Ukufezekisa Ukwenziwa Kwemveliso Okungenaziphene Ngeentsika Ezine Zobuchwephesha
I. Undoqo woBugcisa: Ulawulo oluchanekileyo lokufakwa kwePaste yeSolder
Ingcaciso yoShishino: "Iziphene ze-soldering ezingama-60%-70% zivela ekuprintweni (IPC-7525 7.1.2). Ukubekwa ngokuchanekileyo yindlela yokuqala yokuzikhusela."
Iithagethi zoLawulo loBungakanani
| Ubukhulu | Iimfuneko ezisemgangathweni | Isalathiso se-IPC |
|---|---|---|
| Ukuchaneka komqulu | Izinga lokuDlulisela > 85%, i-CPK ≥ 1.67 | J-STD-005 4.3.2 |
| Ukunyaniseka koBume | Ukuwa ≤ 10%, Akukho msila/ukudilika | IPC-SM-817 3.2.1 |
| Ukuchaneka kwesikhundla | I-Offset ≤ 15% yobubanzi bePad | IPC-A-610H 8.2.3.4 |
II. Ukuphuculwa Okunzulu Kweentsika Zobuchwephesha Ezine
1. Uyilo lweStencil: Itemplate yoBuchule obuNcinci
- ·Ukusika nge-laser + ukupholisha nge-electro (Ra ≤ 0.6μm, kuhambelana neClass 3)
- ·Ukuphakama ukuya phezulu/ezantsi ≤ 0.08mm (uyilo oluchasene nokungqubana kweeblade)
- ·I-SiN nano-coating inciphisa iziphene zebhola ye-solder nge-38%
- ·Uyilo lwe-micro aperture lwezixhobo ze-01005 (umlinganiselo wendawo ≥ 0.71)
Indlela yokusebenza yokuqinisekisa uyilo: I-PCB → I-DFM → Uhlobo lwePrototype → Imveliso eNinzi
2. IiParamitha zokuPrinta: Ulawulo oluHlangeneyo oluValiweyo
| Ipharamitha | Uluhlu oluqhelekileyo | Umngcipheko oMiselweyo |
|---|---|---|
| Uxinzelelo lweSqueegee | 100 ± 20 g/mm | >150 g/mm → ukuguqulwa kwestencil |
| Isantya soKwahlula | 1.5 ± 0.5 mm/s | >3 mm/s → ukubethelwa ngamatye engcwaba +250% |
| Iimeko zeNdalo | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → ukuguquguquka komthamo ±12% |
Ulawulo lwe-AI oluvaliweyo: Ukubeka iliso kwi-SPI → imodeli ye-LSTM → imbuyekezo eguquguqukayo → i-CPK ≥ 2.0
3. I-Solder Paste: Ukulandeleka kwe-Full Lifecycle
- ·Indawo yokugcina ebanda kwi -40℃
- ·Ukufudumeza ngokulandelelana: 5℃ rhoqo emva kweeyure ezi-2 ukuya kubushushu begumbi
- ·Ukuxuba i-Centrifugal: 1200 rpm kwi-180s
- ·Ukujonga ubungqindilili: 850 ± 30 kcps
- ·Ixesha lokuvula: ≤ iiyure ezingama-72
- ·Ukubopha ibhetshi ye-MES ukuze kulandelelwe
4. Ukucocwa kweStencil: Isiqinisekiso seZero-residue
| Indlela yokucoca | Izihlandlo | Indlela yokuqinisekisa |
|---|---|---|
| Isula eyomileyo + I-Vacuum | Rhoqo ii-PCB ezi-5 | Uvavanyo lweMicroskopu lwe-50x |
| Isinyibilikisi Ukucoca Okunzulu | Rhoqo ngemizuzu engama-30 | Intsalela yeGravimetric |
Iikhrayitheriya zeScrap: Uxinzelelo 50,000 iiprinti
III. Ixabiso loMthengi: Ukuphuculwa koMgangatho okuBalwa
| I-Metric | Ngaphambi | Emva | Imeko |
|---|---|---|---|
| Isiphumo sokupasa sokuqala | 82% | 99.1% | Iphimbo le-QFN eliyi-0.4mm |
| Izinga Eligqibeleleyo Lesiphako | 850 PPM | 62 PPM | I-BGA yeeMoto (i-X-Ray) |
| Iindleko Zokuphinda Usebenze | $12k/ngenyanga | $0.8k/ngenyanga | Umgca we-PCBA wezonyango |
Ityala: Ibhodi enkulu ye-Smartwatch ene-01005 component density ayiphumelelanga nge-stencil egqunywe nge-nano-coated
IV. Umda weShishini: Ixesha lokuPrinta ngoBuchule
Imephu yeTekhnoloji
- ·2024: Ukulinganisa amawele edijithali kokuprinta istencil
- ·2025: Inkqubo ye-squeegee ye-AI ehlengahlengiswayo
- ·2026: Ulawulo lwe-reactivity ye-solder paste yenqanaba le-molecular
Ingqiqo yobungcali
"Inzuzo ye-23.7% yenzuzo efunyenwe ngokuphucula ukuchaneka kwevolumu ye-paste ukusuka kwi-±15% ukuya kwi-±8% (SMTA 2023-PT-087).
Itekhnoloji yee-four-pillar yandisa i-printing defect MTBA (Mean Time Between Defects) ukuya kwiiyure ezili-1200.
Iireferensi
- 1.IPC-7525C “Izikhokelo zoYilo lweStencil”
- 2.J-STD-005B “Iimfuneko zeSoldering Paste”
- 3. Iphepha eliMhlophe le-SMTA: “IiMetriki zokuBekwa kweSolder Paste” (2023)
- 4.IEC 61191-3:2017 “Iindibano zeBhodi eziprintiweyo - Icandelo 3”
