Mmebi na Ngwọta Usoro SMT Ndị A Na-ahụkarị: Nduzi zuru oke maka Mgbakọ PCB A Pụrụ Ịtụkwasị Obi
Ihe Mere Njikwa Mmebi Usoro SMT Ji Dị Mkpa
Teknụzụ Elu Elu (SMT) chọrọ ezigbo ọkwa micron na ntinye pasta, itinye ihe mejupụtara ya, na njikwa okpomọkụ. Mgbanwe dị iche iche na nhazi stencil, olu pasta solder, ma ọ bụ profaịlụ reflow nwere ike ibute ntụpọ ndị na-emebi ntụkwasị obi ngwaahịa - ọkachasị na nhazi dị elu, ọsọ dị elu, ma ọ bụ ọtụtụ oyi akwa. Maka ngwa ụgbọelu, ụgbọ ala, ahụike, na telecom, ntụpọ SMT a na-achọpụtaghị nwere ike ibute ọdịda ubi dị egwu. Ntuziaka a na-akọwa ntụpọ SMT a na-ahụkarị, ihe kpatara ha, na ngwọta injinia.
1. Ịtụ nkume n'ili (Mmetụta Manhattan)
Nkọwa: Akụkụ nke mgbawa (dịka ọmụmaatụ, 0201/0402) na-ebuli elu n'ụzọ kwụ ọtọ mgbe a na-emegharị ya, na-ekewapụ ya na otu pad.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Oke mpịachi solder na-adịghị mma n'etiti pad abụọ
- ·Oke okpomọkụ a na-anaghị agbanwe agbanwe (dịka ọmụmaatụ, obosara akara na-adabaghị nhata ma ọ bụ ihe e ji ọla kọpa wụsa)
- ·Oke ọsọ mgbagharị mmiri (>2°C/sekọnd)
- ·Nhazi oghere stencil nke anaghị emezi nke ọma
- ·Peeji nke pad na-emebi iwu nhazi IPC-7351
Ngwọta Injinia:
- ·Nhazi pad/nsochi ndị na-agbanwe agbanwe kwa IPC-7351B ntuziaka
- ·Dakọọ nha/olu oghere stencil maka njedebe nke ihe mejupụtara ya
- ·Belata ọnụego reflow ramp ruo 1–2°C/sekọnd
- ·Tinye oke oghere (maka ≤01005 passives)
- ·Zere itinye ihe dị n'akụkụ nnukwu ụgbọelu ọla kọpa
2. Njikọ Solder
Nkọwa: Njikọ solder na-enweghị ebumnuche n'etiti ndị na-eduzi/pad ndị dị nso.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Oghere stencil buru ibu ma ọ bụ oke mado
- ·Enweghị ihe mkpuchi ihe mkpuchi solder zuru oke (
- ·Mwepụ mmado na-adịghị mma (dịka ọmụmaatụ, oke akụkụ stencil ezughi oke)
- ·Nhazi adịghị mma n'oge mbipụta stencil
Ngwọta Injinia:
- ·Mee mbelata oghere (dịka ọmụmaatụ, "ọkpụkpụ nkịta" maka QFPs, "ebe obibi" maka BGAs)
- ·Mee ka akụkụ oghere dịkwuo mma (≥1.5) na oke mpaghara (≥0.66)
- ·Dee ihe mkpuchi ihe mkpuchi solder obosara nke dam ≥0.025mm maka imewe dị mma
- ·Kwalite Nnyocha Mkpọta Ngwakọta 3D (SPI)
- ·Mee ka usoro nhicha stencil dị irè
3. Ihe na-agbaze ezughi oke (Nkwonkwo anaghị agba mmiri/oghere mepere emepe)
Nkọwa: Njikọ ígwè zuru oke n'ihi enweghị ihe na-eme ka ihe na-agbaze nke ọma.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Oke mado ezughi oke
- ·Profaịlụ mgbanwe mmiri na-adịghị mma (okpomọkụ kachasị elu ma ọ bụ TAL)
- ·Oxidation nke ihe mkpuchi/ihe mejupụtara
- ·Mkpọcha mado mgbe a na-ekpughe ya ogologo oge
Ngwọta Injinia:
- ·Nhazi mmegharị ọzọ: Oke okpomọkụ nke 240–245°C, 60–90s TAL
- ·Jiri Pịnye mado 4/5
- ·Kọwaa Mmecha otu/otu
- ·Gburugburu ebe obibi njikwa: 25±3°C, 40–60% RH
4. Mgbanwe/Nhazi nke Akụkụ
Nkọwa: Mbugharị akụkụ n'oge mmegharị ahụ.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Ngwakọta pasta na-ezughị ezu
- ·Nsogbu mkpọtụ/mkpọgharị conveyor
- ·Ike nozulu na-ezighi ezi/ịdị elu z
- ·PCB warpage dị nso na Tg
Ngwọta Injinia:
- ·Ike nke tack mado >500g/mm²
- ·Nhazi nke nhọrọ na ebe a na-ahọrọ: ≤30μm ziri ezi, ike 0.2–0.5N
- ·Jikwaa ọsọ fan na mkpọtụ ebuga
- ·Jiri FR-4 Tg170+ ma ọ bụ nkwado ngwaọrụ
5. Oghere Njikọta Solder
Nkọwa: Mkpọchi gas na-emepụta oghere n'ime nkwonkwo.
Ebe Ndị Dị Oke Ihe Ize Ndụ: Paadị okpomọkụ QFN, bọọlụ BGA, vias dị elu.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Mgbawa ọsọ ọsọ nke na-ejide ramp ngwa ngwa
- ·Mmiri dị na ihe ndị e ji eme MSL 2a+ emebeghị eme
- ·Via-in-pad na-enweghị mejupụta/mkpuchi
- ·Omume mmiri na-adịghị mma
Ngwọta Injinia:
- ·Ọkwa ịrị elu: 1.0–1.5°C/sekọnd
- ·Mee achịcha tupu oge eruo J-STD-033
- ·Via ndị e ji ihe kpuchie/kpuchie
- ·Jiri vacuum reflow ma ọ bụ obere voiding mado
6. Isi-n'ime-Ohiri Isi (HIP)
Nkọwa: Njikọ bọọlụ BGA na-etinye mana ọ naghị ejikọta ọnụ.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Enweghị nhazi nke Warpage
- ·Bọọlụ solder e tinyere oxidized
- ·TAL dị oke mkpụmkpụ
Ngwọta Injinia:
- ·BGAs e ji esi nri: 125°C/awa 12–24
- ·Jiri usoro mmiri na-agagharị nke nwere ọrụ ≥0.2%
- ·Gbatịa TAL ruo >90s, jiri X-ray nyochaa ya
- ·Mee ka nchịkọta dị mma maka njikwa agha
7. Solder Ball Splatter
Nkọwa: Bọọlụ ndị na-ere obere (
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Mgbago ike (>3°C/sekọnd)
- ·Alloy na-adịghị agbanwe agbanwe: ihe na-agbaze agbaze
- ·Mmetọ nke paịpụ
- ·Nrapado ihe mkpuchi solder adịghị ike
Ngwọta Injinia:
- ·Mkpọchi na-adịghị ọcha nke nwere resin kwụsiri ike
- ·Ọkwa ọkụ tupu oge eruo: 1.0–1.5°C/sekọnd ruo 150–180°C
- ·Tinye nhicha plasma
- ·Kọwaa ihe mkpuchi mkpuchi ahụ site na iji CTI> 175V
8. Ibuli/Mwepụ ihe e ji ebuli ihe
Nkọwa: Nkewa nke paịpụ site na ntọala PCB.
Ihe Ndị Na-akpata Nka na ụzụ:
- ·Usoro mmegharịgharị gabigara ókè
- ·Ihe dị ala nke CTE ma ọ bụ ihe Tg nke z-axis
- ·Mmiri mmiri
Ngwọta Injinia:
- ·Oke ruo ≤2 okirikiri okpomọkụ kwa pad
- ·Jiri ngwaọrụ nhazigharị nke thermocouple na-achịkwa
- ·PCBs e ji eme achịcha: 125°C/awa 4–8 (IPC-1601)
- ·Jiri laminates: Tg >170°C, Td >340°C
Mgbochi Mmebi SMT Sistemụ
- ·DFM: IPC-2581, IPC-7351B nlele ụkpụrụ ala
- ·Nnyocha: Nhazi SPI dị n'ime → AOI → AXI, profaịlụ oven KIC
- ·Ihe: Nnwale SLP kwa IPC-J-STD-033, MSL
- ·Ọzụzụ: Asambodo IPC-A-610H, IPC-7711/7721
Nweta SMT efu-nkwarụ na Ọṅụ zuru oke bara ụba
SMT a pụrụ ịtụkwasị obi chọrọ nkà nke mmekọrịta ihe na nhazi na nhazi ihe. Ọṅụ zuru oke bara ọgaranya, anyị na-enye PCBA dị oke mkpa site na:
- ·DFM E Ji Mee Ka Nhazi Ya Kachasị Mma: Nzaghachi oge na Valor NPI
- ·Nnyocha Kachasị Elu: SPI 3D, AOI nke AI na-enye, X-ray 5μm
- ·Mgbakọ Pụrụ Iche Dị Elu: μBGA (0.2mm), QFN void
- ·Nchọpụta: Ndekọ usoro ọmụmụ nke ọkwa ihe mejupụtara
Kpọtụrụ anyị maka nyocha DFM n'efu na nyocha usoro SMT.
