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Ibhodi yePCB yesandisi-mandla sonxibelelwano
Imiyalelo yokwenziwa kwemveliso
| Uhlobo lweBhodi yeSekethe | I-PCB ecinezela rhoqo yeHybrid + i-Metal edging + i-resin plug hole |
| iileya zebhodi ye-pcb | 8L |
| ubukhulu bebhodi ye-pcb | 2.0mm |
| Ubungakanani obunye | 104.9 * 108.4mm / 1PCS |
| Ukugqitywa komphezulu | VUMELANA |
| Ubukhulu bobhedu bangaphakathi | 35um |
| Ubukhulu bobhedu bangaphandle | 35um |
| Ukugquma iSolder | oluhlaza (GTS, GBS) |
| Isikrini sesilika sePCB | emhlophe (GTO,GBO) |
| izixhobo zebhodi yesekethe | IiRogers RO4350B+ Iisubstrates eziqhelekileyo S1000-2M,FR-4,TG170 |
| ngokusebenzisa umngxuma | umngxuma weplagi yeresin |
| Ubuninzi bomngxuma wokugrumba ngoomatshini | 11W/㎡ |
| Ubuninzi bomngxuma wokugrumba nge-laser | / |
| Ubungakanani obuncinci | 0.3mm |
| Ububanzi bomgca/indawo encinci | 5/7mil |
| Umlinganiselo wokuvula | 7mil |
| Ukucinezela | Ixesha eli-1 |
| ukubhola iibhodi ze-pcb | Ixesha eli-1 |
Ukuqinisekisa umgangatho
Inkqubo yoLawulo loMgangatho: I-ISO 9001: 2015, ISO14001: 2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000: 2012SGS, RBA, CQC, WCA kunye ne-ESA, SQ MARK, Canon GA, Sony GP
Umgangatho womgangatho we-PCB: I-IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
Inkqubo enkulu yokuvelisa i-PCB: I-IL/lmage, iPatternPlating, i-I/L AOI, i-B/Oxide, i-Layup, i-Press, i-LaserDrilling, i-Drilling, i-PTH, i-PanelPlating, i-O/Llmage, i-PanelPlating, i-SESEtching, i-O/L AOI, i-S/Mask, i-Legend, i-SurfaceFinshed (ENIGENEPIG, iGolide elukhuni, iGolide ethambileyo, i-HASL, i-LF-HASL, i-lmm Tin, i-lmm iSilver, i-OSP), i-Rout, i-ET, i-FV
Izinto zokufumanisa
| Izixhobo zokuhlola | izinto zovavanyo |
| I-oven | Uvavanyo lokugcina amandla obushushu |
| Umatshini wokuvavanya inqanaba lokungcola kwe-ion | Uvavanyo lokucoceka kwe-Ionic |
| Umatshini wokuvavanya ityuwa | Uvavanyo lokutshiza ngetyuwa |
| Umvavanyi we-DC osebenza ngamandla aphezulu | Uvavanyo lokumelana ne-voltage |
| UMegger | Ukumelana nobushushu |
| Umatshini wokutsalwa we-Universal | Uvavanyo lokuqina kwamaxolo |
| I-CAF | Uvavanyo lokufuduka kwee-ion, ukuphucula ii-substrates ze-PCB, ukuphucula ukucutshungulwa kwe-PCB, njl. |
| I-OGP | Ukusebenzisa izixhobo zokulinganisa umfanekiso we-3D ezingadibaniyo, kunye neqonga lokuhamba le-XYZ axis kunye nesibuko sokusondeza ngokuzenzekelayo, kusetyenziswa imigaqo yohlalutyo lomfanekiso ukucubungula imiqondiso yomfanekiso ngekhompyutha, ukulinganiswa kobukhulu bejometri kunye nokunyamezelana kwendawo kunokufunyaniswa ngokukhawuleza nangokuchanekileyo, kwaye amaxabiso e-CPK anokuhlalutywa. |
| Umatshini wokulawula ukumelana okwi-intanethi | Uvavanyo lwe-TCT lokuxhathisa ulawulo Iindlela eziqhelekileyo zokusilela, ukuqonda izinto ezinokubangela umonakalo kwizixhobo zenkqubo kunye nezinto eziyinxalenye yazo ukuqinisekisa ukuba imveliso iyilwe okanye yenziwe ngokuchanekileyo na |
| Izixhobo zokuhlola | izinto zovavanyo |
| Ibhokisi yomothuko ebandayo neshushu | Uvavanyo lomothuko olubandayo nolushushu, ubushushu obuphezulu nobuphantsi |
| Igumbi lobushushu kunye nomswakama ohlala uhleli | Uvavanyo lokumelana nokugqwala kunye nokugquma komphezulu nge-electrochemical |
| Imbiza yesolder | Uvavanyo lokuthengiseka |
| I-RoHS | Uvavanyo lweRoHS |
| Umvavanyi we-Impedance | I-AC impedance kunye namaxabiso okulahleka kwamandla |
| Izixhobo zovavanyo lombane | Vavanya ukuqhubeka kwesekethe yemveliso |
| Umatshini wenaliti obhabhayo | Uvavanyo lokuqhuba ubushushu obuphezulu kunye nokumelana okuphantsi |
| Umatshini wokuhlola umngxuma ozenzekelayo ngokupheleleyo | Jonga iintlobo ezahlukeneyo zemingxuma engangqalanga, kuquka imingxunya engqukuva, imingxunya emifutshane, imingxunya emide, imingxunya emikhulu engangqalanga, imingxunya eneembobo, imingxunya embalwa, imingxunya emikhulu nemincinci, kunye nemisebenzi yokuhlola iplagi yemingxuma. |
| I-AOI | I-AOI ihlola ngokuzenzekelayo iimveliso ze-PCBA ngeekhamera ze-CCD ezikumgangatho ophezulu, iqokelele imifanekiso, ithelekise amanqaku ovavanyo kunye neeparameter ezifanelekileyo kwisiseko sedatha, kwaye emva kokucutshungulwa komfanekiso, ijonga iziphene ezincinci ezinokungajongwa kwi-PCB ekujoliswe kuyo. Akukho ndlela yokubalekela iziphene zesekethe. |
Izicelo zePCB eziQhelekileyo eziPhakamileyo
Khetha izixhobo ezisebenzisa i-frequency ephezulu kunye neendlela zokucubungula ezinexabiso elahlukileyo le-DK kunye ne-DF ukuze uhlangabezane neemeko zokusetyenziswa kwee-PCB ezahlukeneyo ezisebenzisa i-high-frequency: ukuhanjiswa kwedatha engenazingcingo, i-WiFi, i-4G, i-5G, i-6G, ii-oven ze-microwave, unxibelelwano lwesathelayithi, usasazo lwerediyo, unxibelelwano oluphathwayo, usasazo lwethelevishini, i-GPS, ulawulo olukude, ukubeka esweni, unxibelelwano oluchanekileyo, umyalelo okude, ulawulo lwezixhobo, i-radar yamaza ye-76~81GHz ye-millimeter, i-radar yokulwa nokungqubana kwe-millimeter yomgama omde, i-radar yokulwa nokungqubana kwe-millimeter ye-drone, i-antenna yesiphelo sonxibelelwano lwesathelayithi kunye ne-backboard ekhawulezayo.
I-High-frequency (HF): Uluhlu lwe-high-frequency luphakathi kwe-3MHz kunye ne-30MHz.
I-Radio Frequency (RF): Idla ngokubhekisa kuluhlu lweefrikhwensi ukusuka malunga ne-3kHz ukuya kwi-300GHz.
I-Microwave: Uluhlu luphakathi kwe-300MHz kunye ne-300GHz.
Yintoni i-dielectric constant ye-RO4350B?
I-RO4350B ine-dielectric constant (Dk) emalunga ne-3.48, elixabiso elizinzileyo xa lilinganiswa kwi-frequency ye-10 GHz. Le dielectric constant yenza i-RO4350B ilungele ukusetyenziswa kwe-frequency ephezulu njengeenkqubo zonxibelelwano ze-microwave kunye ne-RF, njengoko inika iimpawu zokudlulisela isignali ezizinzileyo ngakumbi.
Isicelo
I-HDI PCB ineendlela ezahlukeneyo zokusetyenziswa kwicandelo le-elektroniki, ezinje ngezi:
-Idatha Enkulu kunye ne-AI: I-HDI PCB inokuphucula umgangatho wesiginali, ubomi bebhetri kunye nokuhlanganiswa okusebenzayo kweefowuni eziphathwayo, ngelixa inciphisa ubunzima kunye nobukhulu bazo. I-HDI PCB inokuxhasa uphuhliso lweetekhnoloji ezintsha ezifana nonxibelelwano lwe-5G, i-AI kunye ne-IoT, njl.
-Imoto: I-HDI PCB inokuhlangabezana neemfuno ezinzima nezithembekileyo zeenkqubo ze-elektroniki zeemoto, ngelixa iphucula ukhuseleko, intuthuzelo kunye nobukrelekrele beemoto. Ingasetyenziswa nakwimisebenzi efana neradar yeemoto, ukuhambahamba, ukuzonwabisa kunye noncedo lokuqhuba.
-Ezonyango: I-HDI PCB inokuphucula ukuchaneka, uvakalelo kunye nokuzinza kwezixhobo zonyango, ngelixa inciphisa ubungakanani bazo kunye nokusetyenziswa kwamandla. Ingasetyenziswa nakwiinkalo ezifana nemifanekiso yezonyango, ukubeka esweni, ukuxilongwa kunye nonyango.
Iinkqubo eziphambili ze-HDI PCB zikwiifowuni eziphathwayo, iikhamera zedijithali, ii-AI, ii-IC carriers, iilaptops, ii-elektroniki zeemoto, iirobhothi, iidrone, njl.njl., ezisetyenziswa kakhulu kwiindawo ezininzi.
