Zithini ii-vias ezingaboniyo nezingcwatyiweyo?
Ii-vias ezingaboniyo: Xa icala elinye kuphela lee-vias likumaleko wangaphandle we-PCB, zibizwa ngokuba zii-vias ezingaboniyo.
Ii-vias ezingcwatywe: Xa amacala omabini ee-vias engcwatywe kumaleko wangaphakathi we-PCB, zibizwa ngokuba zii-vias ezingcwatywe.
Zenziwa njani ii-vias ezingaboniyo nezingcwatyiweyo?
Ezi ndlela zintathu zilandelayo zingenza ii-vias ezingaboniyo nezingcwatyiweyo:
Ukubhola ngoomatshini okunobunzulu obungaguqukiyo
Ukugrumba ngokulandelelana kunye nokugrumba
Naluphi na ulwelo lwe-lamination kunye nokugrumba
Yintoni ubumfama ngenkqubo yokuvelisa?
Okokuqala, sithetha nge-laser drill blind thrill ...
1) gqibezela zonke iileya zangaphakathi kuqala;
2) faka iileya ezimbini ze-prepreg kunye nephepha lobhedu kwiileya zangaphakathi zebhodi ye-PCB esele zigqityiwe;
3) gqobhoza ubunzulu obulawulwayo nge-laser kwi-PCB.
Nceda uqaphele ukuba ukuchaneka kubaluleke kakhulu kubantu abangaboniyo ngokusebenzisa i-in pad.
Ngokuphathelele i-mechanical drill blind via holes, sithatha ii-PCB ezineeleya ezi-4 kunye nee-blind vias kumaleko woku-1 ukuya kumaleko wesi-2 umzekelo, inkqubo ngolu hlobo lulandelayo:
1) velisa iileya 1 kunye ne-2 njenge-PCB eqhelekileyo eneeleya 2, ngoko ke kuya kubakho ukubhola kwiileya 1 ukuya kwi-2;
2) dibanisa iibhodi ezimbini eziphambili ukuze sifumane i-PCB enezintlu ezi-4, size sigqobhoze i-plating ngemingxunya;
3) xa i-PCB igqityiwe, ufumana i-PTH kwiileya ezi-1 ukuya kwezi-4 kunye nee-blind vias kwiileya ezi-1 ukuya kwezi-2.
Zithini iingenelo zokusebenzisa ii-vias ezingaboniyo nezingcwatyiweyo?
Iingenelo zokusebenzisa i-blind kunye ne-billed zichazwe ngezantsi:
Ukunciphisa ubungakanani kunye nobunzima bePCB
Ukunciphisa inani leeleya
Ukunciphisa iindleko zokuvelisa iintlobo ezahlukeneyo ze-PCB ukususela ekudibaniseni imisebenzi emininzi
Ukuphucula ukuhambelana kwe-electromagnetic
Ukwandisa iimpawu zeemveliso ze-elektroniki
Ukwenza umsebenzi woyilo ube lula kwaye ukhawuleze
Ziziphi iingxaki zokusebenzisa ii-vias ezingabonakaliyo nezingcwatyiweyo?
Ukunciphisa ubukhulu bee-vias ezingaboniyo nezingcwatyiweyo kubeka iimfuno eziphezulu kwimveliso ye-PCB.
Kufuneka iinjineli ezinamava kakhulu ukuze ziyilwe ii-PCB ezingabonakaliyo nezingcwatyiweyo.
Kunzima ngakumbi ukuhlanganisa ii-PCB ze-vias ezingabonakaliyo nezingcwatyiweyo kuba zihlala zine-pads ezincinci, ezifana nee-BGA pads.
Iyintoni i-aspect ratio eqhelekileyo ye-blind via aspect?
Kwibhodi ye-laser drill blind vias, umlinganiselo oqhelekileyo we-blind via aspect yi-1:1.
Yintoni engcwatywe nge?
Ii-vias ezingcwatywe kwi-PCB zidlula kwimingxunya ephakathi kweengqimba zangaphakathi. Sithatha i-blind enezingqimba ezi-6/engcwatywe ngebhodi yesekethe umzekelo: ii-blind vias can zidlula kwimingxunya evela kwingqimba 2-3, 2-4, 2-5, 3-4, 3-5 kunye no-4-5.
Ungcwatywe nge-vi vs u-blind via
Ii-Blind via kunye ne-buried via zisetyenziswa kakhulu ii-HDI PCB, zihlala zikhona kwiibhodi zesekethe eziprintiweyo zobuchwepheshe obuphezulu ngaxeshanye. Kodwa ziintlobo ezahlukeneyo zee-via.