Imezu mmepụta ihe efu site na ogidi teknụzụ anọ
I. Isi Nkà na ụzụ: Njikwa nkenke nke Mkpọpụta Solder
Nghọta Ụlọ Ọrụ: "Ntụpọ 60%-70% nke ihe e ji agbanye ígwè na-esi na mbipụta apụta (IPC-7525 7.1.2). Ndoputa ziri ezi bụ ụzọ mbụ e si echebe ya."
Ebumnuche Njikwa Ọnụọgụ
| Akụkụ | Ihe Ndị A Chọrọ n'Ụkpụrụ | Ntụaka IPC |
|---|---|---|
| Izi ezi nke olu | Ọnụego mbufe > 85%, CPK ≥ 1.67 | J-STD-005 4.3.2 |
| Ịdị n'otu nke Ọdịdị | Ndahie ≤ 10%, Enweghị Ịda/Ịda | IPC-SM-817 3.2.1 |
| Izi ezi nke ọnọdụ | Mbelata ≤ 15% nke Obosara Pad | IPC-A-610H 8.2.3.4 |
II. Mmezi miri emi nke Ogidi Teknụzụ Anọ
1. Nhazi Stencil: Nlereanya Nhazi Nano
- ·Ịcha laser + electropolishing (Ra ≤ 0.6μm, Klas nke atọ kwekọrọ)
- ·Elu nrịgo elu/ala ≤ 0.08mm (nhazi ihe mgbochi ngụkọ agụba)
- ·Mkpuchi nano SiN na-ebelata ntụpọ bọọlụ solder site na 38%
- ·Nhazi oghere nta maka ihe ndị dị na 01005 (oke mpaghara ≥ 0.71)
Usoro Ọrụ Nyocha Nhazi: PCB → DFM → Ụdị ihe atụ → Mmepụta Oke
2. Usoro Mbipụta: Njikwa Amamihe Emechiri Emechi
| Paramita | Oke ọkọlọtọ | Oke Ihe Ize Ndụ |
|---|---|---|
| Nrụgide Squegee | 100 ± 20 g/mm | >150 g/mm → Ngbanwe stencil |
| Ọsọ nkewa | 1.5 ± 0.5 mm/s | >3 mm/s → Ịtụ nkume n'ili +250% |
| Ọnọdụ Gburugburu Ebe Obibi | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → Mgbanwe olu ±12% |
Njikwa mkpọchi emechiri emechi nke AI: Nlekota SPI → Ụdị LSTM → ụgwọ ọrụ na-agbanwe agbanwe → CPK ≥ 2.0
3. Mkpọchi ihe e ji agwakọta ihe: Nleta zuru oke nke usoro ndụ
- ·Nchekwa oyi na -40℃
- ·Okpomọkụ nzọụkwụ: 5℃ kwa awa 2 ruo okpomọkụ ụlọ
- ·Ngwakọta centrifugal: 1200 rpm maka 180s
- ·Nyocha viscosity: 850 ± 30 kcps
- ·Oge ọrụ: ≤ awa 72
- ·Njikọ ogbe MES maka nchụso
4. Nhicha Stencil: Nkwa nke ihe fọdụrụ
| Ụdị nhicha | Ugboro ole | Ụzọ Nkwenye |
|---|---|---|
| Nhicha Akọrọ + Uzuzu | PCB ise ọ bụla | Nnyocha Mikroskopu 50x |
| Nhicha miri emi nke ihe mgbaze | Kwa nkeji iri atọ | Ihe fọdụrụ na gravimetric |
Ihe achọrọ maka mkpofu: Nrụgide 50,000 Mbipụta
III. Uru Ndị Ahịa: Mmezi Ogo A Na-atụ Anya Ya
| Metric | Tupu | Mgbe | Ihe atụ |
|---|---|---|---|
| Ntinye Mbufe Mbụ | 82% | 99.1% | 0.4mm pitch QFN |
| Ọnụego Mmerụ Ahụ | 850 PPM | 62 PPM | BGA ụgbọala (X-Ray) |
| Ọnụ ego ọrụ ọzọ | $12k/ọnwa | $0.8k/ọnwa | Usoro PCBA Ahụike |
Ikpe: Smartwatch mainboard nwere njupụta nke ihe dị na 01005 enwetaghị ntụpọ bọọlụ solder ọ bụla site na stencil a kpuchiri nano
IV. Ọdịiche Ụlọ Ọrụ: Oge Mbipụta Amamihe
Ụzọ teknụzụ
- ·2024: Ntugharị ejima dijitalụ maka mbipụta stencil
- ·2025: Sistemụ squeegee AI na-agbanwe agbanwe
- ·2026: Njikwa mmeghari ihe nketa nke molekụla-ọkwa solder
Nghọta Ọkachamara
"E nwetara uru 23.7% site na imeziwanye izi ezi nke olu pasta site na ±15% ruo ±8% (SMTA 2023-PT-087).
Teknụzụ ogidi anọ na-agbatị ntụpọ mbipụta MTBA (Oge nkezi n'etiti ntụpọ) ruo awa 1200.
Ntụaka
- 1.IPC-7525C "Ntuziaka Nhazi Stencil"
- 2.J-STD-005B "Ihe Ndị A Chọrọ Maka Ịgbanye Pasta"
- 3. Akwụkwọ Ọcha SMTA: “Nhazi Mbelata Ihe Mgbakwụnye Solder” (2023)
- 4.IEC 61191-3:2017 “Mgbakọ Mbadamba Ebipụtara - Nkebi nke 3”
