| Chinthu | PCB yolimba (HDI) | PCB yosinthasintha | PCB Yolimba Yosinthasintha |
| Gawo Lalikulu | 2-68L | 12L | 68L |
| Chigawo Chamkati Chocheperako/Malo | 1.4/1.4mil | 2/2ml | 2/2ml |
| Kutuluka kwa Gawo Locheperako/Malo Osachepera | 1.4/1.4mil | 3/3mil | 3/3mil |
| Mkuwa Wamkati Wokhala ndi Mkuwa Waukulu | 6oz | 2oz | 6oz |
| Mkuwa Waukulu Wopanda Kutuluka | 6oz | 3oz | 6oz |
| Kuboola Kwang'ono kwa Makina | 0.15mm/6mil | 0.15mm | 0.15mm |
| Kubowola Kwa Laser Kochepa | 0.05mm/3mil | 0.05mm | 0.05mm |
| Chiŵerengero Chachikulu Cha Mawonekedwe (Kubowola Makina) | 20:1 | / | 20:1 |
| Chiŵerengero Chachikulu cha Mawonekedwe (Kubowola kwa Laser) | 1:1 | 1:1 | 1:1 |
| Kugwirizana kwa Zigawo Zosiyanasiyana | +/-0.254mm(1mil) | ± 0.05mm | ± 0.05mm |
| Kulekerera kwa PTH | ± 0.075mm | ± 0.075mm | ± 0.075mm |
| Kulekerera kwa NPTH | ± 0.05mm | ± 0.05mm | ± 0.05mm |
| Kulekerera kwa Sinki Yotsutsana | +0.15mm | ± 0.15mm | ± 0.15mm |
| Makulidwe a bolodi | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Kulekerera kwa Makulidwe a Bodi ( |
± 0.1mm | ± 0.05mm | ± 0.1mm |
| Kulekerera kwa Makulidwe a Bodi (≥1.Omm) | ± 8% | / | ± 10% |
| Kukula kwa Bodi Yochepa | 10 * 10mm | 5 * 5mm | 10 * 10mm |
| Kukula kwa Bodi Lalikulu | 1200mm * 750mm | 500 * 1200mm | 500*500mm |
| Kulinganiza kwa Ndondomeko | +/-0.075mm(3mil) | ± 0.05mm | ± 0.1mm |
| BGA yanga | 0.125mm (5mil) | 7mil | 7mil |
| SMT yanga | 0.177*0.254mm(7*10mil) | 7 * 10mil | 7 * 10mil |
| Chilolezo cha Min Solder Mask | 1.5mil | 2mil | 1.5mil |
| Damu Langa la Chigoba cha Solder | 3mil | 3mil | 3mil |
| Nthano | Woyera, Wakuda, Wofiira, Wachikasu | Woyera, Wakuda, Wofiira, Wachikasu | Woyera, Wakuda, Wofiira, Wachikasu |
| Kutalika/Kutalika kwa Nthano Yochepa | 4/23mil | 4/23mil | 4/23mil |
| Min Bending Radius (Bodi Limodzi) | / | 3-6 x Kukhuthala kwa bolodi | 3-7 x Flexbile Board Makulidwe |
| Min Bending Radius (Kawiri Mbali Board) | / | 6-10 x Kukhuthala kwa bolodi | 6-11 x Kukhuthala kwa Bodi Yosinthasintha |
| Min Bending Radius (Bodi Yokhala ndi Zigawo Zambiri) | / | 10-15 x Kukhuthala kwa bolodi | 10-16 x Flexbile Board Makulidwe |
| Min Pinding Radius (Kupinda Kolimba) | / | 20-40 x Kukhuthala kwa bolodi | 20-40 × Makulidwe a bolodi |
| Kuchuluka kwa Fillet Yovuta | / | 1.5+0.5mm | 1.5+0.5mm |
| Uta ndi Kupotoza | 0.005 | / | 0.0005 |
| Kulekerera kwa Impedance | Chomaliza Chimodzi: ±5Ω(≤50Ω)，±7%(＞50Ω) | Chomaliza Chimodzi: ±5Ω(≤50Ω),±10%(＞50Ω) | Chomaliza Chimodzi: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Kulekerera kwa Impedance | Kusiyana: ± 5Ω(≤50Ω),± 7%(＞50Ω) | Kusiyana: ± 5Ω(≤50Ω),± 10%(＞50Ω) | Kusiyana: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Chigoba cha Solder | Wobiriwira, Wakuda, Wabuluu, Wofiira, Matti Wobiriwira, Wachikasu, Woyera, Wofiirira | Chigoba Chobiriwira Chogulitsira/PI Yakuda/PI Yachikasu | Chobiriwira, Chakuda, Chabuluu, Chofiira, Matt Chobiriwira |
| Kumaliza Pamwamba | Kupaka golide wa Eiectronic, ENIG, Kupaka golide wolimba, Chala chagolide, Siliva womiza, ImmersionTin, HASL LF, OSP, ENEPIG, Kupaka golide wofewa | Kuphimba golide wamagetsi, ENIG, Kuphimba golide wolimba, Chala chagolide, Siliva womiza, Tin yomiza, OSP, ENEPIG, Kuphimba golide wofewa | Kuphimba golide wamagetsi, ENIG, Kuphimba golide wolimba, Chala chagolide, Siliva womiza, Tin ya Immersio, HASL LF, OSP, ENEPIG, Kuphimba golide wofewa |
| Njira Yapadera | Yobisika/yopanda maso, payipi yolowera, yayikulu kwambiri, yolimba/yokhala ndi mphamvu, mphamvu yosakanikirana, RF, chala chagolide, kapangidwe ka N+N, mkuwa wokhuthala, kubowola kumbuyo, HDI(5+2N+5) | chala chagolide, lamination, zomatira zoyendetsera, filimu yoteteza, dome lachitsulo | Yobisika/yopanda maso, payipi yolowera, yayikulu kwambiri, yolimba/yokwanira, mphamvu yosakanikirana, RF, chala chagolide, kapangidwe ka N+N, mkuwa wokhuthala, kubowola kumbuyo |
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