I-DPC Ceramic Substrate: ukhetho olufanelekileyo lokupakisha iitships zeLiDAR zeemoto

Umsebenzi weLiDAR (Ukufumanisa Ukukhanya kunye nokuHlela) kukukhupha imiqondiso yelaser ye-infrared kunye nokuthelekisa imiqondiso ebonakalisiweyo emva kokudibana nemiqobo kunye nemiqondiso ekhutshiweyo, ukuze kufunyanwe ulwazi olufana nendawo, umgama, ukuqhelaniswa, isantya, isimo sengqondo, kunye nokuma kwethagethi. Le teknoloji inokufezekisa ukuphepha imiqobo okanye ukuhamba ngokuzimela. Njengesenzi esichanekileyo, iLiDAR ithathwa ngokubanzi njengesitshixo sokufezekisa ukuqhuba ngokuzimela kwinqanaba eliphezulu, kwaye ukubaluleka kwayo kuya kusanda.

Imithombo yokukhanya kwelaser ivelele phakathi kwezinto eziphambili zeLiDAR yeemoto. Okwangoku, umthombo wokukhanya we-VCSEL (vertical cavity surface emitting laser) uye waba lukhetho olukhethwayo lwe-hybrid solid-state LiDAR kunye ne-flash LiDAR kwizithuthi ngenxa yeendleko zayo eziphantsi zokuvelisa, ukuthembeka okuphezulu, i-engile encinci yokwahlukana, kunye nokuhlanganiswa okulula kwe-2D. I-chip ye-VCSEL inokufikelela kumgama omde wokufumanisa, ukuchaneka okuphezulu kokuqonda, kwaye ihambelane nemigangatho engqongqo yokhuseleko lwamehlo kwiLiDAR yeemoto ye-hybrid solid-state. Ukongeza, zenza iFlash LiDAR ifikelele kwimbono eguquguqukayo nebanzi, kwaye ineenzuzo ezinkulu zeendleko.

Ii-substrates ze-ceramic ziye zaba zizinto ezifanelekileyo zokupakisha iitships kwizicelo ze-LiDAR zeemoto.

Ii-substrates ze-ceramic ze-DPC (Direct Copper Plating) zine-thermal conductivity ephezulu, i-insulation ephezulu, ukuchaneka kwesekethe ephezulu, ukugudama okuphezulu komphezulu, kunye ne-thermal expansion coefficient ehambelana ne-chip. Zikwabonelela ngokunxibelelana ngokuthe nkqo ukuhlangabezana neemfuno zokupakisha ze-VCSEL.

1. Ukusasaza ubushushu okugqwesileyo

I-DPC ceramic substrate inonxibelelwano oluthe nkqo, yenze imijelo yangaphakathi ezimeleyo yokuqhuba. Ngenxa yokuba iiceramics zizigqubuthelo kunye neziqhubi zobushushu, zinokufikelela ekuhlukaniseni i-thermoelectric kwaye zisombulule ngempumelelo ingxaki yokusasazwa kobushushu beetships zeVCSEL.

2. Ukuthembeka okuphezulu

Ubuninzi bamandla eetships zeVCSEL buphezulu kakhulu, kwaye ukungalingani kokwandiswa kobushushu phakathi kwetships kunye ne-substrate kunokubangela iingxaki zoxinzelelo. I-coefficient yokwandiswa kobushushu ye-substrates ze-ceramic iyahambelana kakhulu neVCSEL. Ukongeza, ii-substrates ze-ceramic ze-DPC zinokudibanisa iifreyimu zesinyithi kunye ne-substrates ze-ceramic ukwenza umngxuma ovaliweyo, onesakhiwo esincinci, ongenamaleko odibeneyo ophakathi, kunye nokuqina komoya okuphezulu.

3. Uqhagamshelo oluthe nkqo

Ukupakisha i-VCSEL kufuna ukufakwa kwelensi ngaphezulu kwetship, ngoko ke kufuneka kubekwe umngxuma we-3D kwi-substrate. Ii-substrate ze-DPC ceramic zinenzuzo yokunxibelelana ngokuthe nkqo kunye nokuthembeka okuphezulu, ezifanelekileyo kwi-vertical eutectic bonding.

Kwimeko yophuhliso lweemoto ezikrelekrele, izixhobo zeseramikhi zidlala indima ebaluleke ngakumbi kuphuhliso olukrelekrele lweemoto ezintsha zamandla. Njengesiseko se-teknoloji yonke, uphuhliso oluqhubekayo kwiteknoloji yezinto ezibonakalayo lubalulekile ekuxhaseni uphuhliso olusebenzayo lweshishini lonke.