1. Okwu Mmalite
Dịka nzọụkwụ dị mkpa na usoro SMT, ịgbado ọkụ na-arụ ọrụ dị mkpa n'ịchọpụta ntụkwasị obi na ndụ nke ngwaahịa eletrọnịkị. IPC-J-STD-020, mmepụta eletrọniki ọgbara ọhụrụ chọrọ nkenke njikwa okpomọkụ nke ±5°C. Na ngalaba dịka eletrọniki ụgbọala (AEC-Q100) na aerospace (MIL-STD-883), ịdị mma nke ịgbado ọkụ na-emetụta nchekwa na arụmọrụ ngwaahịa ozugbo.
2. Ụkpụrụ Usoro na Isi Ihe Njikwa Isi
Njikọta ọzọ na-emepụta njikọ solder kwụsiri ike site na profaịlụ okpomọkụ a na-achịkwa. Isi ihe dị mkpa gụnyere:
- ·Ọnụego Ọkụ: 1–3°C/s (iji zere ujo okpomọkụ)
- ·Okpomọkụ kachasị elu: 20–40°C n'elu ebe agbaze ihe na-agbaze (ọkachasị 235–245°C maka SnAgCu)
- ·Oge dị n'elu Liquidus (TAL): Sekọnd 30–90
- ·Ọkwa Oyi: 1–4°C/s (iji mee ka ihe owuwu njikọ solder dị mma)
3. Mmejuputa Teknụzụ Ndị Dị Mkpa
3.1 Nhazi Profaịlụ Okpomọkụ
- ·Na-eji KIC thermal profiler nwere nlekota oge ọwa 6-12.
- ·Na-emesi obi ike Elu osisi ΔT na ỌNỤAHỊA .
- ·Ọmụmụ SMTA na-egosi na profaịlụ okpomọkụ kachasị mma nwere ike ibelata ntụpọ njikọta site na 60% (Ụlọ akwụkwọ sekọndrị, 2021).
3.2 Njikwa Ikuku
- ·Nchedo Nitrogen: IHE2 Ntinye uche nke ihe karịrị 1000ppm na-eme ka mmiri ghara ịdị na ya karịa 15% (Akụkọ Nnyocha Heller).
- ·Njikọ Ikuku Na-ekpo Ọkụ: Ọkụ ikuku a na-achịkwa (0.5–1.5 m/s) na-eme ka o kwe omume na a ga-enyefe okpomọkụ otu otu.
3.3 Usoro Arụmọrụ Ngwaọrụ
| Akara/Nlereanya | Mpaghara Okpomọkụ | Nhazi Njikwa Okpomọkụ | Oriri Nitrogen | atụmatụ |
|---|---|---|---|---|
| Heller 1910 | 12 | ±1°C | 15m³/h | Ikuku ọkụ nke mgbasa ozi abụọ |
| Rehm V9 | 10 | ±1.5°C | 12m³/h | Mmiri ikuku na-agbagharị ọzọ |
| Jutuo JS-800 | 8 | ±2°C | 18m³/h | Ọchịchọ ọgụgụ isi |
4. Sistemụ Nkwanye Ùgwù
4.1 Nlekota Usoro
- ·Nyocha SPC oge-oge: CRP ≥ 1.33
- ·Nnwale ọzọ nke profaịlụ okpomọkụ: Kwa awa anọ
- ·Nnyocha X-ray: Na-eme ka njikọ nkwonkwo solder dị mma kwa IPC-A-610 ọkọlọtọ
4.2 Nkwenye Ntụkwasị Obi
- ·Ịgba ígwè okpomọkụ: -40°C ruo 125°C, okirikiri 1000
- ·Mkpọtụ Mechanical: Nnwale 20–2000Hz, nke nwere axis atọ
- ·Metallography: Ọkpụrụkpụ IMC (ihe mejupụtara intermetallic) 2–5μm
5. Ikpe Ngwa Ụlọ Ọrụ
- ·Eletrọniki Ụgbọala: Ọ na-emezu ụkpụrụ nrụgide okpomọkụ nke okirikiri 3000.
- ·Ngwaọrụ Ahụike: Asambodo dị n'okpuru ISO 13485 maka nchọcha na ntụkwasị obi usoro.
- ·Nkwukọrịta 5G: Na-ahụ na iguzosi ike n'ezi ihe mgbaàmà na geometry njikọ solder kachasị mma maka modulu mmWave.
6. Nchịkọta: Ntọala nke Ịgbagharị Mgbagharị Dị Elu nke A Pụrụ Ịtụkwasị Obi
- ·Njikwa profaịlụ okpomọkụ kpọmkwem
- ·Arụmọrụ akụrụngwa kwụsiri ike ma dị irè
- ·Nlekota ogo usoro zuru oke na nkwenye ntụkwasị obi
Site na njikwa usoro sistemụ, ndị nrụpụta nwere ike nweta mmụba nke ịgbado ọkụ ≥99.9%, na-eru ọkwa kachasị elu nke ịdị mma na nguzozi nke ụlọ ọrụ.
Ntụaka
- 1.IPC-J-STD-020E, 2020
- 2.Ngwọta Usoro Heller Akwụkwọ Ọcha, 2022
- 3. SMTA International Proceedings, 2021
- 4.MIL-STD-883H, 2019
- 5.AEC-Q100 Rev-H, 2014
