KA HIKI KE HUI ʻIA E KA PCB
ʻO SMT, ka inoa piha ʻo ia ka ʻenehana hoʻopaʻa ʻili. ʻO SMT kahi ala e hoʻopaʻa ai i nā ʻāpana a i ʻole nā ʻāpana ma luna o nā papa. Ma muli o ka hopena maikaʻi a me ka pono kiʻekiʻe, ua lilo ʻo SMT i ke ala mua i hoʻohana ʻia i ke kaʻina hana o ka ʻākoakoa PCB.
heluhelu hou aku 
nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku 
KA HIKI KE HUI ʻIA E KA BGA
ʻO ka ʻākoakoa BGA e pili ana i ke kaʻina hana o ke kau ʻana i kahi Ball Grid Array (BGA) ma luna o kahi PCB me ka hoʻohana ʻana i ke ʻano hana soldering reflow. ʻO BGA kahi ʻāpana i kau ʻia ma luna e hoʻohana ana i kahi ʻano o nā pōpō solder no ka hoʻopili uila. Ke hele ka papa kaapuni ma o kahi umu solder reflow, heheʻe kēia mau pōpō solder, e hana ana i nā pilina uila.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku nā wili drywall phosphating ʻeleʻele
Hāʻawi nā wili i kekahi mau pono ma mua o nā ʻano hoʻopaʻa ʻē aʻe. ʻAʻole e like me nā kui, hāʻawi nā wili i kahi paʻa paʻa a paʻa hoʻi, ʻoiai lākou e hana i kā lākou kaula ponoʻī i ka wā e hoʻokomo ʻia ai i loko o kahi mea. Hōʻoia kēia kaula e noho paʻa ana ka wili ma kahi, e hōʻemi ana i ka pilikia o ka wehe ʻana a i ʻole ka hemo ʻana i ka hala ʻana o ka manawa. Eia kekahi, hiki ke wehe maʻalahi ʻia a hoʻololi ʻia nā wili me ka ʻole o ka hōʻino ʻana i ka mea, e lilo ana lākou i koho kūpono no nā pilina manawa pōkole a hiki ke hoʻololi ʻia.
heluhelu hou aku Ka hiki ke hoʻākoakoa PCB
ʻO SMT, ka inoa piha ʻo ia ka ʻenehana hoʻopaʻa ʻili. ʻO SMT kahi ala e hoʻopaʻa ai i nā ʻāpana a i ʻole nā ʻāpana ma luna o nā papa. Ma muli o ka hopena maikaʻi a me ka pono kiʻekiʻe, ua lilo ʻo SMT i ke ala mua i hoʻohana ʻia i ke kaʻina hana o ka ʻākoakoa PCB.
Nā pono o ka ʻākoakoa SMT
1. Liʻiliʻi ka nui a me ka māmā
ʻO ka hoʻohana ʻana i ka ʻenehana SMT e hōʻuluʻulu pololei i nā ʻāpana ma luna o ka papa e kōkua i ka hōʻemi ʻana i ka nui holoʻokoʻa a me ke kaumaha o nā PCB. ʻAe kēia ʻano hōʻuluʻulu iā mākou e kau i nā ʻāpana hou aʻe i kahi ākea i kaupalena ʻia, hiki ke hoʻokō i nā hoʻolālā liʻiliʻi a me ka hana maikaʻi aʻe.
2. Hilinaʻi kiʻekiʻe
Ma hope o ka hōʻoia ʻana o ka prototype, ua aneane hana ʻakomi ʻia ke kaʻina hana hōʻuluʻulu SMT holoʻokoʻa me nā mīkini kikoʻī, e hōʻemi ana i nā hewa i hiki ke hana ʻia e ka hana lima. Mahalo i ka automation, hōʻoia ka ʻenehana SMT i ka hilinaʻi a me ke kūlike o nā PCB.
3. Mālama kālā
Hoʻokō pinepine ʻia ka ʻākoakoa SMT ma o nā mīkini hana aunoa. ʻOiai ke kiʻekiʻe o ke kumukūʻai hoʻokomo o nā mīkini, kōkua nā mīkini hana aunoa i ka hōʻemi ʻana i nā ʻanuʻu lima i ka wā o nā kaʻina hana SMT, kahi e hoʻomaikaʻi nui ai i ka pono hana a hoʻohaʻahaʻa i nā kumukūʻai hana i ka wā lōʻihi. A he emi nā mea i hoʻohana ʻia ma mua o ka ʻākoakoa ma o ka lua, a e emi pū ke kumukūʻai.
| Ka hiki ke hana SMT: 19,000,000 helu/lā | |
| Nā Lako Hoʻāʻo | ʻO ka mea ʻike ʻole luku X-RAY, ʻO ka mea ʻike ʻatikala mua, A0I, mea ʻike ICT, BGA Rework Instrument |
| Ka wikiwiki o ke kau ʻana | 0.036 S/pcs (Kūlana Maikaʻi Loa) |
| Nā ʻĀpana Kikoʻī. | Pūʻolo liʻiliʻi hiki ke hoʻopili ʻia |
| Ka pololei o nā lako hana haʻahaʻa loa | |
| Ka pololei o ka ʻāpana IC | |
| Nā kikoʻī PCB i kau ʻia. | Ka nui o ka substrate |
| Mānoanoa o ka substrate | |
| Ka helu hoʻokuʻu | 1.Impedance Capacitance Ratio: 0.3% |
| 2.IC me ka ʻole o ke kiki ʻana | |
| ʻAno Papa | POP/PCB maʻamau/FPC/PCB Rigid-Flex/PCB i hoʻokumu ʻia me ka metala |
| Ka Mana o kēlā me kēia lā DIP | |
| Ka laina hoʻokomo DIP | 50,000 helu/lā |
| Laina hoʻopili pou DIP | 20,000 helu/lā |
| Laina hoʻāʻo DIP | 50,000pcs PCBA/lā |
| Ka hiki ke hana i nā lako SMT nui | ||
| Mīkini | Pae | Palena |
| Mea paʻi GKG GLS | Paʻi PCB | 50x50mm~610x510mm |
| pololei o ka paʻi ʻana | ±0.018mm | |
| Ka nui o ka mōlina | 420x520mm-737x737mm | |
| ka laulā o ka mānoanoa o ka PCB | 0.4-6mm | |
| Mīkini hoʻohuihui hoʻohui | Sila hoʻoili PCB | 50x50mm~400x360mm |
| Wehe i ka wili | Sila hoʻoili PCB | 50x50mm~400x360mm |
| YAMAHA YSM20R | inā e lawe ana i 1 papa | L50xW50mm -L810xW490mm |
| Ka wikiwiki kumumanaʻo SMD | 95000CPH (0.027 s/chip) | |
| Pae ʻākoakoa | 0201(mm)-45*45mm ke kiʻekiʻe o ka hoʻopaʻa ʻana i nā ʻāpana: ≤15mm | |
| Pololei o ka ʻākoakoa ʻana | CHIP+0.035mmCpk ≥1.0 | |
| Ka nui o nā ʻāpana | 140 mau ʻano (ʻōwili 8mm) | |
| YAMAHA YS24 | inā e lawe ana i 1 papa | L50xW50mm -L700xW460mm |
| Ka wikiwiki kumumanaʻo SMD | 72,000CPH (0.05 s/chip) | |
| Pae ʻākoakoa | 0201(mm)-32*mm ke kiʻekiʻe o ka hoʻopaʻa ʻana o ka ʻāpana: 6.5mm | |
| Pololei o ka ʻākoakoa ʻana | ±0.05mm, ±0.03mm | |
| Ka nui o nā ʻāpana | 120ʻano (ʻōwili 8mm) | |
| YAMAHA YSM10 | inā e lawe ana i 1 papa | L50xW50mm ~L510xW460mm |
| Ka wikiwiki kumumanaʻo SMD | 46000CPH (0.078 s/chip) | |
| Pae ʻākoakoa | 0201(mm)-45*mm ke kiʻekiʻe o ka hoʻopaʻa ʻana o ka ʻāpana: 15mm | |
| Pololei o ka ʻākoakoa ʻana | ±0.035mm Cpk ≥1.0 | |
| Ka nui o nā ʻāpana | 48 ʻano (8mm reel) / 15 ʻano o nā pā IC aunoa | |
| JT TEA-1000 | Hiki ke hoʻololi ʻia kēlā me kēia ala pālua | Hiki ke hoʻololi ʻia ke ala hoʻokahi/papa hana W50 ~ 270mm W50 * W450mm |
| Ke kiʻekiʻe o nā ʻāpana ma ka PCB | luna/lalo 25mm | |
| Ka wikiwiki o ka mea hoʻoili | 300~2000mm/kekona | |
| ʻO ALeader ALD7727D AOI ma ka pūnaewele | Hoʻonā/Lawelawe ʻike/Wikiwiki | Koho: 7um/pikela FOV: 28.62mmx21.00mm Maʻamau: 15um pikela FOV: 61.44mmx45.00mm |
| Ka ʻike ʻana i ka wikiwiki | ||
| ʻŌnaehana code bar | ka ʻike ʻakomi ʻana i nā code bar (code bar a i ʻole QR code) | |
| Ka laulā o ka nui o ka PCB | 50x50mm (minimum) ~ 510x300mm (max) | |
| 1 ala i hoʻopaʻa ʻia | Ua paʻa ke ala 1, hiki ke hoʻololi ʻia ke ala 2/3/4; ʻo ka nui liʻiliʻi loa ma waena o ke ala 2 a me 3 he 95mm; ʻo ka nui kiʻekiʻe loa ma waena o ke ala 1 a me 4 he 700mm. | |
| Laina hoʻokahi | ʻO ka laulā o ke ala hele wāwae kiʻekiʻe loa he 550mm. Ala hele wāwae pālua: ʻo ka laulā o ke ala hele wāwae pālua kiʻekiʻe loa he 300mm (ka laulā hiki ke ana ʻia); | |
| Ka laulā o ka mānoanoa o ka PCB | 0.2mm-5mm | |
| Ka ʻokoʻa PCB ma waena o luna a me lalo | ʻAoʻao luna PCB: 30mm / ʻAoʻao lalo PCB: 60mm | |
| 3D SPI SINIC-TEK | ʻŌnaehana code bar | ka ʻike ʻakomi ʻana i nā code bar (code bar a i ʻole QR code) |
| Ka laulā o ka nui o ka PCB | 50x50mm (minimum) ~ 630x590mm (max) | |
| Pololei | 1μm, kiʻekiʻe: 0.37um | |
| Ka hana hou ʻana | 1um (4sigma) | |
| Ka wikiwiki o ke kahua ʻike maka | 0.3s/kahua ʻike maka | |
| Ka manawa ʻike kiko kuhikuhi | 0.5s/kiko | |
| Kiʻekiʻe loa o ka ʻike ʻana | ±550um ~ 1200μm | |
| ʻO ke kiʻekiʻe ana o ka PCB warping | ±3.5mm ~ ±5mm | |
| Ka mamao palena iki o ka papa | 100um (ma muli o kahi pad soler me ke kiʻekiʻe o 1500um) | |
| Ka nui hoʻāʻo haʻahaʻa loa | huinahā 150um, pōʻai 200um | |
| Ke kiʻekiʻe o ka ʻāpana ma ka PCB | luna/lalo 40mm | |
| Mānoanoa PCB | 0.4~7mm | |
| Mea ʻike X-Ray Unicomp 7900MAX | ʻAno paipu kukui | ʻano i hoʻopuni ʻia |
| Ka uila o ka paipu | 90kV | |
| Mana hoʻopuka kiʻekiʻe loa | 8W | |
| Ka nui o ke kālele ʻana | 5μm | |
| Mea ʻike | FPD wehewehe kiʻekiʻe | |
| Ka nui o ka pikela | ||
| Ka nui o ka ʻike pono | 130*130[mm] | |
| ʻO ka matrix pikela | 1536*1536[pikselo] | |
| Ka wikiwiki o ke kiʻi | 20fps | |
| Hoʻonui ʻōnaehana | 600X | |
| Ke kūlana hoʻokele | Hiki ke ʻimi koke i nā kiʻi kino | |
| Ana ʻakomi | Hiki ke ana ponoʻī i nā pehu i loko o nā mea uila i hoʻopili ʻia e like me BGA & QFN | |
| ʻIke ʻakomi CNC | Kākoʻo i ka hoʻohui kiko hoʻokahi a me ka matrix, hana koke i nā papahana a nānā iā lākou | |
| Hoʻonui geometric | 300 mau manawa | |
| Nā mea hana ana like ʻole | Kākoʻo i nā ana geometric e like me ka mamao, ke kihi, ke anawaena, ka polygon, a pēlā aku | |
| Hiki ke ʻike i nā hāpana ma kahi kihi 70 degere | Loaʻa i ka ʻōnaehana ka hoʻonui ʻana a hiki i ka 6,000 | |
| Ka ʻike ʻana i ka BGA | Hoʻonui nui ʻia, kiʻi maopopo aʻe, a maʻalahi hoʻi e ʻike i nā hui solder BGA a me nā māwae tin | |
| Kahua | Hiki ke hoʻonoho i nā kuhikuhi X, Y a me Z; Ke kuhikuhi ʻana o nā ʻōmole X-ray a me nā mea ʻike X-ray | |
He aha ka ʻAhahui BGA?
ʻO ka ʻākoakoa BGA e pili ana i ke kaʻina hana o ke kau ʻana i kahi Ball Grid Array (BGA) ma luna o kahi PCB me ka hoʻohana ʻana i ke ʻano hana soldering reflow. ʻO BGA kahi ʻāpana i kau ʻia ma luna e hoʻohana ana i kahi ʻano o nā pōpō solder no ka hoʻopili uila. Ke hele ka papa kaapuni ma o kahi umu solder reflow, heheʻe kēia mau pōpō solder, e hana ana i nā pilina uila.
Ka wehewehe ʻana o BGA
BGA: Pūʻulu Māka Pōpō
Ka Hoʻokaʻawale ʻana o BGA
PBGA: BGA palakika i hoʻopuni ʻia me ka palakika
CBGA: BGA no ka ʻōpala BGA keramika
CCGA: Kolume keramika BGA kia keramika
BGA i hoʻopili ʻia ma ke ʻano
TBGA: lipine BGA me ke kolamu maka poepoe
Nā ʻanuʻu o ka ʻAha BGA
ʻO ke kaʻina hana hōʻuluʻulu BGA e pili ana i kēia mau ʻanuʻu:
Hoʻomākaukau PCB: Hoʻomākaukau ʻia ka PCB ma ka hoʻopili ʻana i ka solder paste i nā pads kahi e kau ʻia ai ka BGA. ʻO ka solder paste kahi hui ʻana o nā ʻāpana alloy solder a me ka flux, e kōkua ana i ke kaʻina hana soldering.
Ke kau ʻana o nā BGA: ʻO nā BGA, nona ka chip kaapuni i hoʻohui ʻia me nā pōpō solder ma lalo, ua kau ʻia ma luna o ka PCB i hoʻomākaukau ʻia. Hana pinepine ʻia kēia me ka hoʻohana ʻana i nā mīkini pick-and-place automated a i ʻole nā lako ʻākoakoa ʻē aʻe.
Hoʻopili Hou ʻana: A laila e hoʻouna ʻia ka PCB i hōʻuluʻulu ʻia me nā BGA i kau ʻia ma o ka umu reflow. Hoʻomehana ka umu reflow i ka PCB i kahi mahana kikoʻī e hoʻoheheʻe ai i ka hoʻopili solder, e hoʻoulu ai i nā pōpō solder o nā BGA e reflow a hoʻokumu i nā pilina uila me nā pads PCB.
Hoʻomaʻalili a me ka Nānā ʻana: Ma hope o ke kaʻina hana reflow solder, hoʻomaʻalili ʻia ka PCB e hoʻopaʻa i nā hui solder. A laila nānā ʻia no kekahi mau hemahema, e like me ke kuhi hewa ʻana, nā pōkole, a i ʻole nā pilina hāmama. Hiki ke hoʻohana ʻia ka nānā ʻana o ka optical automated (AOI) a i ʻole ka nānā ʻana o X-ray no kēia kumu.
Nā Kaʻina Hana Lua: Ma muli o nā koi kikoʻī, hiki ke hana ʻia nā kaʻina hana hou e like me ka hoʻomaʻemaʻe, ka hoʻāʻo ʻana, a me ka uhi ʻana conformal ma hope o ka hui ʻana o BGA e hōʻoia i ka hilinaʻi a me ka maikaʻi o ka huahana i hoʻopau ʻia.
Nā Pōmaikaʻi o ka ʻAha BGA
Pūʻulu Makaʻaha Pōpō BGA
ʻEBGA 680L
LBGA 160L
PBGA 217L Plastic Ball Grid Array
SBGA 192L
TSBGA 680L
CLCC
CNR
ʻO ka Pūʻulu Grid Pin Ceramic CPGA
Pūʻolo Inline Pālua DIP
ʻAoʻao DIP
FBGA
1. Kapuahi liʻiliʻi
ʻO ka ʻōpala BGA he ʻāpana, nā mea hoʻopili, kahi substrate lahilahi, a me kahi uhi encapsulation. He kakaikahi nā ʻāpana i hōʻike ʻia a he liʻiliʻi ka helu o nā pine o ka pūʻolo. Hiki ke haʻahaʻa ke kiʻekiʻe holoʻokoʻa o ka ʻāpana ma ka PCB i 1.2 millimeters.
2. Paʻa
He paʻa loa ka ʻōpala BGA. ʻAʻole e like me QFP me ka pitch 20mil, ʻaʻohe pine o BGA e hiki ke kūlou a haki paha. Ma keʻano laulā, pono ka wehe ʻana o BGA i ka hoʻohana ʻana i kahi kahua hana hou BGA ma nā mahana kiʻekiʻe.
3. Hoʻohaʻahaʻa ka inductance parasitic a me ka capacitance
Me nā pine pōkole a me ke kiʻekiʻe haʻahaʻa o ka ʻākoakoa, hōʻike ka ʻōpala BGA i ka inductance parasitic haʻahaʻa a me ka capacitance, e hopena ana i ka hana uila maikaʻi loa.
4. Hoʻonui ʻia ka wahi mālama
Ke hoʻohālikelike ʻia me nā ʻano ʻōpala ʻē aʻe, hoʻokahi hapakolu wale nō o ka nui o ka ʻōpala BGA a ma kahi o 1.2 manawa ka nui o ka ʻāpana chip. Hiki i nā huahana hoʻomanaʻo a me nā huahana hana e hoʻohana ana i ka ʻōpala BGA ke hoʻokō i ka piʻi ʻana o ka hiki ke mālama a me ka wikiwiki o ka hana ma mua o 2.1 manawa.
5. Kūlana kiʻekiʻe
Ma muli o ka hoʻolōʻihi pololei ʻana o nā pine mai ke kikowaena o ka chip i loko o ka pahu BGA, ua hoʻopōkole maikaʻi ʻia nā ala hoʻoili no nā hōʻailona like ʻole, e hōʻemi ana i ka attenuation hōʻailona a hoʻomaikaʻi i ka wikiwiki o ka pane a me nā hiki ke pale i ke komo ʻana. Hoʻonui kēia i ke kūpaʻa o ka huahana.
6. Hoʻopuehu maikaʻi i ka wela
Hāʻawi ʻo BGA i ka hana hoʻopuehu wela maikaʻi loa, me ka mahana o ka ʻāpana e hoʻokokoke ana i ka mahana ambient i ka wā o ka hana.
7. Kūpono no ka hana hou ʻana
Ua hoʻonohonoho pono ʻia nā pine o ka ʻūpā BGA ma lalo, e maʻalahi ai ka loaʻa ʻana o nā wahi i hōʻino ʻia no ka wehe ʻana. Hoʻomaʻalahi kēia i ka hana hou ʻana o nā ʻāpana BGA.
8. Ka pale ʻana i ka haunaele uea
ʻAe ka ʻōpala BGA i ke kau ʻana i nā pine mana a me ka honua he nui ma ke kikowaena, me nā pine I/O i kau ʻia ma ka periphery. Hiki ke hana ʻia ka pre-routing ma ka substrate BGA, e pale ana i ka uea chaotic o nā pine I/O.
Nā hiki ke hoʻākoakoa ʻo RichPCBA BGA
He mea hana kaulana ʻo RICHPCBA no ka hana ʻana i nā PCB a me ka ʻākoakoa PCB. ʻO ka lawelawe ʻākoakoa BGA kekahi o nā ʻano lawelawe he nui a mākou e hāʻawi aku nei. Hiki iā PCBWay ke hāʻawi iā ʻoe i ka ʻākoakoa BGA kiʻekiʻe a me ke kumukūʻai kūpono no kāu mau PCB. ʻO ka pitch liʻiliʻi no ka ʻākoakoa BGA hiki iā mākou ke hoʻokipa he 0.25mm 0.3mm.
Ma ke ʻano he mea lawelawe PCB me 20 mau makahiki o ka ʻike ma ka hana ʻana, ka hana ʻana a me ka hoʻākoakoa ʻana o PCB, he waiwai ko RICHPCBA. Inā he koi no ka hoʻākoakoa BGA, e ʻoluʻolu e hoʻokaʻaʻike mai iā mākou!