6 Layer High Frequency Hybrid & Metal Edging PCB | Rogers RO4350B + S1000 - 2M | High Performance Circuit Board
Product Specifications
Our 6 - layer high - frequency hybrid and metal edging PCB stands out with its unique combination of materials and advanced features.
Type High - frequency Hybrid pressing PCB | Metal edging PCB | impedance Material Rogers RO4350B+Regular Substrates S1000 - 2M、FR - 4、TG170 Number of Layers 6L Board Thickness 2.0mm Single Size 202*146mm/2PCS Surface Finish ENIG Inner Copper Thickness 35um Outer Copper Thickness 35um Color of Solder Mask green (GTS，GBS) Silkscreen Color white (GTO,GBO) Via Treatment Solder mask plug holes Density of Mechanical Drilling Hole 8W/㎡ Min Via Size 0.25mm Min Line Width/Space 5/5mil Aperture Ratio 8mil Pressing Times 1 time Drilling Times 1 time PN B0600853B
Product Details
Manufacturing Highlights: Key Technologies in PCB Production
In the highly competitive field of PCB manufacturing, our 6 - layer high - frequency hybrid and metal edging PCBs are a testament to our innovation and expertise. As a leading PCB manufacturer,we leverage the advantages of top - grade materials like Rogers RO4350B and S1000 - 2M, combined with cutting - edge processing techniques, to achieve outstanding circuit board performance.
Key Manufacturing Features:
Advanced Material Integration: The combination of Rogers RO4350B, known for its low - loss characteristics, and S1000 - 2M, a high - performance regular substrate, along with FR - 4 and TG170, results in a PCB with excellent electrical and mechanical properties. This blend allows for efficient handling of high - frequency signals and provides stability in various operating conditions.
Metal Edging Technology: The addition of metal edging not only provides enhanced mechanical protection but also acts as an effective shield for electromagnetic interference. This technology ensures that the PCB can operate in high - interference environments without compromising signal integrity, making it suitable for applications where signal security is crucial.
High - Precision Via Treatment: Our meticulous solder mask plug hole treatment is crucial for reliable inner - layer connections. It improves electrical conductivity between layers, reduces signal crosstalk, and contributes to the overall high - quality performance of the PCB in high - frequency applications.
Optimal Copper Thickness Control: With an inner and outer copper thickness of 35um, our PCBs are optimized for a balance between electrical performance and cost - effectiveness. The precise control of copper thickness across all layers ensures stable power delivery and efficient signal transmission, meeting the requirements of a wide range of applications.
Ultra - Fine Line and Space Design: Achieving a minimum line width/space of 5/5mil showcases our advanced manufacturing capabilities. This high - density design allows for more components to be integrated on the board, increasing its functionality while reducing its overall size, which is essential for the development of compact and high - performance electronic products.
What Makes Our PCBs Stand Out?
Our PCB products not only meet but exceed industry standards, offering a range of competitive advantages that set us apart from the competition.
From the initial material selection, where we carefully consider the specific needs of high - frequency and metal edging applications, to the final product delivery, we provide a full - service solution. Our team of experts is involved in every step, from design optimization to strict quality control, ensuring a seamless process and a high - quality end - product.
Global Sourcing Network:
We have established strong partnerships with renowned material suppliers like Rogers and other key players in the industry. This global sourcing network guarantees a stable supply of high - quality materials, enabling us to meet production demands promptly and maintain consistent product quality.
Customized Manufacturing (ODM/OEM Services):
We understand that each customer has unique requirements. Our customized manufacturing services are designed to meet these specific needs. Whether it's a custom layer stack - up, special impedance requirements, or a unique design for a particular application, our experienced engineering team can provide tailored solutions, helping our customers gain a competitive edge in the market.
Rigorous Quality Assurance:
Our commitment to quality is unwavering. We hold multiple international certifications, including ISO 9001, ISO 14001, and UL. Our quality control process includes a series of advanced tests, such as 100% impedance testing, X - ray inspection, and environmental stress testing. This ensures that every PCB leaving our factory meets the highest quality standards.
Why Partner with Us for Your PCB Needs?
✅ Over 15 years of experience in PCB manufacturing, with a focus on high - frequency and metal - edging PCB technologies.
✅ Advanced metal edging and solder mask plug hole processing techniques for enhanced performance and reliability.
✅ Stringent quality control measures with comprehensive testing to ensure top - notch product quality.
✅ In - depth knowledge of materials like Rogers RO4350B and S1000 - 2M, enabling us to optimize PCB performance for different applications.
✅ Quick - turnaround customized ODM/OEM solutions to help you get your products to market faster.
Versatile Applications of Our High - Frequency Hybrid & Metal Edging PCBs
Our 6 - layer high - frequency hybrid and metal edging PCBs are designed to meet the demands of various industries that require high - performance and reliable circuit boards. Here are some of the key application areas:
1、5G and 6G Communication Infrastructure
The rapid development of 5G and the emerging 6G technologies rely heavily on high - performance PCBs. Our 6 - layer PCBs, with their low - loss materials and precise impedance control, are ideal for 5G and 6G base stations, RF front - end modules, and high - speed data transmission components. The metal edging provides additional shielding against electromagnetic interference, ensuring stable signal transmission in complex communication environments.
2、Aerospace and Defense Electronics
In the aerospace and defense sectors, reliability and high - performance are non - negotiable. Our PCBs are used in satellite communication systems, military radars, and avionics equipment. The combination of advanced materials and metal edging technology makes them suitable for harsh environments, where they can withstand extreme temperatures, vibrations, and electromagnetic interference while maintaining excellent signal integrity.
3、Automotive Electronics
With the increasing complexity of automotive electronics, especially in advanced driver - assistance systems (ADAS) and electric vehicle (EV) technology, high - performance PCBs are in high demand. Our 6 - layer high - frequency hybrid and metal edging PCBs are used in automotive radar systems, in - vehicle infotainment systems, and battery management systems. The metal edging helps protect sensitive electronic components from electromagnetic interference, ensuring the safe and reliable operation of vehicles.
4、Medical Electronics
Medical devices require high - quality PCBs that can ensure accurate signal transmission and reliability. Our PCBs are used in medical imaging equipment such as MRI scanners, CT scanners, and ultrasound machines. The combination of high - performance materials and precise manufacturing processes makes them suitable for these applications, where any malfunction could have serious consequences for patient health.
Applications of Double-sided Impedance Flexible Printed Circuit (FPC) in Advanced Electronic Products
The double-sided impedance FPC (Flexible Printed Circuit) has been widely and crucially applied in advanced electronic products due to its unique performance advantages. The main manifestations are as follows:
Smartphones: Smartphones pursue thinness, lightness, high performance, and multiple functions, and the double-sided impedance FPC precisely meets these requirements. It is used to connect the motherboard and the display screen, enabling stable transmission of high-definition video signals and touch signals, ensuring a clear screen display and sensitive touch. At the same time, when connecting components such as the camera module, fingerprint recognition module, and battery, the FPC can be flexibly bent according to the internal space, saving space and improving the compactness of the layout. For example, in some flagship models, the FPC is responsible for quickly and accurately transmitting the data from the image sensor to the motherboard for processing, achieving high-quality photography functions.
Tablets: The large-screen display and diverse functions of tablets demand high stability and reliability for signal transmission. The double-sided impedance FPC is used to connect multiple components such as the display screen, touch panel, speaker, and camera, ensuring the smooth transmission of audio, video, and control signals. Its thinness, lightness, and bendability enable tablets to maintain a thin and light body while allowing internal components to be efficiently connected and work in coordination.
Laptops: In laptops, FPC is commonly used to connect the motherboard with the display screen, keyboard, touchpad, and other components. Especially in some ultra-thin and light laptops and 2-in-1 laptops, the flexibility and spatial adaptability of FPC make it an ideal connection solution. It can ensure the uninterrupted transmission of signals during actions such as opening and rotating the display screen, and at the same time, reduce the clutter of internal cables and improve the utilization rate of internal space.
Wearable Devices: For wearable devices such as smartwatches and smart bracelets, they are small in size and need to integrate multiple functions, posing extremely high requirements for the miniaturization of internal components and the reliability of connections. The double-sided impedance FPC can achieve the connection between various functional modules within a narrow space, such as connecting the display screen, sensors, battery, etc., and can adapt to the bending of parts like the wrist, ensuring the stable transmission of signals during the wearing process of the device.
High-end Cameras: In professional single-lens reflex cameras and mirrorless cameras, FPC is used to connect components such as the image sensor, display screen, and control module. It can quickly and accurately transmit a large amount of image data, ensuring the high-resolution shooting and real-time preview functions of the camera. At the same time, the flexibility of FPC allows for a more compact camera design, reducing the occupation of internal space.
Virtual Reality (VR) and Augmented Reality (AR) Devices: VR and AR devices need to process a large amount of image and video data, imposing extremely high requirements on the speed and stability of signal transmission. The double-sided impedance FPC is used to connect core components such as the display screen, sensors, and processors, ensuring high-quality image display and real-time interaction. Its bendability also helps the device fit better on the user's head, enhancing the comfort and stability of wearing.
Medical Devices: In some high-end medical devices, such as portable ultrasonic diagnostic instruments and endoscopes, FPC is used to connect various sensors, display screens, and control units. It can achieve reliable signal transmission within a narrow space and meet the strict requirements of medical devices for reliability, stability, and biocompatibility. For example, in an endoscope, the FPC needs to transmit high-definition image signals in a bent state to assist doctors in making accurate diagnoses.