Ungayihlula njani phakathi kwe-through hole, blind via kunye ne-hripped via kwi-PCB?
Kwinkqubo yoyilo kunye neyokuvelisa i-PCB, sidla ngokusebenzisa i-through hole, blind/buryed via ukuhlangabezana neemfuno zoyilo kunye neemfuno zokusebenza. Ngoko ke yintoni umahluko phakathi kwazo?
1.Umngxuma odlulayo
Umngxuma odlulayo luhlobo olulula noluqhelekileyo lwemingxunya kwi-PCB. Yenziwa ngokugrumba umngxuma kwi-PCB (umaleko ongaphezulu ukuya kosezantsi) uze uyizalise ngezinto eziqhuba umbane (ezifana nobhedu). Idla ngokusetyenziswa ukuqhagamshela iisekethe kwiileya ezahlukeneyo ukubonelela ngoqhagamshelo lombane kunye nenkxaso yoomatshini.
Ixabiso le-through hole liphantsi kakhulu, kodwa kuyilo lwebhodi yesekethe ye-HDI enoxinano oluphezulu, njengoko indawo yebhodi yesekethe ixabiseke kakhulu, uyilo lwe-through hole luchitha imali eninzi.
2. Ayiboni
I-Blind via ifana nomngxuma odlulayo, kodwa i-blind via idlula kancinci kwi-PCB. Ikhokelela umaleko ophezulu ngaphakathi ngaphandle kokungena kwi-PCB. Ihlala isetyenziselwa ukudibanisa iisekethe phakathi komphezulu kunye neeleya zangaphakathi, ifanelekile kakhulu kwi-PCB eneeleya ezininzi enesithuba esincinci. Inkqubo yokuvelisa i-blind via iyinkimbinkimbi. Ukunganikeli ingqalelo kubunzulu bokugrumba kunokubangela ubunzima ekufakeni i-electroplating kwimingxunya. Ke ngoko, iileya zesekethe ekufuneka ziqhagamshelwe zinokugrunjwa kuqala xa zingamaleya esekethe ahlukeneyo, kwaye emva koko zonke zibotshelelwe. Nangona kunjalo, ukusebenzisa le ndlela kufuna izixhobo zokubeka kunye nokulungelelanisa ngokuchanekileyo. Ke ngoko, i-blind via ibiza kakhulu kune-through hole.
3. Wangcwatywa nge
Ii-vias ezingcwatywe zifihlwe ngaphakathi komaleko ngamnye we-PCB kwaye zidibanisa iileya ezimbini okanye ngaphezulu zangaphakathi ze-PCB. Azibonakali kumphezulu nakumaleya asezantsi. Zihlala zifanelekile kwiibhodi zesekethe ze-HDI ezinoxinano olukhulu ukwandisa indawo esebenzisekayo kwezinye iileya zesekethe. Ukuvelisa ii-vias ezingcwatywe, imisebenzi yokugrumba inokwenziwa kuphela kumaleya esekethe nganye nganye kuqala. Umaleko wangaphakathi kuqala ubotshelelwe kancinci uze emva koko ufakwe ngombane, uze emva koko zonke zibotshelelwe. Ngenxa yokuba inkqubo yokusebenza inzima ngakumbi kune-original through hole kunye ne-blind via, ixabiso libiza kakhulu.
Iingcebiso:
Ixabiso: Ngokudlula emngxunyeni ＜Impumputhe nge ＜Ingcwatywe nge
Ukusetyenziswa kwendawo: ngokusebenzisa umngxuma Ubunzima bokusebenza: ngokusebenzisa umngxuma I-Richpcba ibonelela abathengi ngeenkonzo ze-PCB + SMT ezinexabiso eliphantsi, umgangatho ophezulu, kunye nokuhanjiswa okukhawulezayo, iisampulu ezipheleleyo + imveliso enkulu, kwaye isombulula iimfuno zokwenziwa ngokwezifiso ze-PCBA zabathengi. Ezi mveliso zisetyenziswa kakhulu kubukrelekrele bokwenziwa, izixhobo, izixhobo zonxibelelwano, ukugcinwa kwamandla e-photovoltaic, izixhobo ze-elektroniki zeemoto kunye nezinye iinkalo.
