Ukukhiqizwa kwe-PCB kanye ne-PCBA
I-workshop
Hlola izindawo zethu zokukhiqiza zesimanje kanye nezinqubo zokukhiqiza ezithuthukisiwe
1
Ukukhiqizwa kwe-SMT
3
I-Plugin kanye Nokuhlanganiswa
4
Ukulungiselela Isitoreji
I-PCBA Uhlu Lwemishini Yokukhiqiza
Imishini ephelele ye-SMT, THT, yokucubungula ngemuva, yokuhlola, kanye nokuhlola yokukhiqiza nokuhlanganisa i-PCBA esezingeni eliphezulu.
Ngaphambi Kokukhiqizwa
| Inqubo | Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|---|
| Ukuhlaziywa kwe-DFM | Isofthiwe ye-DFM | I-Valor (Siemens), CAM350 | 2 | Hlaziya amafayela okuklama ngaphambi kokukhiqiza ukuze uvimbele izinkinga ezingaba khona |
| Ukubhaka Okunomswakama | Ikhabhinethi Yokugcina Umswakama | I-Shuttle, OK International | 4 | Susa umswakama futhi ugcine izingxenye ze-MSD |
I-SMT
| Inqubo | Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|---|
| Ukuphrinta kwe-Solder Paste | Iphrinta ye-Stencil | I-DESEN, i-DEK, i-EKRA, i-GKG | Abaneminyaka engu-16+ | Phrinta i-solder paste kuma-PCB pads |
| Ukuxuba i-Solder Paste | Isixubi Sokunamathisela I-Solder | I-Cencorp, i-Malcom | 4 | Hlanganisa i-solder paste ukuze ifane |
| Ukuhlanza I-Stencil | Umshini Wokuhlanza I-Stencil | I-SAKI, OK International | 8 | Ukuhlanza ngokuzenzakalelayo i-stencil ukuze kugwenywe ukuvaleka |
| Ukuhlolwa kwe-SPI | I-3D SPI | I-Koh Young, i-ViTrox, i-CyberOptics, i-OMRON | 16 | Ukuhlolwa kwe-3D kokujiya kwe-solder paste, ivolumu, indawo, ukuma |
| Ukubekwa Ngesivinini Esiphezulu | Isifaki Esisheshayo Esiphezulu | I-Yamaha, i-FUJI, i-Panasonic, i-Samsung | 16 | Ukubekwa okusheshayo kwezingxenye ezincane ezingasebenzi |
| Ukubekwa Kwemisebenzi Eminingi | Isifaki Semisebenzi Eminingi | I-Yamaha, i-Universal, i-Mycronic | 16 | Ukubekwa okunembile kwama-IC, ama-BGA, ama-QFP, izixhumi |
| Ukugoqa kabusha | Ihhavini Lokugeleza Kabusha | I-Heller, i-BTU, i-Vitronics Soltec, i-ERSA | 4 | Ukuncibilika kwe-solder paste ngejika lokushisa elilawulwayo |
| Ukuhlolwa kwe-AOI | I-AOI | I-OMRON, Koh Young, ViTrox, SAKI | 16 | Thola amaphutha ngemva kokugeleza kabusha (okungekho, okungalungile, i-polarity, itshe lethuna) |
I-THT
| Inqubo | Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|---|
| Ukufakwa Okuzenzakalelayo | Umshini Wokufaka Okuzenzakalelayo | I-Universal, i-Panasonic | 2 | Ukufakwa okuzenzakalelayo kwezingxenye ze-axial/radial |
| Ukushisela Amagagasi | Umshini Wokunamathisela Amagagasi | I-ERSA, UMBONO | 2 | Ukushiswa okukhulu kwezingxenye ezimbobo |
| Ukushisela Okukhethiwe | Umshini Wokunamathisela Okhethiwe | I-ERSA, iPillarhouse | 2 | Ukushisela okukhethiwe kwezindawo ezibucayi |
| Ukushiswa nge-Dip | Imbiza Yokushisela Ebhentshini | OK International | 2 | Ama-lead noma ama-pad ezingxenyeni ezifakwa ngaphambi kokufakwa |
Ngemva Kokucubungula
| Inqubo | Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|---|
| Ukuhlanza | Isihlanzi se-PCB (Esemgqeni/Iqoqo) | I-Zestron, i-Electrovert | 4 | Susa izinsalela zoketshezi kanye nokungcola |
| Ukugqoka Okuhlelekile | Umshini Wokumboza Ohlanganisiwe | Nordson ASYMTEK, PVA, Musashi | 8 | Vikela i-PCBA emvelweni |
| Ukukhipha | Umsabalalisi Woketshezi | Nordson ASYMTEK, I&J, Musashi | 8 | Ukugcwalisa okungaphansi, ukubhodwela, ukusabalalisa okunamathelayo |
Ukuhlolwa Nokusebenza Kabusha
| Inqubo | Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|---|
| Ukuhlolwa kwe-X-Ray | I-X-Ray (AXI) | I-Nordson DAGE, i-Yxlon, i-Comet | 4 | Hlola amajoyinti e-solder afihliwe (i-BGA, i-CSP) |
| Isiteshi Sokulungisa Kabusha | Isiteshi Sokulungisa Nokulungisa Kabusha | I-PACE, OK International | 8 | Ukulungiswa kwamabhodi anezinkinga ngesandla |
| Ukuvuselelwa kwe-BGA | Isiteshi Sokuvuselela i-BGA | I-PACE, OK International | 4 | Ukulungiswa kabusha kwe-BGA okukhethekile |
Ukuhlolwa
| Inqubo | Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|---|
| Ukuhlela | Umhleli we-IC | I-Xeltek, i-Needhams | 8 | I-firmware/isofthiwe yohlelo kuma-IC |
| I-ICT | I-ICT (Isivivinyo Esingaphakathi Kwesekethe) | I-Keysight, eTeradyne | 8 | Ukuhlolwa kwezinzipho zokuvuleka/izikhindi ezimfushane embhedeni |
| Ukuhlolwa Kokuhlola Okundizayo | Isivivinyo Sokuhlola Ukundiza | Okunjalo, i-SEICA | 8 | Ukuhlolwa kwe-probe ngaphandle kwemishini eyenziwe ngokwezifiso |
| Ukuhlolwa Kokusebenza | I-FCT | Kwenziwe ngezifiso | 4 | Lingisa indawo yokusebenza yangempela |
| Ukuhlolwa Kokushiswa | Irekhi Yokuhlola Ukushiswa Kwangaphakathi | Kwenziwe ngezifiso | Amasethi ama-2 | Ukuhlolwa kokuguga okunamandla kwesikhathi eside |

