Kugera ku nganda zidafite inenge binyuze mu nkingi enye za tekiniki
I. Ishingiro rya Tekiniki: Kugenzura neza uburyo Solder Paste ishyirwamo
Isesengura ry'Inganda: "Inenge za 60%-70% zo gusoda zikomoka ku icapiro (IPC-7525 7.1.2). Gushyira ahagaragara neza ni wo murongo wa mbere w'ubwirinzi."
Intego zo kugenzura imibare
| Ingano | Ibisabwa bisanzwe | Icyitonderwa cya IPC |
|---|---|---|
| Ubuziranenge bw'Ijwi | Igipimo cyo kohereza > 85%, CPK ≥ 1.67 | J-STD-005 4.3.2 |
| Ubunyangamugayo mu miterere | Kugabanuka ≤ 10%, Nta gucika/gusenyuka kw'umucanga | IPC-SM-817 3.2.1 |
| Ubuziranenge bw'umwanya | Ingano ≤ 15% by'ubugari bwa Pad | IPC-A-610H 8.2.3.4 |
II. Guteza imbere byimbitse inkingi enye za tekiniki
1. Igishushanyo mbonera cya Stencil: Icyitegererezo cy'ubuziranenge bwa Nano-scale
- ·Gukata hakoreshejwe laser + electropolishing (Ra ≤ 0.6μm, ikurikije icyiciro cya 3)
- ·Uburebure bwo kuzamuka/kumanuka ≤ 0.08mm (igishushanyo mbonera cy'icyuma kirwanya icyuma)
- ·SiN nano-coating igabanya inenge z'umupira w'amashanyarazi ku kigero cya 38%.
- ·Igishushanyo mbonera cy'ahagera hato na hato ku bice 01005 (igipimo cy'ubuso ≥ 0.71)
Imikorere yo kwemeza igishushanyo mbonera: PCB → DFM → Icyitegererezo → Umusaruro mwinshi
2. Ibipimo byo gucapa: Uburyo bwo kugenzura bufunze
| Igipimo | Ingano Isanzwe | Ingaruka z'ibyago |
|---|---|---|
| Umuvuduko wa Squeegee | 100 ± 20 g/mm | >150 g/mm → guhindura stencil |
| Umuvuduko wo gutandukana | 1.5 ± 0.5 mm/s | >3 mm/s → gushushanya imva +250% |
| Imiterere y'ikirere | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → ihindagurika ry'ingano ± 12% |
Igenzura ry’imikorere ya AI ifunze: Gukurikirana SPI → Icyitegererezo cya LSTM → Ingurane ihinduka → CPK ≥ 2.0
3. Solder Paste: Uburyo bwose bwo gukurikirana ubuzima
- ·Kubika ahantu hakonje kuri -40℃
- ·Gushyushya buhoro buhoro: 5℃ buri masaha 2 kugeza ubushyuhe bw'icyumba
- ·Kuvanga centrifugal: 1200 rpm kuri 180s
- ·Igenzura ry'ubushyuhe: 850 ± 30 kcps
- ·Isaha yo gufungura: ≤ amasaha 72
- ·Guhuza itsinda rya MES kugira ngo rikurikirane neza
4. Gusukura stencil: Ingwate y'ibisigazwa nta bisigaye
| Uburyo bwo gusukura | Inshuro | Uburyo bwo kugenzura |
|---|---|---|
| Guhanagura byumye + Gusukura umwuka | Buri PCB 5 | Igenzura rya mikorosikopi rya 50x |
| Gusukura mu buryo bwimbitse | Buri minota 30 | Ibisigazwa bya Gravimetric |
Ibipimo ngenderwaho: Ubushyuhe 50.000 byacapwe
III. Agaciro k'umukiriya: Kunoza Ubwiza bw'Ibintu mu Mubare
| Igipimo | Mbere | Nyuma | Imiterere y'ibyabaye |
|---|---|---|---|
| Umusaruro wa mbere wo gutsinda | 82% | 99.1% | QFN y'umuvuduko wa 0.4mm |
| Igipimo cy'ubusembwa | 850 PPM | 62 PPM | BGA y'imodoka (X-Ray) |
| Ikiguzi cyo kongera gukora | $12k/ukwezi | $0.8k/ukwezi | Umurongo wa PCBA w'ubuvuzi |
Agasanduku: Ikarita nkuru y'isaha y'ubwenge ifite ubucucike bw'ibice bya 01005 nta nenge yabonetseho binyuze muri stencil ikozwe muri nano-coated
IV. Imbere y'Inganda: Igihe cyo Gucapa mu buryo bw'Ubwenge
Gahunda y'ikoranabuhanga
- ·2024: Uburyo bwo gushushanya bw'impanga ebyiri mu gucapa stencil
- ·2025: Sisitemu yo gukangura ya AI ijyanye n'igihe
- ·2026: Kugenzura uburyo bwo gukora ikoreshwa rya paste yo mu rwego rwa molekile
Ubuhanga mu by'Umwuga
"Inyungu ya 23.7% yabonetse binyuze mu kunoza ingano y'umusemburo kuva kuri ± 15% kugeza kuri ± 8% (SMTA 2023-PT-087).
Ikoranabuhanga ry’inkingi enye ryongerera igihe cyo gucapa MTBA (Igihe cy’uburiganya hagati y’ibice) kugeza ku masaha 1200."
Amareferensi
- 1.IPC-7525C “Amabwiriza agenga igishushanyo mbonera cya stencil”
- 2.J-STD-005B “Ibisabwa kugira ngo ushyireho ifu”
- 3. Inyandiko Yera ya SMTA: “Ibipimo byo Gutanga Solder Paste” (2023)
- 4.IEC 61191-3: 2017 “Inama z’Ubuyobozi zacapwe - Igice cya 3”
