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Visible Quality with 3D SPI – Improve Solder Paste Printing Accuracy by 60%

Visible Quality with 3D SPI – Improve Solder Paste Printing Accuracy by 60%

2025-06-06

Discover how 3D Solder Paste Inspection (SPI) technology reduces printing defects by 60%, boosts SMT yield, and enhances quality control across automotive, 5G, and high-reliability electronics.

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Smart PCBA Inspection Systems: AOI, SPI, X-Ray, ICT & FCT

Smart PCBA Inspection Systems: AOI, SPI, X-Ray, ICT & FCT

2025-06-06

Discover how multi-tiered PcbA inspection technologies ensure ultra-low DPPM rates and high reliability in automotive, medical, and high-end electronics manufacturing.

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Reflow Soldering Process: Precision Thermal Control in SMT

Reflow Soldering Process: Precision Thermal Control in SMT

2025-06-06

Learn how temperature profiling, nitrogen atmosphere, and process monitoring ensure soldering reliability in automotive, aerospace, and 5G applications.

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High-Precision SMT Placement for High-Reliability PCBA Assembly

High-Precision SMT Placement for High-Reliability PCBA Assembly

2025-06-06

Explore the advanced placement technologies and process controls that ensure stable, accurate PCBA mounting.

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Solder Paste Printing: The Foundation of Successful Soldering

Solder Paste Printing: The Foundation of Successful Soldering

2025-06-06

Learn how precision stencil design, AI-driven printing, and solder paste lifecycle management ensure defect-free SMT soldering.

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3D Solder Paste Inspection in PCBA: The First Line of Welding Quality Defense

3D Solder Paste Inspection in PCBA: The First Line of Welding Quality Defense

2025-06-05

Discover the core value of 3D solder paste inspection machines in PCBA production. Improve welding quality, reduce rework, and boost yield with intelligent SPI systems.

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SMT Assembly Process Fully Explained: From Bare Board to Final Product

SMT Assembly Process Fully Explained: From Bare Board to Final Product

2025-05-19

This in-depth guide explains the most common SMT assembly defects such as tombstoning, bridging, voids, and misalignment. Learn their root causes and how to resolve them with best practices to improve PCBA reliability.

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How Phased Array Antenna PCBs Empower Next-Generation Air Defense Systems

How Phased Array Antenna PCBs Empower Next-Generation Air Defense Systems

2025-05-15

Discover how phased array antenna PCBs enhance next-gen air defense with high-frequency materials, HDI tech, and advanced radar capabilities.

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Common SMT Process Defects and Solutions: A Complete Guide for Reliable PCB Assembly

Common SMT Process Defects and Solutions: A Complete Guide for Reliable PCB Assembly

2025-05-14

This in-depth guide explains the most common SMT assembly defects such as tombstoning, bridging, voids, and misalignment. Learn their root causes and how to resolve them with best practices to improve PCBA reliability.

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From the Customer’s Perspective: How to Prepare a Complete PCBA Order Package

From the Customer’s Perspective: How to Prepare a Complete PCBA Order Package

2025-05-12

A step-by-step guide for customers on how to prepare all essential files and documentation for PCBA orders. Ensure faster quoting, smoother production, and fewer quality issues.

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