Explore our state-of-the-art manufacturing facilities and advanced production processes
Initial layer imaging
Inner layer inspection
Bonding oxide treatment
Material layering
Lamination process
Precision hole creation
Mechanical drilling
Plated through holes
Copper deposition
Outer layer imaging
Circuit formation
Selective etching
Outer layer inspection
Solder mask application
Silkscreen printing
ENIG, ENEPIG, Gold, HASL
Board contouring
Electrical testing
lmm Tin, lmm Silver, OSP
Final verification