Ke hoʻokō nei i ka hana ʻana me ka ʻole o ka hemahema ma o nā pou ʻenehana ʻehā
I. ʻIke loea: Ka Mana Pololei o ka Hoʻokahe ʻana o ka Solder Paste
ʻIke ʻOihana: "ʻO 60%-70% o nā hemahema o ke kūʻai ʻana i loaʻa mai ka paʻi ʻana (IPC-7525 7.1.2). ʻO ka waiho ʻana me ka pololei ka laina mua o ka pale."
Nā Pahuhopu Mana Helu
| Ana | Nā Koina Maʻamau | Kuhikuhi IPC |
|---|---|---|
| Pololei o ka leo | Ka helu hoʻoili > 85%, CPK ≥ 1.67 | J-STD-005 4.3.2 |
| ʻAno Kūpono | ʻAʻohe Hiolo/Hiolo ≤ 10%, ʻAʻohe Hiolo/Hiolo | IPC-SM-817 3.2.1 |
| Pololei o ke Kūlana | Hoʻopau ʻia ≤ 15% o ka laulā o ka Pad | IPC-A-610H 8.2.3.4 |
II. Hoʻonui hohonu o nā pou loea ʻehā
1. Hoʻolālā Stencil: Kumu Hoʻohālike Precision Nano-scale
- ·ʻOki ʻana i ka laser + electropolishing (Ra ≤ 0.6μm, kūlike me ka Papa 3)
- ·Ke kiʻekiʻe piʻi/iho ≤ 0.08mm (hoʻolālā kū'ē i ka pahi)
- ·Hoʻemi ka nano-coating SiN i nā hemahema o ka pōpō solder ma 38%
- ·Hoʻolālā puka liʻiliʻi no nā ʻāpana 01005 (lakio wahi ≥ 0.71)
Kaʻina Hana Hōʻoia Hoʻolālā: PCB → DFM → Prototype → Hana Nui
2. Nā Palena Paʻi: Mana Akamai Loop Pani
| Palena | Pae Maʻamau | Paepae pilikia |
|---|---|---|
| Kaomi Squeegee | 100 ± 20 g/mm | >150 g/mm → hoʻololi ʻana o ka stencil |
| Ka wikiwiki o ka hoʻokaʻawale ʻana | 1.5 ± 0.5 mm/s | >3 mm/s → hoʻolei kupapaʻu +250% |
| Nā Kūlana Ambient | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → ka loli ʻana o ka leo ±12% |
Mana Hoʻomalu AI Pani-loop: Nānā ʻana i ka SPI → kumu hoʻohālike LSTM → uku hoʻololi → CPK ≥ 2.0
3. Hoʻopili Solder: Traceability piha o ke ola holoʻokoʻa
- ·Ka mālama anu ma -40 ℃
- ·Hoʻomehana ʻanuʻu: 5 ℃ i kēlā me kēia 2h i ka mahana o ka lumi
- ·Hoʻohuihui centrifugal: 1200 rpm no 180s
- ·Nānā ʻana i ka mānoanoa: 850 ± 30 kcps
- ·Ka manawa wehe: ≤ 72h
- ·Hoʻopaʻa pūʻulu MES no ka hiki ke hahai ʻia
4. Hoʻomaʻemaʻe Stencil: Hōʻoia Zero-residue
| ʻAno Hoʻomaʻemaʻe | Alapine (frequency) | ʻAno Hōʻoia |
|---|---|---|
| Kāwele maloʻo + Vacuum | ʻO kēlā me kēia 5 PCB | Nānā ʻana i ka Microscope 50x |
| Hoʻomaʻemaʻe hohonu o ka mea hoʻoheheʻe | I kēlā me kēia 30 minuke | Koena Gravimetric |
Nā Kūlana Hoʻopau: Ka ʻumekaumaha 50,000 mau paʻi
III. Ka Waiwai o ka Mea Kūʻai: Hoʻomaikaʻi ʻana i ka maikaʻi hiki ke helu ʻia
| Metrika | Ma mua | Ma hope | Kūlana |
|---|---|---|---|
| Ka Hua o ka Pass Mua | 82% | 99.1% | 0.4mm pitch QFN |
| Ka helu kīnā | 850 PPM | 62 PPM | BGA Kaʻa (X-Ray) |
| Kumukūʻai hana hou | $12k/mahina | $0.8k/mahina | Laina PCBA Lapaʻau |
Hihia: ʻO ka papa nui o ka Smartwatch me ka nui o nā ʻāpana 01005 i loaʻa ka ʻole o nā hemahema pōpō solder ma o ka stencil nano-coated
IV. Palena ʻoihana: Au o ka paʻi akamai
Palapala Alanui ʻenehana
- ·2024: Hoʻohālike māhoe kikohoʻe no ka paʻi stencil
- ·2025: ʻŌnaehana squeegee AI Adaptive
- ·2026: Ka mana hoʻomalu reactivity paste solder pae molekala
ʻIke loea
Ua loaʻa ka loaʻa ʻana o ka hua he 23.7% ma o ka hoʻomaikaʻi ʻana i ka pololei o ka nui o ka hoʻopili mai ±15% a i ±8% (SMTA 2023-PT-087).
Hoʻonui ka ʻenehana ʻehā kia i ka hemahema paʻi MTBA (Mean Time Between Defects) i 1200 mau hola.
Nā Kuhikuhi
- 1.IPC-7525C “Nā Alakaʻi Hoʻolālā Stencil”
- 2.J-STD-005B "Nā Koi no nā Pāpili Soldering"
- 3. Pepa Keʻokeʻo SMTA: “Nā Metrika Hoʻokaʻawale ʻana o ka Solder Paste” (2023)
- 4.IEC 61191-3:2017 “Nā ʻAhaʻōlelo Papa Paʻi - Māhele 3”
