Izinhlelo Zokuhlola ze-Smart PCBA: i-AOI, i-SPI, i-X-Ray, i-ICT kanye ne-FCT

1. Isingeniso

Njengoba imikhiqizo ye-elekthronikhi iguqukela ekuhlanganisweni okunobuningi obukhulu kanye nobunzima obukhulu, ukuhlolwa kwekhwalithi ye-PCBA kubhekene nezinselele ezikhulayo—ikakhulukazi ekuhlolweni kwe-micro-pitch kwezingxenye ze-0201 (0.6×0.3mm) kanye nokuhlolwa kwamajoyinti e-solder afihliwe kumaphakheji e-BGA/CSP. I-IPC-A-610H, ukukhiqiza kwesimanje kumele kugcine izinga lokukhubazeka lingaphansi kwama-DPPM angu-500. Lesi sihloko sichaza ukuhlaziywa okuhlelekile kwezinhlelo zokuhlola ezinamazinga amaningi, okuhlanganisa ukulawulwa kwenqubo, ubuchwepheshe bokuhlola obuhlakaniphile, kanye nokulandelela kwesikhathi sangempela.

2. Ukwakheka Kohlelo Lobuchwepheshe Bokuhlola

2.1 Umklamo Wezindawo Zokuhlola Ezisebenza Ngokugcwele

Uhlaka lokuhlola olunezigaba ezine luqinisekisa ukumbozwa kwekhwalithi ephelele:

• ·Ngaphambi Kwenqubo: I-3D SPI (±5μm) + AOI yokuqondanisa indawo
• ·Ngemuva Kokugeleza Kabusha: I-AOI enezinhlangothi ezimbili + i-3D X-Ray (ukulungiswa okungu-5μm)
• ·Ukuhlolwa Kukagesi: I-ICT (ukumbozwa ≥95%) + i-FCT
• ·Ukuhlolwa Kokugcina: Isampula yokuhlola ebhubhisayo ye-AVI +

2.2 Izinkomba Zokusebenza Eziyinhloko

• ·Isikhathi sokuqinisekiswa kwesihloko sokuqala: ≤imizuzu eyi-15 (uma kuqhathaniswa namahora ama-2 ngokwesiko)
• ·Izinga lokuphunyuka elifanele:
• ·Ukugcinwa kokulandelela idatha: iminyaka engu-≥10

3. Ukuhlaziywa Kwezobuchwepheshe Bokuhlola Okuyinhloko

3.1 Ukuqhathaniswa kobuchwepheshe bokuhlola okukhanya

3.2 Amakhono Okuhlola i-X-Ray

• ·Isithombe se-CT Tomographic: Ithola isilinganiso se-BGA void I-IPC-7095
• ·Ukucutshungulwa Kwesikhathi Sangempela: Ukucutshungulwa kwesithombe okungu-≥25fps
• ·Ukunemba Kokuhlukaniswa Kwamaphutha: >98% ngama-algorithms asebenzisa i-AI

4. Izinhlelo Zokuhlola Ugesi

4.1 Ukwakhiwa Kokuhlolwa Kwe-ICT

• ·Iphimbo lokuhlola elincane: ≥0.8mm
• ·Ububanzi be-voltage: 0–50V
• ·Ukunemba kokulinganisa: ±1% (ukumelana), ±2% (umthamo)

4.2 Izixazululo Zokuhlola ze-FCT

• ·Iziteshi ze-I/O: Isekela iziteshi ezingaphezu kuka-1000
• ·Ibanga Lokuvama: DC–6GHz
• ·Ukunemba Kokutholakala Kwephutha: ±5mm

5. Uhlelo Lokuphathwa Kwedatha Esezingeni Eliphezulu

5.1 Ideshibhodi Yokuqapha Yesikhathi Sangempela

• ·Ukuqapha isivuno esibukhoma (vuselela njalo ngemizuzwana eyi-1)
• ·Ukuhlaziywa kwemephu yokushisa engalungile
• ·Ukuboniswa kwe-OEE yemishini

5.2 Uhlelo Lokulandelela

• ·Ibhakhodi noma i-UID ehlukile yebhodi ngalinye
• ·Ukuxhumana kwedatha yenqubo ephelele
• ·Ukuhlanganiswa kwe-MES/QMS kulungile

6. Amacala Okusebenza Kwemboni

6.1 Izimoto Ezisebenza Ngogesi

• ·Kuqinisekiswe ngaphansi I-AEC-Q100
• ·Izinga lokuhluleka elingu-0km
• ·Ukuthobela imibiko ye-8D

6.2 Amadivayisi Ezokwelapha

• ·Ukuhambisana ne-ISO 13485 kwezobuchwepheshe bezokwelapha
• ·Ukuhlolwa okungu-100% kwezici eziyingozi kakhulu
• ·Ukuhlolwa kokuhlanza kanye nokuhambisana nemvelo

7. Ukuhlaziywa Kwezinzuzo

Ngokuvumelana ne Isikole Samabanga Aphezulu 2022, ukusetshenziswa kwezinhlelo zokuhlola ezihlakaniphile, ezinamazinga amaningi kuholela ku:

• ·30% ukwanda kwesivuno sokuqala
• ·40% ukuncishiswa kwezindleko ezihlobene nekhwalithi iyonke
• ·60% izikhalazo zamakhasimende ezimbalwa

8. Isifinyezo: Isikhathi Esisha Sokuhlolwa Okuhlakaniphile kwe-PCBA

• ·Uhlaka lokuhlola ubuchwepheshe obuningi (i-AOI + SPI + X-Ray + ICT/FCT)
• ·Ama-algorithms okwahlulela amaphutha ahlakaniphile asebenza nge-AI
• ·Ukulandelelwa kwekhwalithi yedijithali yenqubo ephelele kanye nokuhlanganiswa kwe-MES

Ngale ndlela ehlelekile, abakhiqizi bangafinyelela amazinga ekhwalithi ye-Six Sigma (), ukusetha izilinganiso ezintsha zokuthembeka kwe-PCBA yomhlaba wonke.

Izinkomba

1. 1.IPC-A-610H, 2020
2. 2. Izinqubo Zobuchwepheshe ze-SMTA, 2022
3. 3.AEC-Q100 Rev-H, 2014
4. 4.ISO 13485:2016
5. 5.IPC-7095D, 2021