Ukufeza Ukukhiqiza Okungaphelele Ngezinsika Ezine Zobuchwepheshe
I. Umongo Wezobuchwepheshe: Ukulawulwa Okunembile Kokufakwa Kwe-Solder Paste
Ukuqonda Kwemboni: "Amaphutha okushisela angu-60%-70% avela ekuphrinteni (IPC-7525 7.1.2). Ukubekwa kokunemba kuyindlela yokuqala yokuzivikela."
Izinhloso Zokulawula Ubuningi
| Ubukhulu | Izidingo Ezijwayelekile | Ireferensi ye-IPC |
|---|---|---|
| Ukunemba Kwevolumu | Izinga Lokudlulisa > 85%, i-CPK ≥ 1.67 | J-STD-005 4.3.2 |
| Ubuqotho Bokwakheka | Ukuwa ≤ 10%, Akukho Ukusika/Ukudilika | I-IPC-SM-817 3.2.1 |
| Ukunemba Kwesikhundla | I-Offset ≤ 15% yobubanzi bephedi | I-IPC-A-610H 8.2.3.4 |
II. Ukuthuthukiswa Okujulile Kwezinsika Ezine Zobuchwepheshe
1. Umklamo we-Stencil: Isifanekiso Sokunemba Esincane
- ·Ukusika nge-laser + ukupholisha nge-electro (Ra ≤ 0.6μm, okuhambisana nesigaba 3)
- ·Ukuphakama kwesinyathelo-phezulu/phansi ≤ 0.08mm (umklamo wokungqubuzana kwe-anti-blade)
- ·I-SiN nano-coating yehlisa amaphutha ebhola le-solder ngo-38%
- ·Umklamo wokuvula okuncane wezingxenye ezingu-01005 (isilinganiso sendawo ≥ 0.71)
Ukuhamba Komsebenzi Wokuqinisekisa Umklamo: I-PCB → I-DFM → Uhlobo Lomfanekiso → Ukukhiqizwa Okukhulu
2. Amapharamitha Okuphrinta: Ukulawula Okuhlakaniphile Okuvaliwe
| Ipharamitha | Ibanga Elijwayelekile | Umkhawulo Wengozi |
|---|---|---|
| Ukucindezela kwe-Squeegee | 100 ± 20 g/mm | >150 g/mm → ukuguqulwa kwe-stencil |
| Isivinini Sokuhlukana | 1.5 ± 0.5 mm/s | >3 mm/s → ukuthungwa ngamatshe amathuna +250% |
| Izimo Zendawo | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → ukuguquguquka kwevolumu ±12% |
Ukulawula i-AI Closed-loop: Ukuqapha kwe-SPI → imodeli ye-LSTM → isinxephezelo esishintshashintshayo → i-CPK ≥ 2.0
3. I-Solder Paste: Ukulandeleka Okugcwele Komjikelezo Wokuphila
- ·Indawo yokugcina ebanda ku--40℃
- ·Ukufudumala kancane kancane: 5℃ njalo emahoreni ama-2 kuya ekushiseni kwegumbi
- ·Ukuxuba kwe-Centrifugal: 1200 rpm ngama-180s
- ·Ukuhlolwa kokuqina: 850 ± 30 kcps
- ·Isikhathi sokuvula: ≤ amahora angu-72
- ·Ukubopha kwe-MES batch ukuze kulandeleke
4. Ukuhlanzwa kwe-Stencil: Isiqinisekiso se-Zero-residue
| Imodi Yokuhlanza | Imvamisa | Indlela Yokuqinisekisa |
|---|---|---|
| Ukusula Komile + Umshini Wokuhlanza | Njalo ngama-PCB ama-5 | Ukuhlolwa Kwemakroskopu Okungu-50x |
| Isinyibilikisi Esijulile Sokuhlanza | Njalo ngemizuzu engama-30 | Insalela ye-Gravimetric |
Izindlela Zokukhetha Izinto Ezingadingeki: Ukuqina 50,000 amaphrinti
III. Inani Lekhasimende: Ukuthuthukiswa Kwekhwalithi Elinganiselwe
| I-Metric | Ngaphambi | Ngemva | Isimo |
|---|---|---|---|
| Inzuzo Yokudlula Kokuqala | 82% | 99.1% | Iphimbo le-QFN elingu-0.4mm |
| Izinga Eliphelele Lokukhubazeka | 850 PPM | 62 PPM | I-BGA Yezimoto (i-X-Ray) |
| Izindleko Zokusebenza Kabusha | $12k/ngenyanga | $0.8k/ngenyanga | Umugqa we-PCBA wezokwelapha |
Ikesi: Ibhodi elikhulu lewashi elihlakaniphile elinobuningi bezingxenye ezingu-01005 lifinyelele kumaphutha ebhola le-solder angekho nge-nano-coated stencil
IV. Umngcele Wemboni: Inkathi Yokuphrinta Okuhlakaniphile
Imephu Yobuchwepheshe
- ·2024: Ukulingisa kwedijithali okubili kokuphrinta nge-stencil
- ·2025: Uhlelo lwe-Aptivative AI squeegee
- ·2026: Ukulawulwa kokusabela kwe-solder paste yezinga lama-molecule
Ukuqonda Kobungcweti
"Inzuzo yesivuno engu-23.7% etholwe ngokuthuthukisa ukunemba kwevolumu yokunamathisela kusuka ku-±15% kuya ku-±8% (SMTA 2023-PT-087).
Ubuchwepheshe obunezinsika ezine bunweba i-defect yokuphrinta i-MTBA (Isikhathi Esiphakathi Phakathi Kwamaphutha) kuya emahoreni angu-1200."
Izinkomba
- 1.IPC-7525C “Iziqondiso Zokuklama I-Stencil”
- 2.J-STD-005B “Izidingo Zokunamathisela Okuhlanganisiwe”
- 3. Iphepha Elimhlophe le-SMTA: “Ama-Metrics Okubeka I-Solder Paste” (2023)
- 4.IEC 61191-3:2017 “Imihlangano Yebhodi Ephrintiwe - Ingxenye 3”
