1. Chiyambi
Monga gawo lofunika kwambiri mu ndondomeko ya SMT, kusungunula kwa reflow kumachita gawo lofunika kwambiri pakutsimikiza kudalirika ndi moyo wa zinthu zamagetsi. IPC-J-STD-020Kupanga zamagetsi zamakono kumafuna kulondola kowongolera kutentha kwa ±5°C. M'magawo monga zamagetsi zamagalimoto (AEC-Q100) ndi ndege (MIL-STD-883), ubwino wa soldering umakhudza mwachindunji chitetezo cha zinthu ndi magwiridwe antchito.
2. Mfundo Zoyendetsera Ntchito ndi Mfundo Zofunika Zowongolera
Kusokanso kwa madzi kumapanga malo olumikizirana okhazikika kudzera mu ma profiles olamulidwa ndi kutentha. Magawo ofunikira ndi awa:
- ·Kutentha Kwambiri: 1–3°C/s (kuti mupewe kutentha kwambiri)
- ·Kutentha Kwambiri: 20–40°C pamwamba pa malo osungunuka a solder (nthawi zambiri 235–245°C ya SnAgCu)
- ·Nthawi Yoposa Liquidus (TAL): Masekondi 30–90
- ·Kuzizira kwa Mtengo: 1–4°C/s (kuti muwongolere kapangidwe kake ka solder joint)
3. Kukhazikitsa Kofunika Kwambiri Kwaukadaulo
3.1 Kukonza Mbiri ya Kutentha
- ·Amagwiritsa ntchito KIC thermal profiler yokhala ndi 6–12 real-time monitoring.
- ·Kuonetsetsa pamwamba pa bolodi ΔT ndi Mtengo .
- ·Kafukufuku wa SMTA akuwonetsa kuti ma profiles otenthetsera okonzedwa bwino amatha kuchepetsa zolakwika za soldering ndi 60% (Sukulu Yasekondale, 2021).
3.2 Kulamulira Mpweya
- ·Chitetezo cha Nayitrogeni: CHONSE2 Kuchuluka kwa madzi Lipoti la Kafukufuku wa Heller).
- ·Mpweya Wotentha Wozungulira: Mpweya woyendetsedwa bwino (0.5–1.5 m/s) umatsimikizira kuti kutentha kumasamutsidwa mofanana.
3.3 Ziwerengero za Magwiridwe Antchito a Zipangizo
| Mtundu/Chitsanzo | Malo Otentha Kwambiri | Kuwongolera Kutentha Molondola | Kugwiritsa Ntchito Nayitrogeni | Mawonekedwe |
|---|---|---|---|---|
| Heller 1910 | 12 | ±1°C | 15m³/h | Mpweya wotentha wozungulira kawiri |
| Rehm V9 | 10 | ±1.5°C | 12m³/h | Kutulutsanso kwa vacuum |
| Jutuo JS-800 | 8 | ±2°C | 18m³/h | Kuziziritsa kwanzeru |
4. Dongosolo Lotsimikizira Ubwino
4.1 Kuyang'anira Njira
- ·Kusanthula kwa SPC nthawi yeniyeni: CRP ≥ 1.33
- ·Kutsimikiziranso mbiri ya kutentha: Maola anayi aliwonse
- ·Kuwunika kwa X-ray: Kuonetsetsa kuti cholumikizira cha solder chili bwino pa IPC-A-610 miyezo
4.2 Kutsimikizira Kudalirika
- ·Kuzungulira kwa Kutentha: -40°C mpaka 125°C, ma cycle 1000
- ·Kugwedezeka kwa Makina: Mayeso a 20–2000Hz, 3-axis
- ·Zojambulajambula: IMC (intermetallic compound) makulidwe 2–5μm
5. Milandu Yogwiritsira Ntchito Makampani
- ·Zamagetsi Zamagalimoto: Zimakwaniritsa miyezo ya kutentha kwa ma cycle 3000.
- ·Zipangizo Zachipatala: Yovomerezedwa ndi ISO 13485 chifukwa cha kulondola komanso kudalirika kwa njira yogwirira ntchito.
- ·Kulankhulana kwa 5G: Imaonetsetsa kuti chizindikirocho chili cholondola pogwiritsa ntchito mawonekedwe abwino a solder joint a ma module a mmWave.
6. Chidule: Maziko a High-Reliability Reflow Soldering
- ·Kuwongolera bwino mbiri ya kutentha
- ·Kagwiritsidwe ntchito ka zida kokhazikika komanso kogwira mtima
- ·Kuwunika bwino kwa njira yonse komanso kutsimikizira kudalirika
Ndi njira yowongolera mwadongosolo, opanga amatha kupeza phindu lokonzanso soldering ≥99.9%, kufikira mulingo wapamwamba komanso wogwirizana womwe ukutsogolera mumakampani.
Zolemba
- 1.IPC-J-STD-020E, 2020
- 2. Pepala Loyera la Mayankho a Njira za Heller, 2022
- 3. Milandu Yapadziko Lonse ya SMTA, 2021
- 4.MIL-STD-883H, 2019
- 5.AEC-Q100 Rev-H, 2014
