I-DPC Ceramic Substrate: inketho ekahle yokupakisha ama-chip e-LiDAR ezimoto
Umsebenzi we-LiDAR (Ukutholwa Kokukhanya Nokulinganisa) ukukhipha izimpawu ze-infrared laser nokuqhathanisa izimpawu eziboniswayo ngemva kokubhekana nezithiyo nezimpawu ezikhishwayo, ukuze kutholakale ulwazi olufana nendawo, ibanga, ukuma, ijubane, isimo sengqondo, kanye nesimo sethagethi. Lobu buchwepheshe bungafeza ukugwema izithiyo noma ukuzulazula okuzenzakalelayo. Njengenzwa enembile kakhulu, i-LiDAR ibhekwa kabanzi njengesihluthulelo sokufeza ukushayela okuzenzakalelayo kwezinga eliphezulu, futhi ukubaluleka kwayo kuya ngokuya kugqama.
Imithombo yokukhanya ye-laser ivelele phakathi kwezingxenye eziyinhloko ze-LiDAR yezimoto. Njengamanje, umthombo wokukhanya we-VCSEL (vertical cavity surface emitting laser) usuyisinqumo esikhethwayo se-hybrid solid-state LiDAR kanye ne-flash LiDAR ezimotweni ngenxa yezindleko zayo eziphansi zokukhiqiza, ukuthembeka okuphezulu, i-angle encane yokwehlukana, kanye nokuhlanganiswa okulula kwe-2D. I-chip ye-VCSEL ingafinyelela ibanga elide lokutholwa, ukunemba okuphezulu kokubona, futhi ihambisane nezindinganiso zokuphepha kwamehlo eziqinile ku-LiDAR yezimoto ye-hybrid solid-state. Ngaphezu kwalokho, zenza i-Flash LiDAR ifinyelele umbono oguquguqukayo nobanzi, futhi ibe nezinzuzo ezinkulu zezindleko.
Ama-substrate e-ceramic abe yinto efanelekile yokupakisha ama-chip kwizicelo zezimoto ze-LiDAR.
I-DPC (Direct Copper Plating) ceramic substrates ine-thermal conductivity ephezulu, i-insulation ephezulu, ukunemba okuphezulu kwesekethe, ubushelefu obuphezulu bendawo, kanye ne-thermal expansion coefficient ehambisana ne-chip. Ziphinde zinikeze ukuxhumana okuqondile ukuze kuhlangatshezwane nezidingo zokupakisha ze-VCSEL.
1. Ukushabalalisa ukushisa okuhle kakhulu
I-substrate ye-ceramic ye-DPC inokuxhumana okuqondile, okwakha iziteshi zokuqhuba zangaphakathi ezizimele. Ngenxa yokuthi i-ceramics iyizivikeli kanye neziqondisi zokushisa, ingafinyelela ukuhlukaniswa kwe-thermoelectric futhi ixazulule ngempumelelo inkinga yokushabalaliswa kokushisa kwama-VCSEL chips.
2. Ukuthembeka okuphezulu
Ubuningi bamandla ama-chip e-VCSEL buphezulu kakhulu, futhi ukungafani kokwanda kokushisa phakathi kwe-chip kanye ne-substrate kungaholela ezinkingeni zokucindezeleka. I-coefficient yokwanda kokushisa kwama-substrate e-ceramic iyahambisana kakhulu ne-VCSEL. Ngaphezu kwalokho, ama-substrate e-ceramic e-DPC angahlanganisa ozimele bensimbi kanye nama-substrate e-ceramic ukuze akhe umgodi ovalwe, onesakhiwo esiqinile, ongenalo ungqimba oluphakathi lokubopha, kanye nokuqina komoya okuphezulu.
3. Ukuxhumana okuqondile
Ukupakishwa kwe-VCSEL kudinga ukufakwa kwelensi ngaphezu kwe-chip, ngakho-ke kudingeka kufakwe imbobo ye-3D ku-substrate. Ama-substrate e-DPC ceramic anenzuzo yokuxhumana okuqondile nokuthembeka okuphezulu, afanelekela ukubopha okuqondile kwe-eutectic.
Ngomongo wokuthuthukiswa kwezimoto ezihlakaniphile, izinto zobumba zidlala indima ebaluleke kakhulu ekuthuthukisweni okuhlakaniphile kwezimoto ezintsha zamandla. Njengesisekelo salo lonke ubuchwepheshe, ukusungula izinto ezintsha okuqhubekayo kubuchwepheshe bezinto kubalulekile ekusekeleni intuthuko ephumelelayo yomkhakha wonke.
