Cimma Manufofin Kera Ginshiƙai Huɗu Masu Alaƙa
I. Fasahar Fasaha: Daidaita Sarrafa Maɓallin Solder
Fahimtar Masana'antu: "Lalacewar soldering ta 60%-70% ta samo asali ne daga bugawa (IPC-7525 7.1.2). Daidaito na asali shine layin farko na kariya."
Manufofin Kula da Adadi
| Girma | Bukatun Daidaitacce | Bayani game da IPC |
|---|---|---|
| Daidaiton Girma | Canja wurin kuɗi > 85%, CPK ≥ 1.67 | J-STD-005 4.3.2 |
| Ingancin Siffa | Ragewa ≤ 10%, Babu Wuya/Rushewa | IPC-SM-817 3.2.1 |
| Daidaiton Matsayi | Daidaito ≤ 15% na Faɗin Faɗin Faɗin Faɗin | IPC-A-610H 8.2.3.4 |
II. Inganta Zurfin Ginshiƙai Huɗu na Fasaha
1. Tsarin Stencil: Samfurin Daidaitaccen Nano-scale
- ·Yanke Laser + gogewa ta lantarki (Ra ≤ 0.6μm, Mai jituwa da Class 3)
- ·Tsayin hawa/sama ≤ 0.08mm (ƙirar karo mai hana ruwa)
- ·Shafa nano na SiN yana rage lahani na ƙwallon solder da kashi 38%
- ·Tsarin buɗewa mai zurfi don abubuwan 01005 (rabo na yanki ≥ 0.71)
Tsarin Tabbatar da Tsarin Aiki: PCB → DFM → Samfurin samfuri → Samar da taro
2. Sigogin Bugawa: Ikon Wayo Mai Rufewa
| Sigogi | Matsakaicin Nisa | Matsakaicin Hadari |
|---|---|---|
| Matsi na Matsi | 100 ± 20 g/mm | >150 g/mm → nakasar stencil |
| Saurin Rabuwa | 1.5 ± 0.5 mm/s | >3 mm/s → tsaunin kabari +250% |
| Yanayi na Yanayi | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → Sauyin girma ±12% |
Ikon Rufewa na AI: Sa ido kan SPI → Tsarin LSTM → diyya mai ƙarfi → CPK ≥ 2.0
3. Manna mai laushi: Cikakken bin diddigin rayuwa
- ·Ajiyar sanyi a -40℃
- ·Dumama mataki-mataki: 5℃ kowace awa 2 zuwa zafin jiki na ɗaki
- ·Haɗawar centrifugal: 1200 rpm don 180s
- ·Duban danko: 850 ± 30 kcps
- ·Lokacin buɗewa: ≤ 72h
- ·Haɗa batch na MES don ganowa
4. Tsaftace Stencil: Garanti mara saura
| Yanayin Tsaftacewa | Mita | Hanyar Tabbatarwa |
|---|---|---|
| Goge Busasshe + Injin Tsafta | Kowane PCB guda 5 | Dubawar Makiriko 50x |
| Tsaftace Mai Tsaftace Mai Tsafta | Kowace Minti 30 | Ragowar Gravimetric |
Sharuɗɗan Yankewa: Tashin hankali kwafi 50,000
III. Darajar Abokin Ciniki: Inganta Ingancin da Za a Iya Kimantawa
| Ma'auni | Kafin | Bayan | Yanayi |
|---|---|---|---|
| Ba da izinin shiga na farko | Kashi 82% | 99.1% | 0.4mm QFN mai girman gaske |
| Matsakaicin Lalacewa | 850 PPM | 62 PPM | BGA na Mota (X-Ray) |
| Kudin Sake Aiki | $12k/wata | $0.8k/wata | Layin PCBA na Likita |
Case: Babban allon agogon Smartwatch tare da yawan kayan haɗin 01005 an cimma shi ba tare da lahani ga ƙwallon solder ba ta hanyar stencil mai rufi na nano
IV. Gaban Masana'antu: Zamanin Buga Wayo
Taswirar Fasaha
- ·2024: Kwaikwayon tagwayen dijital don buga stencil
- ·2025: Tsarin squeegee na AI mai daidaitawa
- ·2026: Kula da manna manna na matakin ƙwayoyin halitta
Fahimtar Ƙwararru
An samu kashi 23.7% na ribar da aka samu ta hanyar inganta daidaiton girman manna daga ±15% zuwa ±8% (SMTA 2023-PT-087).
Fasaha mai ginshiƙai huɗu ta faɗaɗa lahani na bugawa MTBA (Matsakaicin Lokaci Tsakanin Lalacewa) zuwa awanni 1200.
Nassoshi
- 1.IPC-7525C “Jagororin Tsarin Stencil”
- 2.J-STD-005B "Bukatun Manna Mai Lantarki"
- 3. Takardar Fari ta SMTA: “Ma'aunin Manne Mai Solder” (2023)
- 4.IEC 61191-3:2017 “Taron Allo da Aka Buga - Kashi na 3”
