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PCB & PCBA Manufacturing
Workshop

Explore our state-of-the-art manufacturing facilities and advanced production processes

PCB Production Process

IL Image

Initial layer imaging

1

I/L AOI

Inner layer inspection

2

B/Oxide

Bonding oxide treatment

3

Layup

Material layering

4

Press

Lamination process

5

Laser Drilling

Precision hole creation

6

Drilling

Mechanical drilling

7

PTH

Plated through holes

8

Panel Plating

Copper deposition

9

O/L lmage

Outer layer imaging

10

Pattern plating

Circuit formation

11

SES Etching

Selective etching

12

O/L AOI

Outer layer inspection

13

S/Mask

Solder mask application

14

Legend

Silkscreen printing

15

Surface Finish

ENIG, ENEPIG, Gold, HASL

16

Rout

Board contouring

17

ET

Electrical testing

18

Surface Finish

lmm Tin, lmm Silver, OSP

19

FV

Final verification

20
Quality Production
circuit board tester
PCB factory video
PCB Manufacturing Equipment List
PCB Intelligent Handling Robots1ui
01

PCB Intelligent Warehousing and PCBHandling Robots

Enhancing PCB Production Efficiency and Management Precision, Optimizing Material Management and Production Processes
PCB Inkjet Printing and Curing Processes13s
01

Optimization of PCB Inkjet Printing and Curing Processes

Enhancing Multilayer PCB Production Quality and Efficiency through Precise Parameter Adjustments and Equipment Maintenance
PCB Cleaningtml
01

PCB Cleaning &Finished PCB Cleaning Line

Integrated Bending and Warping Detection for Enhanced Cleaning Efficiency and Production Effectiveness
PCB Drillingux4
01

PCB Drilling

Drill through/blind holes on CCLs to establish connection between circuit layers and between devices and circuits.
PCB Pressingwfi
01

PCB Pressing

Chemically oxidize the surface of copper to generate a layer of oxide (brown cuprous oxide), which further increases the surface area to enhance bonding strength.
PCB Processing1y2
01

PCB Processing

Process the PCB into the shape required by the customer through routing, V-cut, die punching and bevelling.
Trace - LDI (Laser Direct Imaging) Exposure Machinegq4
01

Trace - LDI (Laser Direct Imaging) Exposure Machine

PCB Trace Manufacturing Process: Equipment, Techniques, and Key Considerations
Automated PCB Loading and Unloadingf6u
01

Automated PCB Loading and Unloading

To achieve automation and high-efficiency production, Shenzhen Rich Full Joy Electronics Co., Ltd. has introduced a Robotic PCB Handling System.
Via Filling Plating Linesdav
01

PCB Hole Copper Plating - Via Filling Plating Lines

The Role of Via Filling Plating Lines. Via filling plating lines are crucial in the PCB manufacturing process, ensuring the functionality and reliability of electronic devices.
Circuit Exposurei0n
01

Circuit Exposure  Ink Exposure  LDI exposure speed

In the production process of Printed Circuit Boards (PCBs), exposure is a crucial step.
Vacuum Etching Machinexfu
01

PCB Circuit Etching - Vacuum Etching Machine

The vacuum etching machine equipment uses chemical solutions to etch circuit patterns onto the PCB copper surface.
Resin Plugging - Vacuum Resin Plugging Machine21x
01

Plugging Process - Vacuum Resin Plugging Machine

The vacuum resin plugging process is essential in modern PCB manufacturing, particularly for multilayer boards, high-density interconnects (HDI), and rigid-flex boards.
PCB Cleaningrbn
01

PCB Cleaning &Finished PCB Cleaning Line

Integrated Bending and Warping Detection for Enhanced Cleaning Efficiency and Production Effectiveness
PCB Inkjet Printing and Curing Processesdxg
01

Optimization of PCB Inkjet Printing and Curing Processes

Enhancing Multilayer PCB Production Quality and Efficiency through Precise Parameter Adjustments and Equipment Maintenance"
PCB Intelligent Warehousing98q
01

PCB Intelligent Warehousing and PCBHandling Robots

Enhancing PCB Production Efficiency and Management Precision, Optimizing Material Management and Production Processes
PCB-1-gantry-plating-line
01

Cutting-Edge Plating Process for High-Performance PCBs

Discover how Rich Full Joy's advanced gantry-type plating line and pulse plating technology deliver unmatched reliability, micro-via quality, and IPC Class 3 performance for high-end PCBs.
pcb-2-Application-of-X-Ray Inspection
01

Application of X-Ray Inspection in High-Frequency PCB Quality Control: How to Identify Internal Defects with Precision

Discover how X-ray inspection ensures the quality of high-frequency PCBs by detecting internal defects like voids, short circuits, and delamination with precision.
PCB-3-micron-level-pcb-laser-drilling-0-1
01

Rich Full Joy Micron-Level Drilling Process: Precision Originates from Technology, Excellence Derives from Mastery

Explore Rich Full Joy’s micron-level PCB drilling powered by Hitachi laser technology. Achieve ±1μm precision, clean hole walls, and aerospace-grade reliability.
E-Test85b
01

E-Test

The E-Test is mainly used to check the open and short circuits of the PCB. The electrical performance test should be qualified before shipment.
PCB Chemical Laboratoryfao
01

PCB Chemical Laboratory

Our team consists of experienced professionals with deep technical expertise in PCB manufacturing and testing.
PCB Inspection - Online AOInu2
01

PCB Inspection - Online AOI

In the production of PCBs (Printed Circuit Boards), precise defect inspection is crucial for ensuring product quality.
E-Test85b
01

E-Test

The E-Test is mainly used to check the open and short circuits of the PCB. The electrical performance test should be qualified before shipment.

PCB Manufacturing Equipment List

More than 200 high-precision production equipment, including 50 six-axis drilling machines, 10 laser drilling machines, and 20 AOI machines, providing a fully automated production line.

I/L — Inner Layer Imaging & AOI

English Name Vendor(s) Qty Purpose
Preclean (ink) Orbotech, Schmid 3 Clean inner panels prior to coating
Roller Coater (Vertical) Schmid, KCE 2 Vertical coating of photoresist
Roller Coater (Horizontal) Schmid, KCE 1 Horizontal coating/lamination of photoresist
D.E.S (Develop/Etch/Strip) Atotech, Manz, HOYA, YangBo (TW) 3 Inner-layer develop–etch–strip
Auto Exposure (ink) Orbotech, Maskless Lithography, SCREEN 5 Automatic exposure for inner layers
Manual Exposure Colight, OLEC 1 Manual exposure for small lots/prototypes
I/L AOI Discovery Orbotech 6 Inner-layer AOI defect detection
V-Smart Rework Station Orbotech 5 Manual verification/rework for AOI defects
I/L AOI Spiron Orbotech 3 Integrated inner-layer AOI + review
I/L AOI Inspire Orbotech 1 High-precision inner-layer AOI
OPE (Inner-layer Punch) LPKF, Schmoll, Mitsubishi 2 Tooling/punch for lamination registration

Press — Lamination & Brown Oxide

English Name Vendor(s) Qty Purpose
Horizontal Bondfilm Brown Oxide ChuangKe, DengTai 2 Surface roughening before lamination
Conventional Press (2 Hot + 1 Cold) HuoQuan 2 Lamination
Electronical Press (ADARA 48 / 73) CEDATE (Italy) 4 Precision lamination
RBM Thermal Fusion (Hot-Melt) HuoQuan; MuNuo 4+2, 12 Resin flow assist
Automatic/Manual Lay-up (Stacker) CEDATE (Italy) 4 Lamination lay-up
PP Auto Cutter ZhengYe 4 PP prepreg cutting
X-ray Drilling (Tooling) DeLiFu; HaoShuo 4 Registration & target drilling
X-ray Inspection AiSiDa 2 Post-press registration verification

RF — Rigid-Flex Lamination & Flex Core

English Name Vendor(s) Qty Purpose
Regal-Flex Press — 10 Rigid-flex lamination
PLASMA (for Regal-Flex) — 2 Surface activation for flex adhesion
Steel Plate Cleaner — 2 Clean lamination plates
UV Laser Cutting — 2 Flex outline/coverlay cutting
Flex-Core Cutter — 2 Flex core cutting
Vertical Oven — 2 Flex baking/curing
Thin-Core Laminator — 2 Thin core dry-film lamination

Drilling — Mechanical & Laser

English Name Vendor(s) Qty Purpose
Laser Drill (5Z00U / ML605GTW5) Mitsubishi 20 Microvia laser drilling
Six-spindle Mechanical Drills Hitachi; LongZe; DongTai; DaLiang 150+ High-speed drilling
Dual-spindle Mechanical Drills XueLong; HuaJian; DaLiang 8 Prototype & small-lot drilling
Hole Position Scanner (CPK) MACHVISION 2 Drill registration check
Automatic Surface Grinder/Polisher ChengZhong (CDZ550) 12 Deburr & surface prep

Routing

English Name Vendor(s) Qty Purpose
Routing Machine YOWSUN 12 Profile routing
Beveling Machine — 4 Edge beveling
Punching Machine — 6 Depanelization

Electrical Testing (ET)

English Name Vendor(s) Qty Purpose
Flying Probe Tester ATG 6 Electrical continuity & isolation test
Bed of Nails Tester — 10 Mass production testing

Final Visual Inspection (FV)

English Name Vendor(s) Qty Purpose
Visual Inspection Stations In-house 40 Final product QC
Magnifiers — 20 Fine feature inspection

Film Room

English Name Vendor(s) Qty Purpose
Laser Photoplotter Orbotech 2 Film output
Film Storage Cabinet — 5 Secure film handling

FPC (Flexible PCB)

English Name Vendor(s) Qty Purpose
Coverlay Laminator Hitachi 3 FPC coverlay lamination
PI Cutting Machine — 2 Polyimide cutting
Laser Drill for FPC — 2 Microvia drilling for flex

QA (Quality Assurance / Lab)

English Name Vendor(s) Qty Purpose
2D/3D Measurement Systems OPTEK; ZhengYe 1 (2D), 1 (auto image) Dimensional inspection
Impedance Tester (CITS800S2) Polar 1 Impedance measurement
X-ray Coating Thickness ZhengYe 1 Plating thickness
Ion Contamination Tester ZhengYe 1 Cleanliness (ionic) test
Salt Spray Chamber — 1 Corrosion resistance test
Thermal Shock Chamber — 1 Reliability (temp shock)
Metallographic Microscope Olympus 1 Cross-section analysis