Leave Your Message

Hybrid High-Frequency PCB with Rogers RO4350B | China Manufacturer

The hybrid high-frequency PCB is a cutting-edge solution designed for advanced RF and microwave applications. Utilizing TG170 Rogers RO4350B material with a dielectric constant (Dk) of 3.48, this PCB ensures exceptional signal integrity and thermal stability. Key features include mechanical blind vias for high-density interconnects, resin-filled vias for enhanced durability, and selective gold plating for superior conductivity and corrosion resistance. These PCBs are ideal for communication, aerospace, and automotive industries, offering unmatched performance and reliability.

    quote now

    Multilayer PcB, any layer HDI PCB

    Type High-frequency Hybrid pressing PCB+mechanical drilled blind hole+resin plug hole
    End product  
    Materia Rogers RO4350B 1E/1E 0200 (DK=3.48)(0.508mm)+ Regular Substrates S1000-2M  FR-4、TG170
    Number of layer 6L
    Board Thickness 1.0mm
    single size 53.1*54mm/1PCS
    Surface finish partially electric thick gold  
    inner copper thickness 18um
    outer copper thickness 35um
    color of solder mask green(GTS,GBS)
    silkscreen color white(GTO,GBO)
    via treatment resin plug hole
    density of mechanical drilling hole 73W/㎡
    density of laser drilling hole /
    min via size 0.3mm
    min line width/space 8/7mil
    aperture ratio 4mil
    pressing times 2 time
    drilling times 4 time
    PN J0691134A

    Rogers RO4350B | China’s Leading High-Frequency PCB Manufacturer

    high-frequency PCB China supplier

    What is a High-Frequency Hybrid PCB?

    A high-frequency hybrid PCB is a specialized multilayer PCB that combines different dielectric materials to achieve superior RF performance, enhanced signal integrity, and optimized thermal management. By integrating high-frequency laminates like Rogers RO4350B with standard FR-4 or other materials, hybrid PCBs provide a cost-effective and high-performance solution for RF, microwave, and high-speed applications.

    As a leading high-frequency PCB manufacturer in China, we specialize in high-frequency hybrid PCB fabrication, offering customized designs with advanced processing technologies, including:
    ✔ Resin-filled vias
    ✔ Selective thick gold plating


    Key Features of Our High-Frequency Hybrid PCBs
    ✔ Material Combination: Rogers RO4350B + FR-4 / Other Substrates
    ✔ Processing Technologies: Mechanical blind vias, resin-filled vias, partial thick gold plating
    ✔ Excellent RF Performance: Stable dielectric constant (Dk = 3.48) and low loss tangent (Df = 0.0037)
    ✔ High Thermal Reliability: Tg ≥ 280°C, ideal for high-power applications
    ✔ Precision Manufacturing: Tight impedance control, low insertion loss, and high dimensional stability
    ✔ Customized Stack-ups: Multi-layer hybrid PCB solutions tailored to specific RF designs
    ✔ Mass Production Capabilities: Cost-effective and scalable for industrial needs

    High-Frequency Hybrid PCB Manufacturing Capabilities
    We offer custom high-frequency PCB manufacturing services, specializing in high-mix, high-frequency PCB production using Rogers materials.
    ✔ PCB Type: High-frequency hybrid PCB
    ✔ Layer Count: 2-48 layers
    ✔ Board Thickness: 0.2mm - 3.2mm
    ✔ Min. Line Width / Space: 3 mil / 3 mil
    ✔ Surface Finish Options: ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold
    ✔ Vias: Blind vias, buried vias, resin-filled vias
    ✔ Max. Copper Thickness: 6oz

    Why Use Rogers RO4350B for High-Frequency PCBs?

    Rogers RO4350B is a high-performance, low-loss thermoset laminate engineered for RF and microwave circuits. Unlike traditional FR-4, RO4350B offers superior electrical properties, making it the preferred choice for 5G networks, radar systems, and satellite communications.

    Property

    RO4350B Typical ValueRO4350B

    Dielectric Constant (Dk) @10GHz

    3.48 ± 0.053.48±0.05

    Loss Tangent (Df) @10GHz

    0.0037

    Tg (Glass Transition Temperature)Tg

    >280°C>280℃

    CTE (Z-Axis @50-260°C)CTE

    32 ppm/°C32

    Thermal Conductivity

    0.69 W/mK

    Moisture Absorption

    0.06%

    Flammability Rating

    UL94 V-0

    Key Benefits of Rogers RO4350B in Hybrid PCB Designs:
    ✔ Superior High-Frequency Performance – Low loss and stable Dk ensure excellent signal transmission
    ✔ High Thermal Stability – Supports lead-free assembly and high-temperature soldering
    ✔ Low Moisture Absorption – Ideal for harsh and humid environments
    ✔ Better Processability – Compatible with standard PCB manufacturing processes

    Why Choose Us as Your High-Frequency PCB Supplier in China?
    ✔ Expertise in High-Frequency PCB Manufacturing
    We have over 20 years of experience in high-frequency PCB fabrication, specializing in hybrid PCBs using Rogers RO4350B and other advanced materials.
    ✔ Advanced Production Technologies
    We utilize state-of-the-art equipment for precision drilling, plating, and multilayer lamination, ensuring superior RF performance and signal integrity.
    ✔ Competitive Pricing & Fast Turnaround
    As a leading high-frequency PCB manufacturer in China, we offer cost-effective solutions with fast production cycles to meet global demand.
    ✔ Strict Quality Control & Certifications
    Our PCBs comply with ISO9001, UL, RoHS, and IPC standards, ensuring high reliability and performance.

    Rogers PCB manufacturing

    Frequently Asked Questions (FAQ) About High-Frequency Hybrid PCBs

    1.What is a high-frequency hybrid PCB?
    A high-frequency hybrid PCB is a multilayer PCB that integrates different dielectric materials to achieve optimal performance for high-speed and RF applications. By combining materials like Rogers RO4350B with standard FR-4, hybrid PCBs provide enhanced signal integrity, impedance control, and thermal management while reducing manufacturing costs.

    2.Why use Rogers RO4350B instead of standard FR-4?
    Unlike FR-4, Rogers RO4350B offers:
    ✔ Stable dielectric constant (Dk = 3.48), ensuring consistent signal propagation.
    ✔ Low loss tangent (Df = 0.0037), minimizing signal attenuation.
    ✔ High thermal stability (Tg >280°C), supporting high-power applications.
    ✔ Lower moisture absorption (0.06%), making it suitable for harsh environments.

    3.What are the benefits of hybrid PCB technology?
    High-frequency hybrid PCBs provide:
    ✔ Cost savings – Combining standard FR-4 with premium RF materials lowers expenses.
    ✔ Improved signal integrity – Reduced insertion loss and impedance deviation.
    ✔ Better mechanical performance – Reduced warping, improved reliability.
    ✔ Enhanced thermal management – Suitable for high-power RF circuits.

    4.What industries commonly use high-frequency hybrid PCBs?
    These PCBs are widely used in telecommunications, automotive radar, aerospace, 5G networks, and IoT devices where stable signal transmission and thermal reliability are crucial.

    5.What are the main processing technologies for high-frequency hybrid PCBs?
    ✔ Mechanical blind vias – To optimize space and enhance high-speed signal routing.
    ✔ Resin-filled vias – To ensure reliability in multilayer stacking.
    ✔ Selective thick gold plating – For better conductivity and durability in RF circuits.

    6.How does material selection affect high-frequency PCB performance?
    The dielectric constant (Dk) and dissipation factor (Df) are critical for RF PCB performance. A stable Dk ensures consistent signal transmission, while a low Df minimizes signal loss. Rogers RO4350B’s low Df and tight Dk tolerance make it ideal for 5G, radar, and satellite applications.

    7.What surface finishes are available for high-frequency hybrid PCBs?
    We offer multiple options, including:
    ✔ ENIG (Electroless Nickel Immersion Gold) – Best for signal integrity.
    ✔ Hard Gold Plating – High durability and wear resistance.
    ✔ Immersion Silver – Ideal for fine-pitch components.

    8.How does a high-frequency PCB reduce EMI (Electromagnetic Interference)?
    ✔ Optimized stack-up design – Reducing unwanted signal coupling.
    ✔ Controlled impedance routing – Ensuring signal integrity.
    ✔ Proper grounding techniques – To minimize interference in RF circuits.

    9.What are the challenges of manufacturing high-frequency hybrid PCBs?
    ✔ Material compatibility – Different materials expand at different rates, requiring precise lamination techniques.
    ✔ Drilling precision – Maintaining via quality is crucial for RF performance.
    ✔ Copper roughness control – Affects signal loss at high frequencies.

    10.How do I choose the right high-frequency PCB manufacturer?
    When selecting a high-frequency PCB manufacturer, consider:
    ✔ Experience with RF and hybrid PCB fabrication
    ✔ Advanced processing capabilities (blind vias, resin-filled vias, impedance control)
    ✔ Strong quality certifications (ISO, IPC, UL standards)

    Expanded Applications of High-Frequency Hybrid PCBs

    1. 5G Wireless Communication Systems
    Base station antennas and transceivers
    Millimeter-wave (mmWave) RF front-end modules
    High-speed backhaul and fiber-optic networks
    Why it matters: 5G networks operate at higher frequencies (24 GHz to 100 GHz), requiring low-loss PCB materials like Rogers RO4350B for minimal signal degradation.

    2. Satellite and Aerospace Electronics
    GNSS navigation systems
    Phased array antennas for satellite communication
    Radar and telemetry systems
    Why it matters: Aerospace applications demand lightweight, high-reliability PCBs that can withstand extreme temperatures and radiation exposure.

    3. Automotive Radar and ADAS Systems
    77 GHz automotive radar
    Lidar and vehicle-to-everything (V2X) communication
    Electronic control units (ECUs) for ADASADAS 
    Why it matters: Modern cars require high-frequency PCBs for collision avoidance, adaptive cruise control, and autonomous driving systems.

    4. IoT and Smart Devices
    Smart home automation systems
    Wearable health monitors
    Wireless sensor networks
    Why it matters: IoT devices require compact, high-performance PCBs with low power consumption and efficient wireless connectivity.

    5. RF Power Amplifiers and High-Power Transmitters
    Microwave and RF power modules
    Broadband amplifiers for military applications
    Telecom power distribution systems
    Why it matters: High-frequency PCBs with excellent thermal conductivity are crucial for preventing overheating in high-power RF systems.

    6. High-Speed Computing and Data Centers
    High-speed network switches
    Optical transceivers for data centers
    Cloud computing infrastructure
    Why it matters: Modern data centers require low-latency PCBs with stable impedance to support 40G/100G Ethernet and AI computing workloads.

    7. Medical Imaging and RF Therapy Equipment
    MRI and CT scan signal processing boards
    Wireless medical telemetry systems
    Implantable medical devices
    Why it matters: High-frequency hybrid PCBs enable precise medical imaging and wireless communication in healthcare applications.

    8. Defense and Electronic Warfare Systems
    Military radar and surveillance systems
    Secure encrypted communication modules
    Unmanned aerial vehicle (UAV) avionics
    Why it matters: Rugged high-frequency PCBs ensure stable signal transmission in harsh environments, making them ideal for military applications.

    9. Test and Measurement Equipment
    High-frequency signal analyzers
    Microwave frequency generators
    Network and spectrum analyzers
    Why it matters: Precision impedance control is essential for accurate signal measurement in RF testing applications.

    10. Industrial Automation and Robotics
    5G-connected industrial sensors
    Autonomous robotic control systems
    Wireless factory automation modules
    Why it matters: High-frequency PCBs improve wireless communication in smart factories and Industry 4.0 environments.

    The Role of High-Frequency PCB Materials in Signal Transmission
    ✔ Stable Dielectric Constant (Dk): Ensures uniform signal propagation across the PCB.
    ✔ Low Loss Tangent (Df): Minimizes signal loss, especially at microwave and mmWave frequencies.
    ✔ Thermal Conductivity: Helps dissipate heat in high-power RF applications.
    ✔ Moisture Resistance: Prevents signal degradation in humid environments.
    ✔ Impedance Control: Ensures predictable performance for high-speed digital and RF circuits.
    Looking for a trusted high-frequency PCB supplier in China? Contact us for customized Rogers RO4350B PCB solutions!
    329qf