƙarin sinadarai na halitta a cikin maganin nutsewa na tin, tsarin layin tin yana gabatar da tsari mai girma, yana shawo kan matsalolin da ke haifar da gashin tin da ƙaura na tin, yayin da kuma yana da kyakkyawan kwanciyar hankali da ƙarfin soldering.
Tsarin Tin Nutsewa zai iya samar da mahaɗan ƙarfe na ƙarfe na tagulla mai lebur don sa tin nutsewa ya sami kyakkyawan sassauci ba tare da wata matsala ta yaɗuwa ta ƙarfe ko matsalar yaɗuwar sinadarai ba.
Amfanin Tin Nutsewa
1. Ya dace da layukan samarwa na kwance.
2. Ya dace da sarrafa waya mai kyau da kuma haɗa ta da gubar, musamman ma ga tsarin yin kumfa.
3. Faɗin yana da kyau sosai, ya dace da SMT.
Rashin ƙarfin Tin Nutsewa
1. Babban buƙatar ajiya, na iya sa zanen yatsa ya canza launi.
2. Gishirin tin na iya haifar da gajerun da'ira da matsalolin haɗin gwiwa na solder, wanda hakan ke rage tsawon lokacin shiryawa.
3. Yana da wahalar gudanar da gwajin lantarki.
4. Tsarin ya ƙunshi abubuwan da ke haifar da cutar kansa.
YARDA
ENIG (Zinariyar Niƙa Mai Rage Wutar Lantarki) wani shafi ne da ake amfani da shi sosai wanda ya ƙunshi layukan ƙarfe guda biyu, inda ake sanya nickel kai tsaye a kan jan ƙarfe sannan a shafa atom ɗin zinariya a kan jan ƙarfe ta hanyar canjin yanayi. Kauri na layin ciki na nickel gabaɗaya shine 3-6um, kuma kauri na layin waje na zinariya gabaɗaya shine 0.05-0.1um. Nickel yana samar da wani shinge tsakanin solder da jan ƙarfe. Aikin zinare shine hana iskar nickel yayin ajiya, ta haka ne yake tsawaita rayuwar shiryayye, amma tsarin zinare na nutsewa kuma yana iya samar da kyakkyawan lanƙwasa na saman.
Tsarin sarrafa ENIG shine: tsaftacewa--> etching--> catalyst--> sinadarin nickel plating--> zinariya deposition--> tsaftacewa ragowar
Fa'idodin ENIG
1. Ya dace da soldering mara gubar (wanda ya dace da RoHS).
2. Kyakkyawan santsi a saman.
3. Tsawon lokacin shiryawa da kuma tsawon wurin da za a iya ajiyewa.
4. Ya dace da haɗin waya na Al.
Rashin ƙarfin ENIG
1. Tsada saboda amfani da zinare.
2. Tsarin aiki mai rikitarwa, mai wahalar sarrafawa.
3. Sauƙin samar da yanayin baƙar fata.
Nickel mai amfani da lantarki/Zinariya (zinariya mai tauri/zinariya mai laushi)
An raba zinaren nickel mai amfani da wutar lantarki zuwa "zinariya mai tauri" da "zinariya mai laushi". Zinariya mai tauri tana da ƙarancin tsarki kuma ana amfani da ita sosai a cikin yatsu na zinariya (haɗin gefen PCB), hulɗar PCB ko wasu wurare masu jure lalacewa. Kauri na zinariya na iya bambanta dangane da buƙatu. Zinariya mai tauri tana da tsarki mafi girma kuma ana amfani da ita sosai a haɗa waya.
Amfanin Electrolytic Nickel/Zinare
1. Tsawon lokacin shiryawa.
2. Ya dace da maɓallin hulɗa da haɗin waya.
3. Zinariya mai tauri ta dace da gwajin lantarki.
4. Ba ya ɗauke da gubar (mai bin umarnin RoHS)
Rashin ƙarfin sinadarin electrolytic nickel/zinariya
1. Kammala saman da ya fi tsada.
2. Yatsun zinariya masu amfani da wutar lantarki suna buƙatar ƙarin wayoyi masu amfani da wutar lantarki.
3. An yi amfani da zinare wajen soyawa ba shi da kyau. Saboda kauri na zinare, yadudduka masu kauri suna da wahalar soyawa.
ENEPIK
Ana ƙara amfani da Electroless Nickel Electroless Palladium Immersion Gold ko ENEPIG don kammala saman PCB. Idan aka kwatanta da ENIG, ENEPIG yana ƙara ƙarin Layer na palladium tsakanin nickel da zinariya don ƙara kare layin nickel daga tsatsa da kuma hana samar da kushin baƙi waɗanda ake samu cikin sauƙi a cikin tsarin kammala saman ENIG. Kauri na nickel yana da kusan 3-6um, kauri na palladium yana da kusan 0.1-0.5um kuma kauri na zinariya shine 0.02-0.1um. Duk da cewa kauri na zinariya ya fi ƙasa da ENIG, ENEPIG ya fi tsada. Duk da haka, raguwar farashin palladium kwanan nan ya sa farashin ENEPIG ya fi araha.
Amfanin ENEPIG
1. Yana da dukkan fa'idodin ENIG, babu wani abu mai kama da black pad.
2. Ya fi dacewa da haɗa waya fiye da ENIG.
3. Babu haɗarin tsatsa.
4. Tsawon lokacin ajiya, babu gubar (mai bin umarnin RoHS)
Rashin ƙarfin ENEPIG
1. Tsarin aiki mai rikitarwa, mai wahalar sarrafawa.
2. Babban farashi.
3. Wata sabuwar hanya ce kuma ba ta kai matsayin da ta kai ba tukuna.