Papa PCB hoʻonui mana kamaʻilio
Nā kuhikuhi hana huahana
| ʻAno o ka Papa Kaapuni | PCB kaomi Hybrid alapine kiʻekiʻe + Metal edging + resin plug hole |
| nā papa papa pcb | 8L |
| ka mānoanoa o ka papa pcb | 2.0mm |
| Nui hoʻokahi | 104.9*108.4mm/1PCS |
| Hoʻopau ʻili | ʻAelike |
| Mānoanoa keleawe o loko | 35um |
| Mānoanoa keleawe waho | 35um |
| Ka uhi ʻana i ka solder | ʻōmaʻomaʻo (GTS，GBS) |
| PCB pale silika | keʻokeʻo (GTO,GBO) |
| mea papa kaapuni | ʻO Rogers RO4350B+ Nā Substrates Maʻamau S1000-2M, FR-4, TG170 |
| ma o ka lua | puka plug resin |
| Ka nui o ka lua ʻeli mīkini | 11W/㎡ |
| Ka nui o ka lua ʻeli laser | / |
| Ka nui liʻiliʻi loa | 0.3mm |
| Ka laulā laina liʻiliʻi loa/wahi | 5/7miliona |
| Laki puka | 7 miliona |
| Ke kaomi ʻana | 1 manawa |
| ʻeli papa pcb | 1 manawa |
Hōʻoiaʻiʻo Kūlana
ʻŌnaehana Hoʻokele Kūlana: ISO 9001: 2015, ISO14001: 2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000: 2012SGS, RBA, CQC, WCA & ESA, SQ MARK, Canon GA, Sony GP
Kūlana kūlana PCB: IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
Ke kaʻina hana hana nui o ka PCB: IL/lmage, PatternPlating, I/L AOI, B/Oxide, Layup, Press, LaserDrilling, Drilling, PTH, PanelPlating, O/Llmage, PanelPlating, SESEtching, O/L AOI, S/Mask, Legend, SurfaceFinshed (ENIGENEPIG, Gula Paʻa, Gula Palupalu, HASL, LF-HASL, lmm Tin, lmm Silver, OSP), Rout, ET, FV
Nā mea ʻike
| Nā lako nānā | nā mea hoʻāʻo |
| Umu | Ka hoʻāʻo ʻana i ka mālama ʻana i ka ikehu wela |
| Mīkini hoʻāʻo pae haumia ion | Hoʻāʻo hoʻomaʻemaʻe ionic |
| Mīkini hoʻāʻo ʻana i ka paʻakai | Hoʻāʻo pīpī paʻakai |
| Mea hoʻāʻo uila kiʻekiʻe DC | Hoʻāʻo kū i ke au uila |
| ʻO Megger | Ke kū'ē ʻana i ka pale ʻana |
| Mīkini tensile honua | Hoʻāʻo ikaika ʻili |
| CAF | Ka hoʻāʻo ʻana i ka neʻe ʻana o ka Ion, ka hoʻomaikaʻi ʻana i nā substrates PCB, ka hoʻomaikaʻi ʻana i ka hana ʻana o PCB, a pēlā aku. |
| OGP | Me ka hoʻohana ʻana i nā mea ana kiʻi 3D pili ʻole, i hui pū ʻia me ka paepae neʻe axis XYZ a me ke aniani zoom aunoa, me ka hoʻohana ʻana i nā loina loiloi kiʻi e hana i nā hōʻailona kiʻi e ke kamepiula, hiki ke ʻike koke ʻia ke ana o nā ana geometric a me nā ʻae ʻana i ke kūlana, a hiki ke kālailai ʻia nā waiwai CPK. |
| Mīkini hoʻomalu pale kū'ē ma ka pūnaewele | Hoʻāʻo TCT pale ʻana i nā ʻano hāʻule maʻamau, e hoʻomaopopo ana i nā mea hiki ke hōʻino i nā lako ʻōnaehana a me nā ʻāpana e hōʻoia inā ua hoʻolālā pololei ʻia a hana ʻia paha ka huahana |
| Nā lako nānā | nā mea hoʻāʻo |
| Pahu hoʻohoka anu a me ka wela | Hoʻāʻo haʻalulu anu a me ka wela, kiʻekiʻe a me ka haʻahaʻa o ka mahana |
| Keʻena mahana a me ka haʻahaʻa mau | Ka hoʻāʻo ʻana i ka palaho electrochemical a me ke kūpaʻa ʻana o ka insulation ʻili |
| Ipu hao | Hoʻāʻo kūʻai |
| RoHS | Hoʻāʻo RoHS |
| Mea hoʻāʻo impedance | Nā waiwai impedance AC a me ka pohō mana |
| Nā lako hoʻāʻo uila | E hoʻāʻo i ka hoʻomau kaapuni o ka huahana |
| Mīkini nila lele | Hoʻāʻo hoʻokele pale uila kiʻekiʻe a me ke kū'ē haʻahaʻa |
| Mīkini nānā lua piha piha | E nānā i nā ʻano puka like ʻole, me nā puka poepoe, nā puka pōkole, nā puka lōʻihi, nā puka nui ʻē, porous, nā puka kakaikahi, nā puka nui a me nā puka liʻiliʻi, a me nā hana nānā plug puka |
| ʻAOI | Hoʻopaʻa pono ʻo AOI i nā huahana PCBA ma o nā kāmela CCD wehewehe kiʻekiʻe, hōʻiliʻili i nā kiʻi, hoʻohālikelike i nā kiko hoʻāʻo me nā palena kūpono i loko o ka waihona ʻikepili, a ma hope o ka hana ʻana i ke kiʻi, nānā i nā hemahema liʻiliʻi i hiki ke nānā ʻole ʻia ma ka PCB pahuhopu. ʻAʻohe pakele mai nā hemahema kaapuni |
Nā noi PCB alapine kiʻekiʻe
E koho i nā mea alapine kiʻekiʻe a me nā ʻano hana hana me nā waiwai DK a me DF like ʻole e hoʻokō i nā hiʻohiʻona noi o nā PCB alapine kiʻekiʻe like ʻole: ka hoʻoili ʻikepili uea ʻole, WiFi, 4G, 5G, 6G, Nā umu Microwave, kamaʻilio ukali, hoʻolaha lekiō, kamaʻilio kelepona, hoʻolaha kīwī, GPS, mana mamao, nānā ʻana, kamaʻilio tactical, kauoha mamao, ka mana lako, radar nalu millimeter 76 ~ 81GHz, radar anti-collision nalu millimeter lōʻihi, radar anti-collision nalu millimeter no ka drone, antenna terminal kamaʻilio ukali a me ka backboard wikiwiki.
Alapine kiʻekiʻe (HF): Aia ka laulā alapine kiʻekiʻe ma waena o 3MHz a me 30MHz.
Alapine (frequency): ʻO ka maʻamau, pili ia i ka pae alapine (frequency) mai kahi o 3kHz a i 300GHz.
Microwave: Aia ka pae ma waena o 300MHz a me 300GHz.
He aha ke ʻano dielectric o RO4350B?
Loaʻa i ka RO4350B kahi dielectric constant (Dk) ma kahi o 3.48, he waiwai paʻa ia ke ana ʻia ma ke alapine (frequency) o 10 GHz. ʻO kēia dielectric constant e kūpono ai ʻo RO4350B no nā noi alapine kiʻekiʻe e like me ka microwave a me nā ʻōnaehana kamaʻilio RF, no ka mea, hāʻawi ia i nā ʻano hoʻoili hōʻailona paʻa.
Noi
Loaʻa i ka HDI PCB kahi ākea o nā hiʻohiʻona noi ma ke kahua uila, e like me:
-ʻIkepili Nui & AI: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka maikaʻi o ka hōʻailona, ke ola pākaukau a me ka hoʻohui hana o nā kelepona paʻalima, me ka hoʻemi ʻana i ko lākou kaumaha a me ka mānoanoa. Hiki i ka HDI PCB ke kākoʻo i ka hoʻomohala ʻana o nā ʻenehana hou e like me ke kamaʻilio 5G, AI a me IoT, a pēlā aku.
-Kaʻa: Hiki i ka HDI PCB ke hoʻokō i nā koi paʻakikī a me ka hilinaʻi o nā ʻōnaehana uila kaʻa, me ka hoʻomaikaʻi ʻana i ka palekana, ka ʻoluʻolu a me ka naʻauao o nā kaʻa. Hiki ke hoʻopili ʻia i nā hana e like me ka radar kaʻa, ka hoʻokele, ka leʻaleʻa a me ke kōkua hoʻokele.
-Lapaʻau: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka pololei, ka ʻike a me ke kūpaʻa o nā lako lapaʻau, me ka hoʻemi ʻana i ko lākou nui a me ka hoʻohana ʻana i ka mana. Hiki ke hoʻohana ʻia i nā kahua e like me ke kiʻi lapaʻau, ka nānā ʻana, ka ʻike a me ka mālama ʻana.
ʻO nā noi nui o ka HDI PCB i nā kelepona paʻalima, nā kāmela kikohoʻe, AI, nā mea lawe IC, nā kamepiula lawe, nā mea uila kaʻa, nā robots, nā drones, a me nā mea ʻē aʻe, i hoʻohana nui ʻia ma nā ʻano he nui.
