Hana ʻana o PCB a me PCBA
Hale hana
E ʻimi i kā mākou mau hale hana hana kiʻekiʻe loa a me nā kaʻina hana holomua
Papa inoa o nā lako hana hana PCB
ʻOi aku ma mua o 200 mau lako hana hana pololei kiʻekiʻe, me 50 mau mīkini ʻeli ʻeono-axis, 10 mau mīkini ʻeli laser, a me 20 mau mīkini AOI, e hāʻawi ana i kahi laina hana hana piha piha.
I/L — Kiʻi Papa Loʻo & AOI
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Hoʻomaʻemaʻe mua (ʻīnika) | ʻO Orbotech, Schmid | 3 | E hoʻomaʻemaʻe i nā panela o loko ma mua o ke uhi ʻana |
| Mea Hoʻopili Roller (Kū pololei) | Schmid, KCE | 2 | ʻO ka uhi ʻana o ka photoresist kū pololei |
| Mea Hoʻopili ʻUmiʻumi (Horizontal) | Schmid, KCE | 1 | Ka uhi ʻana/lamination pālahalaha o ka photoresist |
| DES (Hoʻomohala/ʻEke/Wehe) | Atotech, Manz, HOYA, YangBo (TW) | 3 | Hoʻomohala-ʻoki-ʻoki papa o loko |
| Hōʻike Aunoa (ʻīnika) | ʻO Orbotech, Lithography Maskless, PĀKĀ | 5 | Hoʻolaha ʻakomi no nā papa o loko |
| Hōʻike lima | ʻO Colight, OLEC | 1 | Ka hōʻike lima no nā ʻāpana liʻiliʻi / prototypes |
| ʻIke ʻana o I/L AOI | ʻO Orbotech | 6 | Ka ʻike ʻana i nā hemahema AOI papa o loko |
| Ke Kahua Hana Hou ʻo V-Smart | ʻO Orbotech | 5 | Hōʻoia/hana hou lima no nā hemahema AOI |
| ʻO I/L AOI Spiron | ʻO Orbotech | 3 | AOI papa kūloko i hoʻohui ʻia + loiloi |
| I/L AOI Hoʻoulu | ʻO Orbotech | 1 | AOI papa kūloko kiʻekiʻe |
| OPE (Punch papa-loko) | LPKF, Schmoll, Mitsubishi | 2 | Mea hana/punch no ke kākau inoa lamination |
Paʻi — Lamination & Brown Oxide
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| ʻOkika ʻeleʻele Bondfilm Horizontal | ChuangKe, DengTai | 2 | Ka ʻāʻī ʻana o ka ʻili ma mua o ka lamination |
| Paʻi Kuʻuna (2 Wela + 1 Anu) | HuoQuan | 2 | Lamination |
| Paʻi Uila (ADARA 48 / 73) | CEDATE (ʻĪkālia) | 4 | Lamination pololei |
| Hoʻohui Wela RBM (Hoʻoheheʻe Wela) | HuoQuan; MuNuo | 4+2, 12 | Kōkua kahe ʻana o ka resin |
| Hoʻonohonoho ʻakomi/lima (Stacker) | CEDATE (ʻĪkālia) | 4 | Hoʻonohonoho ʻana o ka lamination |
| Mea ʻoki kaʻa PP | ʻO ZhengYe | 4 | ʻOki ʻana i ka hoʻomākaukau ʻana o PP |
| ʻEli ʻana i ke kukuna X (Mea Hana) | DeLiFu; HaoShuo | 4 | Ka hoʻopaʻa inoa a me ka ʻeli ʻana i ka pahuhopu |
| Nānā ʻana i ke kukuna X | ʻAisida | 2 | Ka hōʻoia hoʻopaʻa inoa ma hope o ka paʻi ʻana |
RF — Rigid-Flex Lamination & Flex Core
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Paʻi Regal-Flex | — | 10 | Lamination paʻa-flex |
| PLASMA (no Regal-Flex) | — | 2 | Hoʻoulu ʻana i ka ʻili no ka hoʻopili flex |
| Mea Hoʻomaʻemaʻe Papa Kila | — | 2 | Nā papa lamination maʻemaʻe |
| ʻOki ʻana i ka laser UV | — | 2 | ʻOki ʻana i ka outline/coverlay flex |
| Mea ʻoki Flex-Core | — | 2 | ʻOki ʻana i ke kumu flex |
| ʻUmu Kū pololei | — | 2 | Hoʻomoʻa/hoʻōla ʻana i ka Flex |
| Laminator ʻAno Lahilahi | — | 2 | Lamination ʻili maloʻo lahilahi |
ʻEli — Mekanika & Laser
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| ʻŌwili Laser (5Z00U / ML605GTW5) | Mitsubishi | 20 | ʻEli laser Microvia |
| Nā wili mīkini ʻeono-wili | Hitachi; LongZe; DongTai; DaLiang | 150+ | ʻEli wikiwiki |
| Nā ʻŌwili Mekanika ʻElua-spindle | XueLong; HuaJian; DaLiang | 8 | Hoʻohālike a me ka ʻeli ʻana i ka ʻāpana liʻiliʻi |
| Mea Nānā Kūlana Hole (CPK) | MACHVISION | 2 | Ka nānā ʻana i ke kau inoa ʻana o ka wili |
| Mea wili/mea hoʻomaʻemaʻe ʻili akomi | ChengZhong (CDZ550) | 12 | Hoʻomākaukau ʻana i ka ʻili a me ka hoʻokahe ʻana |
Ke ala ʻana
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Mīkini Hoʻokele Alanui | ʻO YOWSUN | 12 | Ke kuhikuhi ʻana i ka ʻikepili pilikino |
| Mīkini Beveling | — | 4 | Ke kuhi ʻana o ka lihi |
| Mīkini Kuʻi | — | 6 | Wehe ʻana i ka panela |
Hoʻāʻo Uila (ET)
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Mea hoʻāʻo Probe lele | ATG | 6 | Hoʻomau uila a me ka hoʻāʻo hoʻokaʻawale |
| Mea hoʻāʻo moe o nā kui | — | 10 | Hoʻāʻo hana nui |
Nānā ʻIke Hope Loa (FV)
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Nā Kikowaena Nānā Maka | I loko o ka hale | 40 | QC huahana hope loa |
| Nā Mea Hoʻonui | — | 20 | Nānā ʻana i nā hiʻohiʻona maikaʻi |
Lumi Kiʻiʻoniʻoni
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Mea Hoʻolālā Kiʻi Laser | ʻO Orbotech | 2 | Ka hoʻopuka kiʻiʻoniʻoni |
| Keʻena Mālama Kiʻiʻoniʻoni | — | 5 | Ka lawelawe ʻana i ka ʻiliʻili palekana |
FPC (PCB hiki ke hoʻololi ʻia)
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| ʻO ka Laminator Coverlay | Hitachi | 3 | Ka hoʻopili ʻana o ka uhi FPC |
| Mīkini ʻoki PI | — | 2 | ʻOki ʻana i ka polyimide |
| ʻEli Laser no FPC | — | 2 | ʻEli Microvia no ka flex |
QA (Hōʻoia Kūlana / Keʻena Hoʻokolohua)
| Inoa Pelekania | Mea kūʻai aku | Ka nui | Kumu |
|---|---|---|---|
| Nā ʻōnaehana ana 2D/3D | OPTEK; ZhengYe | 1 (2D), 1 (kiʻi aunoa) | Nānā ʻana i ke ana |
| Mea Hoʻāʻo Impedance (CITS800S2) | Polar | 1 | Ana ʻana o ka impedance |
| Mānoanoa o ka uhi ʻana o ka X-ray | ʻO ZhengYe | 1 | Mānoanoa o ka pāpale |
| Mea ho'āʻo haumia ion | ʻO ZhengYe | 1 | Hoʻāʻo maʻemaʻe (ionic) |
| Keʻena ʻEhu Paʻakai | — | 1 | Hoʻāʻo kū'ē i ka palaho |
| Keʻena Hoʻohoka Wera | — | 1 | Hilinaʻi (haʻalulu mahana) |
| Microscope Metallographic | ʻOlumepa | 1 | Ka nānā ʻana i ka ʻāpana kea |