High-Frequency Hybrid PCB with Half-Hole & Resin Plug | Optimized for High-Speed & RF Applications
Design and Product Features
Millimeter Circuit Board Features of PCB Products
This product is a high - frequency hybrid pressing PCB with half - hole, resin plug hole, and back - drilling features. It is panelized, consisting of 6 types of PCBs on one panel.
Material: Regular Substrates S1000 - 2M + High - frequency series FSD255, FR - 4, TG170
Number of Layers: 4L
Board Thickness: 0.508mm
Single Size: 61.05*92.89mm/6PCS
Surface Finish: ENIG
Outer Copper Thickness: 35um
Silkscreen Color: white (GTO, GBO)
Density of Mechanical Drilling Hole: 13W/㎡
Min Via Size: 0.18mm
Min Line Width/Space: 7/6mil
Aperture Ratio: 3mil
Pressing Times: 1 time
Drilling Times: 2 times
PN: B0490470A
Advantages of High - Frequency Hybrid Materials
Our PCB uses materials such as Regular Substrates S1000 - 2M, High - frequency series FSD255, FR - 4, and TG170. S1000 - 2M has excellent electrical performance and stability, FSD255 performs outstandingly in high - frequency signal transmission, FR - 4 provides reliable mechanical support, and TG170 ensures stable operation in high - temperature environments. The combination of these materials enables the PCB to effectively reduce signal loss in high - frequency applications and ensure stable signal transmission, meeting the requirements of various complex electronic devices.
The half - hole design brings unique advantages to the PCB. It allows components to be connected in a special way. For example, for some plug - in components that require mechanical fixation and electrical connection through holes, the half - hole can provide a more stable connection and reduce the risk of poor soldering. At the same time, the half - hole design can also optimize the space layout of the circuit board, enabling more functions in a limited space, improving the integration and practicality of the PCB, and facilitating the miniaturization and multi - functionality design of electronic products.
The resin plug hole process can effectively fill the vias, preventing problems such as solder balls and short - circuits during subsequent production processes. At the same time, the resin plug hole can also enhance the mechanical strength of the vias and improve the overall reliability of the PCB. The specially treated resin has good insulation performance, further ensuring stable signal transmission and avoiding signal leakage or interference at the vias, improving the performance of the PCB in high - frequency circuits.
Back - drilling technology is a major highlight of this PCB. By back - drilling, the redundant via stubs can be removed, reducing reflections and losses during signal transmission and improving signal integrity. In high - frequency circuits, the quality of the signal is of great importance. The back - drilling technology can effectively optimize the signal transmission path, ensuring the accuracy and stability of the signal, and making the PCB perform better in application scenarios such as high - speed data transmission and high - frequency communication.
Millimeter Circuit Board Performance Highlights
High - Speed Signal Transmission Ability
With advanced materials and a carefully designed circuit layout, this PCB can achieve high - speed signal transmission in a high - frequency environment. Its minimum line width/space reaches 7/6mil, and combined with high - precision manufacturing processes, it effectively reduces signal transmission delay and distortion. Whether in computer devices with extremely high requirements for data processing speed or communication base station devices with strict requirements for communication real - time performance, it can stably transmit signals and meet the needs of high - speed data interaction.
High Reliability
Every link, from material selection to the manufacturing process, is strictly controlled to ensure the high reliability of the PCB. Multiple pressing and drilling processes are carried out using high - precision equipment and strict quality inspection standards. After various environmental tests, such as high - and low - temperature tests, humidity tests, and vibration tests, the PCB can maintain stable performance under different environmental conditions, providing a solid guarantee for the long - term stable operation of electronic products.
High - Precision Manufacturing
Our production process can achieve a minimum via size of 0.18mm and a high drilling density of 13W/㎡, which reflects our high - precision level in the PCB manufacturing field. High - precision manufacturing can not only improve the integration of the PCB but also ensure the precise connection between various components, reducing performance problems caused by manufacturing errors and enhancing the overall quality and competitiveness of the product.
Why Choose Our High - Frequency Hybrid Pressing PCB?
Professional Technical Team
We have an experienced professional technical team with profound professional knowledge and rich practical experience in PCB design, material research and development, and manufacturing processes. Team members work closely together and constantly explore and innovate to provide personalized solutions according to customers' needs, ensuring that the product can meet customers' expectations in terms of performance and quality.
Customized Services
We can provide comprehensive customized services according to customers' different needs. Whether it's the size, number of layers, functional module design of the PCB, or material selection, surface treatment process, etc., we can tailor - make them for customers. We will communicate in depth with customers to understand the application scenarios and special requirements of their products and create the most suitable PCB solutions for customers to meet diverse market demands.
Strict Quality Control
We have established a complete quality control system. Every link, from raw material procurement to production processing and finished product inspection, undergoes strict quality inspection. Advanced testing equipment, such as automated optical inspection (AOI) and X - ray inspection, is used to comprehensively test the appearance, internal structure, and electrical performance of the PCB, ensuring that each PCB meets high - quality standards and providing customers with reliable products.
Millimeter Circuit Board Quality Assurance
Strict Raw Material Inspection
We conduct strict inspections on each batch of raw materials, including S1000 - 2M, FSD255, FR - 4, TG170, etc. We check whether their electrical properties, physical characteristics, and dimensional accuracy meet the product design requirements. Only the raw materials that pass the inspection can enter the production process, ensuring product quality from the source and avoiding product defects caused by raw material problems.
Comprehensive Production Process Monitoring
During the production process, we use an advanced production management system to monitor each production link in real - time. We strictly control key process parameters such as pressing, drilling, and circuit etching to ensure product consistency and stability. At the same time, we regularly maintain and calibrate production equipment to ensure its normal operation and improve production efficiency, thus guaranteeing the quality of the product.
Application Cases
Consumer Electronics Field
In a well - known brand's small smart wearable device, this PCB of ours plays a crucial role. As the device has extremely high requirements for size and performance, the 0.508mm thin design of this PCB meets its compact space needs. The half - hole design and high - precision circuit layout enable various tiny electronic components to be connected closely and stably, ensuring the stability of the device under high - frequency signal transmission. Through the resin plug hole and back - drilling technologies, signal interference is effectively reduced, making the device's Bluetooth communication and data processing functions more efficient and enhancing the user experience.
Complete Finished Product Testing
We conduct comprehensive and strict tests on each finished PCB, covering multiple aspects such as electrical performance testing, functional testing, and reliability testing. In the electrical performance testing, parameters such as line impedance and conductivity are accurately measured to ensure they meet the design standards. The functional testing simulates the actual usage scenarios to check whether each functional module on the PCB can work properly. The reliability testing includes high - temperature aging tests, low - temperature storage tests, and humidity - heat cycle tests. By simulating extreme environments, we evaluate the performance of the PCB under different conditions. Only the PCBs that pass all the tests are allowed to leave the factory, so as to provide customers with products of excellent quality and reliable performance.
Industrial Control Field
A large - scale industrial automation enterprise has adopted our PCB in its new automated production line control system. A large number of sensors, controllers, and actuators in the production line require reliable signal transmission and stable power supply. The high - frequency hybrid materials of this PCB can maintain stable electrical performance in a complex electromagnetic environment, effectively avoiding signal distortion. At the same time, its high reliability and high - precision manufacturing process ensure that the system can operate stably in a long - term and high - intensity industrial production environment, reducing equipment failures and maintenance costs and improving production efficiency.
Communication Equipment Field
In the radio - frequency module of a new 5G communication base station, our PCB demonstrates excellent performance. 5G communication has extremely high requirements for high - speed and stable signal transmission. The advanced materials and optimized design of this PCB enable it to achieve low - loss signal transmission in high - frequency bands. The back - drilling technology and precise impedance control further enhance signal integrity, ensuring stable communication between the base station and terminal devices. At the same time, its multi - layer design and high - density wiring meet the
Applications of the Four-Layer Gold-Plated Multifunction Board
The Four-Layer Gold-Plated Multifunction Board is a versatile and high-performance PCB designed for demanding applications across various industries. Below are ten detailed application areas where this board excels:
1.High-Frequency Communication Systems:
●Description: The board is ideal for high-frequency communication systems, such as RF (radio frequency) and microwave applications. Its high-frequency materials and precise impedance control ensure minimal signal loss and distortion.
●Applications: Wireless communication base stations, satellite communication systems, radar systems, and 5G infrastructure.
●Benefits:Ensures reliable signal transmission in high-frequency environments, making it suitable for critical communication networks.
2.High-Speed Data Transmission
●Description: The four-layer structure and gold-plated surface enable the board to handle high-speed signals with minimal loss or interference.
●Applications: Data centers, networking equipment, high-speed servers, and fiber-optic communication systems.
● Benefits: Supports high-speed data transfer rates, ensuring efficient and reliable performance in data-intensive environments.
3.Automotive Electronics
●Description: The board’s gold-plated surface provides excellent corrosion resistance, making it suitable for harsh automotive environments. Its high-frequency capabilities and precise impedance control are ideal for advanced automotive systems.
●Applications: Infotainment systems, advanced driver-assistance systems (ADAS), vehicle-to-everything (V2X) communication, and engine control units (ECUs).
● Benefits: Enhances the reliability and performance of automotive electronics, ensuring safety and connectivity in modern vehicles.
4.Industrial Control Systems：
●Description:The board’s robust design and specialized processes make it suitable for industrial control systems that require high-speed signal processing and durability.
●Applications: Programmable logic controllers (PLCs), industrial robots, motor drives, and factory automation systems.
●Benefits: Provides reliable performance in harsh industrial environments, ensuring efficient operation of control systems.
5.Medical Devices:
●Description:The board’s high precision and reliability make it ideal for medical devices that require accurate signal processing and data transmission.
●Applications: Medical imaging systems (CT, MRI, ultrasound), patient monitoring devices, and surgical robots.
●Benefits: Ensures high performance and reliability in critical healthcare applications, improving patient outcomes.
6.Aerospace and Defense：
●Description:The board’s ability to withstand extreme conditions and its high-frequency performance make it suitable for aerospace and defense applications.
●Applications: Avionics systems, satellite communication, radar systems, and unmanned aerial vehicles (UAVs).
●Benefits: Provides reliable performance in extreme environments, ensuring the success of mission-critical operations.
7.Consumer Electronics:
●Description:The board’s compact design and high-speed capabilities make it ideal for consumer electronics that require high performance in a small form factor.
●Applications: Smartphones, tablets, wearables, and smart home devices.
●Benefits: Enhances the functionality and reliability of consumer electronics, improving user experience.
8.IoT (Internet of Things) Devices:
●Description:The board’s ability to handle high-speed data and its durability make it suitable for IoT devices that require reliable connectivity and performance.
●Applications: Smart sensors, edge computing devices, and IoT gateways.
●Benefits: Ensures seamless connectivity and data processing in IoT networks, enabling smart solutions.
9.Research and Development:
●Description:The board’s robust design and high-frequency capabilities make it ideal for energy management systems that require efficient power distribution and monitoring.
●Applications: Smart grid systems, energy storage controllers, and solar inverters.
●Benefits:Enhances the efficiency and reliability of energy management systems, supporting sustainable energy solutions.
10.High-Speed Computing:
●Description:The board’s ability to handle high-speed signals and its precise impedance control make it suitable for high-performance computing applications.
●Applications: Servers, data centers, AI accelerators, and high-performance computing clusters.
●Benefits:Supports fast data processing and efficient operation in high-performance computing environments.
The Four-Layer Gold-Plated Multifunction Board is a high-performance PCB designed to meet the demands of complex and high-frequency applications. With its four-layer structure, gold-plated surface, and specialized processes, this board offers superior performance, reliability, and durability. Whether you're designing high-frequency communication systems, high-speed data transmission equipment, automotive electronics, or industrial control systems, the Four-Layer Gold-Plated Multifunction Board is an excellent choice that will meet your needs and exceed your expectations.