Umahluko ophambili phakathi kwe-HDI kunye ne-PCB eqhelekileyo - ixesha elitsha lokunxibelelana okuphezulu
I-HDI (i-High Density Interconnection) yibhodi yesekethe encinci eyenzelwe abasebenzisi abanomthamo omncinci. Xa kuthelekiswa nee-PCB eziqhelekileyo, uphawu olubalulekileyo lwe-HDI kukuxinana kwayo okuphezulu kweentambo. Umahluko phakathi kwezi zimbini ubonakala kakhulu kwezi nkalo zine zilandelayo.
1. I-HDI incinci kwaye ilula ngobunzima
Iibhodi ze-HDI zenziwe ngeebhodi zemveli ezinamacala amabini njengeebhodi eziphambili kwaye zigqunywe nge-continuous lamination. Olu hlobo lwebhodi yesekethe eyenziwe nge-continuous lamination ikwabizwa ngokuba yi-Build-up Multilayer board (BUM). Xa kuthelekiswa neebhodi zesekethe zemveli, ii-HDI zinezibonelelo zokuba "zilula, zincinci, zimfutshane, kwaye zincinci".
Unxibelelwano lombane phakathi kweengqimba zebhodi ye-HDI lwenziwa ngokusebenzisa umngxuma oqhubayo, ogqunywe/ongaboniyo ngokusebenzisa uqhagamshelo. Ulwakhiwo lwayo lwahlukile kwiibhodi zesekethe eziqhelekileyo ezinezingqimba ezininzi. Inani elikhulu lee-vias ezingcwatywe nge-micro/blind zisetyenziswa kwiibhodi ze-HDI. I-HDI isebenzisa ukubhola ngqo nge-laser, ngelixa i-PCB eqhelekileyo idla ngokusebenzisa ukubhola ngoomatshini, ngoko ke inani leengqimba kunye nomlinganiselo womda zihlala zincitshiswa.
2. Inkqubo yokuvelisa i-HDI motherboard
Uxinano oluphezulu lweebhodi ze-HDI lubonakala kakhulu kuxinano lwemingxuma, imigca, ii-pad, kunye nobukhulu be-interlayer.
Umngxuma omncinci: Ibhodi ye-HDI ineedizayini zemingxuma emincinci efana ne-blind via, ebonakala kakhulu kwitekhnoloji yokwenza imingxunya emincinci enobubanzi obungaphantsi kwe-150um kunye neemfuno eziphezulu ngokweendleko, ukusebenza kakuhle kwemveliso kunye nolawulo lokuchaneka kwendawo yemingxuma. Kukho imingxunya edlula kuphela kwiibhodi zesekethe zemveli ezinamaleya amaninzi kwaye akukho mingxunya mincinci efihliweyo/engaboniyo.
Ukuphuculwa kobubanzi/isithuba somgca: Oku kubonakala kakhulu kwiimfuno ezingqongqo ngakumbi zeziphene zomgca kunye noburhabaxa bomphezulu womgca. Ngokubanzi, ububanzi/isithuba somgca asiyi kudlula i-76.2um.
Uxinano oluphezulu lwephedi: uxinano loqhagamshelwano lwe-soldering lungaphezulu kwe-50/cm2
Ukuncitshiswa kobukhulu be-dielectric: Oku kubonakala kakhulu kwindlela yobukhulu be-dielectric obuphakathi kwamaleya ukuya kwi-80um nangaphantsi, kwaye iimfuno zokufana kobukhulu ziya zisiba nzima ngakumbi, ngakumbi kwiibhodi ezinoxinano oluphezulu kunye nezinto zokupakisha ezine-impedance control ephawulekayo.
3. Ukusebenza kombane kwebhodi ye-HDI kungcono
I-HDI ayivumeli nje kuphela ukuba uyilo lweemveliso zokugqibela lube luncinci ngakumbi, kodwa ikwahlangabezana nemigangatho ephezulu yokusebenza kakuhle kwe-elektroniki.
Ukwanda koxinano lwe-HDI kuvumela amandla esignali aphuculweyo kwaye kuphucula ukuthembeka. Ukongeza, iibhodi ze-HDI zinophuculo olungcono kuphazamiseko lwe-RF, ukuphazamiseka kwamaza e-electromagnetic, ukukhutshwa kwe-electrostatic, ukuhanjiswa kobushushu, njl. I-HDI ikwasebenzisa itekhnoloji yokulawula inkqubo yesignali yedijithali epheleleyo (i-DSP) kunye netekhnoloji ezininzi ezinelungelo elilodwa lomenzi, ezinokuguquguquka komthwalo opheleleyo kunye nokukwazi ukugqithisa ixesha elifutshane.
Iibhodi ze-4.HDI zinemfuno ephezulu kakhulu yokufakelwa kwe-burryvia.
Nokuba bubungakanani bebhodi okanye ukusebenza kombane, i-HDI ingcono kune-PCB eqhelekileyo. Yonke ingqekembe inamacala amabini. Elinye icala le-HDI kukuba njengoko yenziwe njenge-PCB ephezulu, umda wayo wokwenziwa kunye nobunzima benkqubo buphezulu kakhulu kunobo be-PCB eziqhelekileyo. Kukwakho nemiba emininzi ekufuneka iqwalaselwe ngexesha lokuveliswa - ingakumbi ngokugqunywa ngeplagi.
Okwangoku, indawo ebuhlungu kunye nobunzima bokwenziwa kwe-HDI bufihlwe ngokufaka iplagi. Ukuba i-HDI efihlwe nge-via ayifakwanga kakuhle, kuya kubakho iingxaki ezinkulu zomgangatho, kubandakanya imiphetho yebhodi engalinganiyo, ubukhulu be-dielectric obungalinganiyo, kunye neepads ezinemingxuma, njl.njl.
Umphezulu webhodi awulingani kwaye imigca ayithe tye, nto leyo ebangela ukuba kubekho imbonakalo yolwandle kwiindawo ezixineneyo, nto leyo enokubangela iziphene ezifana nezikhewu zemigca kunye nokuqhawuka kwayo.
Impedance yeempawu nayo iya kutshintshatshintsha ngenxa yobukhulu obungalinganiyo be-dielectric, nto leyo ebangela ukungazinzi kwesignali.
Ukungalingani kwephedi yokunyibilikisa kuya kukhokelela kumgangatho ophantsi wokupakishwa okulandelayo kunye nokulahleka okubangelwa zizinto.
Ngoko ke, ayingabo bonke abavelisi be-PCB abanobuchule namandla okwenza umsebenzi olungileyo kwi-HDI. Ngamava angaphezu kweminyaka engama-20 kwimveliso ye-PCB, i-RICHPCBA ibonelela ngetekhnoloji yamva nje yokwenziwa kwebhodi yesekethe eprintiweyo kunye nemigangatho ephezulu yomgangatho kushishino lwe-elektroniki. Iimveliso eziquka: iileya ze-1-68 PCB, i-HDI, i-multilayer PCB, i-FPC, i-rigid pcb, i-flex pcb, i-ceramic pcb, i-high frequency pcb, njl. Khetha i-RICHPCBA njengomvelisi wakho we-PCB othembekileyo eTshayina.
