| Mea | PCB paʻa (HDI) | PCB hiki ke hoʻololi ʻia | PCB paʻa-Flex |
| Papa Nui Loa | 2-68L | 12L | 68L |
| Ka palena iki o ka papa o loko/ka hakahaka | 1.4/1.4mil | 2/2miliona | 2/2miliona |
| Kaha/Kahi o waho o ka papa | 1.4/1.4mil | 3/3mili | 3/3mili |
| Papa Kūloko Max Copper | 6oz | 2oz | 6oz |
| ʻO ke keleawe Max Max o waho | 6oz | 3oz | 6oz |
| ʻEli Mekanika Min | 0.15mm/6mil | 0.15mm | 0.15mm |
| ʻEli Laser Min | 0.05mm/3mil | 0.05mm | 0.05mm |
| Ka Lākiō ʻAoʻao Kiʻekiʻe (ʻEli Mekanika) | 20:1 | / | 20:1 |
| Ka Lāki ʻAoʻao Kiʻekiʻe (ʻEli Laser) | 1:1 | 1:1 | 1:1 |
| Hoʻonohonoho ʻana i waena o nā papa | +/-0.254mm (1mil) | ±0.05mm | ±0.05mm |
| Ka Hoʻomanawanui PTH | ±0.075mm | ±0.075mm | ±0.075mm |
| Ka Hoʻomanawanui NPTH | ±0.05mm | ±0.05mm | ±0.05mm |
| Ka Hoʻomanawanui Countersink | +0.15mm | ±0.15mm | ±0.15mm |
| Mānoanoa o ka Papa | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Ka hoʻomanawanui ʻana o ka mānoanoa o ka papa ( |
±0.1mm | ±0.05mm | ±0.1mm |
| Ka hoʻomanawanui ʻana o ka mānoanoa o ka papa (≥1.Omm) | ±8% | / | ±10% |
| Ka nui o ka papa liʻiliʻi loa | 10*10mm | 5*5mm | 10*10mm |
| Ka nui o ka papa kiʻekiʻe loa | 1200mm * 750mm | 500*1200mm | 500*500mm |
| Hoʻonohonoho ʻana i ka hoʻolālā | +/-0.075mm (3mil) | ±0.05mm | ±0.1mm |
| ʻO kaʻu BGA | 0.125mm (5mil) | 7 miliona | 7 miliona |
| Kaʻu SMT | 0.177*0.254mm (7*10mil) | 7*10miliona | 7*10miliona |
| Ka Hoʻomaʻemaʻe ʻana o ka Mask Solder Min | 1.5mili | 2 miliona | 1.5mili |
| ʻO kaʻu Solder Mask Dam | 3 miliona | 3 miliona | 3 miliona |
| Kaʻao | Keʻokeʻo, ʻEleʻele, ʻUlaʻula, Melemele | Keʻokeʻo, ʻEleʻele, ʻUlaʻula, Melemele | Keʻokeʻo, ʻEleʻele, ʻUlaʻula, Melemele |
| Ka laulā/kiʻekiʻe o ka moʻolelo liʻiliʻi loa | 4/23mili | 4/23mili | 4/23mili |
| ʻO ka Min Bending Radius (Papa Hoʻokahi) | / | 3-6 x Mānoanoa o ka Papa | 3-7 x Mānoanoa o ka Papa Flexbile |
| Min Bending Radius (Papa ʻaoʻao pālua) | / | 6-10 x Mānoanoa o ka Papa | 6-11 x Mānoanoa o ka Papa Flexbile |
| ʻO ka Min Bending Radius (Papa Multilayer) | / | 10-15 x Mānoanoa o ka Papa | 10-16 x Mānoanoa o ka Papa Flexbile |
| ʻO ka Radius Kulou Min (Kulou Dynamic) | / | 20-40 x Mānoanoa o ka Papa | 20-40 × Mānoanoa o ka Papa |
| Ka laulā o ka fillet strain | / | 1.5+0.5mm | 1.5+0.5mm |
| Kakaka a me ka Milo | 0.005 | / | 0.0005 |
| Ka hoʻomanawanui Impedance | Hoʻokahi-Hoʻopau: ±5Ω(≤50Ω)，±7%(>50Ω) | Hoʻokahi-Hoʻopau: ±5Ω(≤50Ω),±10%(>50Ω) | Hoʻokahi-Hoʻopau: ±5Ω(≤50Ω), ±10%(>50Ω) |
| Ka hoʻomanawanui Impedance | ʻOkoʻa: ±5Ω(≤50Ω)，±7%(>50Ω) | ʻOkoʻa: ±5Ω(≤50Ω),±10%(>50Ω) | ʻOkoʻa: ±5Ω(≤50Ω), ±10%(>50Ω) |
| Pale Maka Solder | ʻŌmaʻomaʻo, ʻEleʻele, Polū, ʻUlaʻula, ʻŌmaʻomaʻo Matt, Melemele, Keʻokeʻo, Poni | Pale Maka Solder ʻŌmaʻomaʻo/PI ʻEleʻele/PI Melemele | ʻŌmaʻomaʻo, ʻEleʻele, Polū, ʻUlaʻula, ʻŌmaʻomaʻo Matt |
| Hoʻopau ʻili | Ka uhi gula uila, ENIG, Ka uhi gula paʻa, Manamana lima gula, Kāla hoʻoluʻu, Tin hoʻoluʻu, HASL LF, OSP, ENEPIG, Ka uhi gula palupalu | Ka uhi gula uila, ENIG, Ka uhi gula paʻa, Manamana lima gula, Kāla hoʻoluʻu, Tin hoʻoluʻu, OSP, ENEPIG, Ka uhi gula palupalu | ʻO ka uhi gula uila, ENIG, Ka uhi gula paʻa, Manamana lima gula, Kāleka hoʻoluʻu, Tin Immersio, HASL LF, OSP, ENEPIG, Ka uhi gula palupalu |
| Kaʻina Hana Kūikawā | Kanu ʻia/makapō ma o, ʻanuʻu ʻanuʻu, nui loa, kanu ʻia ke kū'ē/mana, kaomi hui ʻia, RF, manamana gula, ʻano N+N, keleawe mānoanoa, ʻeli hope, HDI (5+2N+5) | manamana lima gula, lamination, mea hoʻopili alakaʻi, ʻili pale, dome metala | Kanu ʻia/makapō ma o, ʻanuʻu ʻanuʻu, nui loa, kū'ē/mana kanu ʻia, kaomi hui ʻia, RF, manamana gula, ʻano N+N, keleawe mānoanoa, ʻeli hope |
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