Zeziphi iintlobo zee-IC Substrate PCBs ezikhoyo?
Ngokwezinto ezisetyenzisiweyo, ingahlulwahlulwa ibe: Iqinile, iguquguquka, i-ceramic, i-polyimide, i-BT, njl.
Ngokweteknoloji, inokwahlulwahlulwa ibe zii: BGA, CSP, FC, MCM, njl.
Zithini ii-Ic Substrate Applications?
Umenzi we-BGA substrates
Iphathwa ngesandla, Iselfowuni, Inethiwekhi
Iifowuni ezihlakaniphileyo, izixhobo ze-elektroniki zabathengi kunye ne-DTV
I-CPU, i-GPU kunye neChipset yesicelo sePC
I-CPU, i-GPU ye-Game Console (umz. i-X-Box, i-PS3, i-Wii…)
Umlawuli weChip yeDTV, Umlawuli weChip yeBlu-Ray
Ukusetyenziswa kweziseko zophuhliso (umz. Inethiwekhi, Isitishi seSiseko…)
Ii-ASICs ze-ASIC
Ibhendi yeDijithali
Ulawulo lwaMandla
Iprosesa yeMizobo
Umlawuli weMultimedia
Iprosesa yesicelo
Ikhadi lememori leemveliso ze-3C (umz. iMobile/DSC/PDA/GPS/Pocket PC/Notebook)
I-CPU yokusebenza okuphezulu
Izixhobo ze-GPU, ze-ASIC
Idesktop/Iseva
Uthungelwano
Zithini ii-CSP Package Substrate Application?
Imemori, i-analog, ii-ASIC, iLogic, izixhobo zeRF,
Incwadi yamanqaku, Incwadi engaphantsi, iiKhompyutha zoBuqu,
I-GPS, i-PDA, inkqubo yonxibelelwano engenazingcingo
Zithini iingenelo zokusebenzisa i-PCB ye-substrate yesekethe edibeneyo?
Ii-substrates zesekethe ezidibeneyo Ii-PCB zibonelela ngokusebenza kakuhle kombane kunye nendawo encinci yebhodi, okuvumela ukudityaniswa kwee-IC ezininzi kwibhodi yesekethe enye. Ii-substrates zesekethe ezidibeneyo Ii-PCB zikwanokusebenza okuphuculweyo kobushushu ngenxa ye-dielectric constant yazo ephantsi, nto leyo ekhokelela ekuthembekeni okungcono kunye nemijikelo yobomi obude. Ii-substrates zesekethe ezidibeneyo Ii-PCB zineempawu zombane ezibalaseleyo, kubandakanya iimpawu ze-frequency ephezulu, kunye nokuncitshiswa okuncinci kwesignali kunye namanqanaba okuthetha.
Zithini iingxaki zokusebenzisa i-IC Substrate PCB?
Ii-substrates ze-IC zifuna ubuchule obukhulu kunye nobuchule bokwenza, njengoko ziqulathe iileya ezininzi zeentambo ezintsonkothileyo, izinto, kunye neepakeji ze-IC.
Ukongeza, ii-substrates ze-IC zihlala zibiza kakhulu ukuzenza ngenxa yobunzima bazo.
Okokugqibela, ii-substrates ze-IC nazo zisengozini yokusilela ngenxa yobukhulu bazo obuncinci kunye neentambo ezintsonkothileyo.
Yintoni umahluko phakathi kwe-IC Substrate PCB kunye ne-PCB eqhelekileyo?
Ii-PCB ze-IC substrate zahlukile kwii-PCB eziqhelekileyo kuba zenzelwe ngokukodwa ukuxhasa ii-IC chips kunye nezinto ezipakishwe yi-IC. Ngokuphathelele imveliso ye-PCB, ukwenziwa kwe-IC Substrate kunzima kakhulu kune-PCB eqhelekileyo ngenxa ye-high density drill and trace yayo.
Ngaba i-IC Substrate PCB ingasetyenziselwa ukwenza iiprototyping?
Ewe, i-PCB ye-substrate yephakheji ye-IC ingasetyenziselwa ukwenza i-prototyping.
Zithini iiPBGA Package Substrate Application?
I-ASIC, i-DSP kunye neMemori, ii-Gate Arrays,
Iiprosesa ezincinci / Abalawuli / Imizobo
IiChipsets zePC kunye neePeripherals
Iiprosesa zeMifanekiso
Iibhokisi zeSeti ephezulu
IiConsoles zoMdlalo
I-Gigabit Ethernet
Ziziphi iingxaki ekuvelisweni kwebhodi ye-IC substrate?
Eyona ngxaki inkulu yi-drill enoxinano oluphezulu kakhulu efana nee-vias ezingaboniyo ze-0.1 mm kunye nee-vias ezingcwatywe, i-stacked micro via ixhaphake kakhulu kwimveliso ye-PCBs ye-substrate yesekethe edibeneyo. Kwaye indawo yokulandelela kunye nobubanzi bunokuba mncinci njenge-0.025 mm. Ngoko ke kubaluleke kakhulu ukufumana iifektri ze-IC substrate ezithembekileyo zohlobo olunjalo lweebhodi zesekethe eziprintiweyo.