1. Gabatarwa
Yayin da kayayyakin lantarki ke ci gaba da bunƙasa zuwa ga haɗakar abubuwa masu yawa da rikitarwa, duba ingancin PCBA yana fuskantar ƙalubale masu yawa - musamman a cikin binciken ƙananan sassa na 0201 (0.6×0.3mm) da kuma kimanta ɓoyayyun haɗin solder a cikin fakitin BGA/CSP. A cewar IPC-A-610H, masana'antu na zamani dole ne su kiyaye ƙimar lahani ƙasa da 500 DPPM. Wannan labarin ya bayyana tsarin nazarin tsarin dubawa na matakai da yawa, tare da haɗa tsarin sarrafa tsari, fasahar gwaji mai wayo, da kuma bin diddigin lokaci-lokaci.
2. Tsarin Tsarin Fasahar Dubawa
2.1 Tsarin Cikakkun Tsarin Dubawa
Tsarin dubawa mai matakai huɗu yana tabbatar da cikakken ɗaukar hoto mai inganci:
- ·Kafin Aiki: 3D SPI (±5μm) + AOI don daidaita wurin sanyawa
- ·Bayan Sake Gudanawa: AOI mai gefe biyu + X-Ray na 3D (ƙuduri na 5μm)
- ·Gwajin Lantarki: ICT (rufewa ≥95%) + FCT
- ·Dubawa na Ƙarshe: Gwajin AVI + mai lalata
2.2 Mahimman Alamomin Aiki
- ·Lokacin tabbatar da labarin farko: ≤minti 15 (idan aka kwatanta da awanni 2 bisa ga al'ada)
- ·Yawan tserewa daga lahani:
- ·Rike bin diddigin bayanai: ≥ shekaru 10
3. Binciken Fasahar Dubawa ta Core
3.1 Kwatanta Fasahar Duba Ido
| Fasaha | ƙuduri | Gudun Dubawa | Lalacewar da ta shafi |
|---|---|---|---|
| 2D AOI | 10μm | 0.5s/allo | Lalacewar saman/gani |
| 3D AOI | 5μm | 1.2s/allo | Lalacewar tsayi da haɗin gwiwa |
| 3D SPI | 3μm | 0.8s/allo | Ƙarar manna mai solder/nakasa |
3.2 Ƙarfin Dubawa ta X-Ray
- ·Hotunan Tomografi na CT: Gano rabon rashin daidaiton BGA IPC-7095
- ·Tsarin Aiki na Ainihin Lokaci: ≥25fps sarrafa hoto
- ·Daidaiton Rarraba Lalacewa: >98% tare da algorithms masu kunna AI
4. Tsarin Gwajin Lantarki
4.1 Tsarin Gwajin ICT
- ·Mafi ƙarancin gwajin gwaji: ≥0.8mm
- ·Kewayon ƙarfin lantarki: 0–50V
- ·Daidaiton aunawa: ±1% (juriya), ±2% (ƙarfin aiki)
4.2 Maganin Gwaji na FCT
- ·Tashoshin I/O: Yana tallafawa tashoshi sama da 1000
- ·Mita Mai Sauri: DC–6GHz
- ·Daidaiton Wurin Laifi: ±5mm
5. Tsarin Gudanar da Bayanai Mai Inganci
5.1 Allon Kulawa na Lokaci-lokaci
- ·Sa ido kan yawan amfanin ƙasa kai tsaye (sake sabuntawa kowane 1s)
- ·Nazarin taswirar zafi mara kyau
- ·Kayan aiki na gani na OEE
5.2 Tsarin Bin Diddigin Abubuwan da ke Faruwa
- ·Barcode na musamman ko UID ga kowane allo
- ·Cikakken haɗin bayanai na tsari
- ·Haɗin MES/QMS a shirye
6. Lambobin Aikace-aikacen Masana'antu
6.1 Kayan Lantarki na Motoci
- ·An tabbatar a ƙarƙashin AEC-Q100
- ·0km ƙimar gazawa
- ·Mai bin rahotannin 8D
6.2 Na'urorin Lafiya
- ·Ka'idojin ISO 13485 na Kayan lantarki na Likitanci
- ·Duba 100% na fasaloli masu haɗari
- ·Gwajin tsaftace muhalli da kuma gwajin daidaiton muhalli
7. Binciken Fa'idodi
Bisa lafazin Makarantar Sakandare 2022aiwatar da tsarin dubawa mai wayo, mai matakai da yawa yana haifar da:
- ·Kashi 30% karuwar yawan amfanin farko-farko
- ·Kashi 40% rage jimillar kuɗaɗen da suka shafi inganci
- ·kashi 60% ƙarancin korafe-korafen abokan ciniki
8. Takaitawa: Sabon Zamani na Binciken PCBA Mai Wayo
- ·Tsarin duba fasaha da yawa (AOI + SPI + X-Ray + ICT/FCT)
- ·Algorithms na hukunci na lahani mai hankali wanda AI ke amfani da shi
- ·Cikakken tsarin bin diddigin ingancin dijital da haɗin MES
Tare da wannan tsarin tsari, masana'antun za su iya cimma matakan ingancin Six Sigma (), kafa sabbin ma'auni don amincin PCBA na duniya.
Nassoshi
- 1.IPC-A-610H, 2020
- 2. Takardun Fasaha na SMTA, 2022
- 3. AEC-Q100 Rev-H, 2014
- 4. ISO 13485:2016
- 5.IPC-7095D, 2021
