8 - Layer High - Performance PCB with FR - 4 and TG170 | Metal Edge & Solder Mask Plug Holes | Advanced Circuit Solution
Product Details and Specifications
Our 8 - layer PCB with metal edge and solder mask plug holes stands out for its exceptional design and advanced features.
Product Specifications
Type: High - performance PCB | Metal edge PCB | impedance - controlled PCB
Material: FR - 4、TG170
Number of Layers: 8L
Board Thickness: 2.0mm
Single Size: 173*142mm/2PCS
Surface Finish: ENIG
Inner Copper Thickness: 35um
Outer Copper Thickness: 35um
Color of Solder Mask: green (GTS，GBS)
Silkscreen Color: white (GTO,GBO)
Via Treatment: Solder mask plug holes
Density of Mechanical Drilling Hole: 11W/㎡
Min Via Size: 0.2mm
Min Line Width/Space: 8/8mil
Aperture Ratio: 10mil
Pressing Times: 1 time
Drilling Times: 1 time
PN: B0800851B
Manufacturing Highlights: Key Technologies in PCB Production
In the highly competitive PCB manufacturing industry, our 8 - layer PCBs represent the pinnacle of our technological innovation. As a leading PCB manufacturer, we combine the advantages of high - quality materials like FR - 4 and TG170 with state - of - the - art processing techniques to achieve superior circuit board performance.
Key Manufacturing Features
Optimal Material Selection: FR - 4, known for its excellent electrical insulation and mechanical properties, and TG170, which offers high - temperature resistance and improved dielectric performance, are carefully selected. This combination results in a PCB that can withstand high - frequency signals and complex operating conditions.
Metal Edge Enhancement: The metal edge not only strengthens the mechanical structure of the PCB but also provides effective electromagnetic shielding. This technology is crucial for applications where electromagnetic compatibility is essential, ensuring stable signal transmission and reducing interference.
High - Quality Via Treatment: Our meticulous solder mask plug hole treatment is vital for reliable inner - layer connections. It enhances electrical conductivity between layers, reduces signal leakage, and improves the overall performance of the PCB in high - frequency applications.
Precise Copper Thickness Control: With an inner and outer copper thickness of 35um, our PCBs are designed to optimize electrical performance and power handling capabilities. The precise control of copper thickness across all layers ensures stable electrical characteristics and efficient power distribution.
High - Density Wiring Design: Achieving a minimum line width/space of 8/8mil demonstrates our advanced manufacturing capabilities. This high - density wiring design allows for more components to be packed onto the board, increasing its functionality while minimizing its footprint, which is crucial for modern compact electronic devices.
During the PCB design phase, how do you decide whether to adopt the solder mask plug hole process based on different application scenarios and requirements?
During the PCB design stage, the decision of whether to adopt the solder mask plug hole process needs to be comprehensively considered based on different application scenarios and requirements. The following is a detailed analysis:
Judging from the Electrical Performance Requirements
●High frequency and high-speed application scenarios
● Selection Basis: In high - frequency and high - speed circuits, such as 5G communication base stations and high - speed servers, signal integrity is of utmost importance. If the vias are not plugged, the solder flowing into the vias may change the impedance characteristics of the vias, resulting in increased signal reflection and attenuation. By adopting the solder mask plug hole process, the impedance consistency of the vias can be ensured, signal interference can be reduced, and the stable transmission of high - frequency signals can be guaranteed.
● Example: In the PCB design for the 5G millimeter - wave frequency band, the signal has a high frequency and a short wavelength, and is very sensitive to impedance changes. The solder mask plug hole process can effectively prevent signal distortion caused by the solder in the vias.
Application scenarios of power circuit
● Selection Basis: For power circuits, especially those with high - current power supply, the vias need to have good electrical conductivity and heat dissipation. If the vias are filled with solder, it may increase the resistance of the vias, affect the current transmission efficiency, and even generate excessive heat. In this case, if the requirements for the heat dissipation and current - carrying capacity of the vias are high, the solder mask plug hole process may not be suitable. However, if it is necessary to prevent short - circuits between the power layers, appropriate solder mask plug holes can play an isolating role.
● Example: In the PCB of an electric vehicle's battery management system, the vias of high - current power lines may focus more on heat dissipation and low resistance, while the vias of some low - current control lines can use solder mask plug holes to prevent short - circuits.
Judging from the Assembly Process Requirements
Surface Mount Technology (SMT) process
● Selection Basis: During the SMT assembly process, if the vias are close to the surface - mounted components, not using the solder mask plug hole process may cause the solder to flow into the vias, resulting in soldering defects such as poor soldering and insufficient solder, which will affect the soldering quality and reliability of the components. Therefore, when there are many surface - mounted components on the PCB and the distance between the vias and the components is small, the solder mask plug hole process is usually required.
● Example: In the PCB design of a mobile phone motherboard, the SMT process is widely used. The components are arranged compactly, and the vias are dense. To ensure the soldering quality of the surface - mounted components, most of the vias need to be plugged with solder mask.
Wave soldering process
● Selection Basis: During wave soldering, the molten solder will flow through the vias. If the vias are not plugged, problems such as solder balls and short - circuits may occur on the other side of the PCB. For PCBs using the wave soldering process, especially when there are through - hole components, the solder mask plug hole process can effectively avoid these soldering problems and improve the soldering quality.
● Example: In some traditional consumer electronics products, such as TV motherboards, some components are soldered by the wave soldering process. Plugging the vias near the through - hole components with solder mask can prevent short - circuits during soldering.
Judging from the Product's Reliability and Stability Requirements
Application scenarios in harsh environments
● Selection Basis: Electronic products operating in harsh environments such as high temperature, high humidity, and strong vibration, such as aerospace equipment and industrial control equipment, have extremely high requirements for the reliability of the PCB. The solder mask plug hole process can prevent moisture, dust, etc. from entering the vias, avoiding oxidation and corrosion of the copper layer inside the vias, thereby improving the long - term stability and reliability of the PCB.
● Example: PCBs in the aerospace field need to work stably in a complex space environment for a long time. The solder mask plug hole process can effectively protect the vias and reduce the risk of failures caused by environmental factors.
High reliability products
● Selection Basis: For products with extremely high requirements for reliability, such as medical devices and automotive electronics, even when used in normal environments, the stability of the PCB needs to be ensured. The solder mask plug hole process can reduce the possibility of via failures and improve the overall reliability of the product.
● Example: For PCBs of medical devices such as pacemakers, to ensure the safe and reliable operation of the device, it is necessary to choose the solder mask plug hole process for the vias.
Considering Cost and Production Efficiency
Cost factors
● Selection Basis: The solder mask plug hole process will increase the production cost of the PCB, including material costs and processing costs. If the product is sensitive to cost and the requirements for the vias in the application scenario are not particularly strict, a comprehensive evaluation can be made on whether to adopt the solder mask plug hole process. For example, in some low - cost consumer electronics products, the use of solder mask plug holes can be appropriately reduced without affecting performance and reliability.
Production efficiency factors
● Selection Basis: The solder mask plug hole process will increase the production process and time, reducing production efficiency. For products with large - scale production and tight delivery schedules, the impact of the solder mask plug hole process on production efficiency needs to be weighed. If the product requirements can be met by optimizing the design or using other alternative solutions, the solder mask plug hole process may be considered not to be adopted preferentially.
What are the impacts of solder mask plug holes on the PCB wiring design? What factors need to be considered during the design process?
The solder mask plug hole process can have various impacts on the PCB wiring design, and numerous factors need to be comprehensively considered during the design process.
● Impacts on PCB Wiring Design
● Increasing Wiring Complexity: The solder mask plug hole process requires precise solder mask treatment at the via positions, which makes the planning of vias in the wiring design more complex. The positions of vias need to be accurately calculated to ensure the smooth implementation of the plug hole process and avoid interference between the plugged holes and surrounding traces, pads, etc. For example, in high - density PCB wiring, there are a large number of vias with small spacing. The plugging operation may be difficult to perform due to limited space, so the wiring needs to be adjusted to leave appropriate space for the plug holes, thus increasing the difficulty and complexity of wiring.
● Affecting Via Layout Rules: To ensure the quality of the solder mask plug holes, the via layout rules need to be changed. Generally, the spacing between vias needs to be appropriately increased to facilitate the plugging operation and subsequent inspection. For example, when the solder mask plug hole process is used for vias with the original standard spacing, the spacing may need to be increased, which may require readjusting the originally compact wiring design and affect the rationality and compactness of the overall layout.
● Changing Signal Transmission Path Planning: In the design of PCBs for high - speed signal transmission, the solder mask plug hole process may change the signal transmission characteristics. After the vias are plugged, parameters such as their equivalent inductance and capacitance will change, which in turn affects the signal transmission delay and loss. Therefore, during the wiring design, the signal transmission paths need to be replanned to avoid adverse effects on the signals caused by the plugged holes and ensure signal integrity. For example, for critical high - speed differential signals, it may be necessary to avoid the positions of the plugged holes and choose other paths for wiring.
● Factors to be Considered During Design
● Electrical Performance Requirements: Depending on the application scenario of the PCB, if high electrical performance is required, such as in high - frequency circuits, the impact of the solder mask plug hole process on signal transmission needs to be carefully considered. Appropriate plug - hole materials and processes should be selected to ensure the impedance matching of the vias and reduce signal reflection and interference. For power circuits, it is necessary to ensure that the plug holes do not affect the current - carrying capacity and heat - dissipation performance of the vias, and avoid an increase in via resistance due to the plug holes, which could affect the stability of the power supply.
● Assembly Process Requirements: If the PCB adopts the surface - mount technology (SMT) and the vias are close to the surface - mounted components, then during the design, it is necessary to ensure that the solder mask plug holes can effectively prevent solder from flowing into the vias, avoiding soldering defects such as poor soldering and insufficient solder. For the wave soldering process, the impact of the plug holes on the solder flow needs to be considered to prevent issues such as solder balls and short - circuits from occurring on the other side of the PCB. For example, when designing a PCB with a large number of through - hole components, it is necessary to ensure that the vias near the through - hole components are well - plugged to avoid poor soldering during wave soldering.
How to inspect the quality of solder mask plug holes? What are the industry standards and inspection methods?
The quality inspection of solder mask plug holes is a crucial link in ensuring the performance and reliability of PCBs. The following is an introduction from aspects such as industry standards, appearance inspection, aperture and hole wall inspection, and electrical performance inspection:
1.Industry Standards
● IPC Standards: The IPC (Institute of Printed Circuits, now known as the Association Connecting Electronics Industries) has developed a series of standards for PCB manufacturing and inspection. Regarding solder mask plug holes, standards like IPC - A - 600 "Acceptability of Printed Boards" clearly define the filling requirements and appearance standards for solder mask plug holes. For example, ideally, the plug holes should be completely filled, without obvious voids or bubbles. The surface should be flat, flush with or slightly recessed from the surrounding solder mask layer, and the degree of recess should not exceed the specified range.
● Other Standards: Some enterprises and countries also develop relevant standards based on their own requirements. For example, large enterprises like Huawei further refine and tighten the standards based on IPC standards, according to their product needs. They put forward higher requirements for the filling rate of plug holes, aperture tolerances, etc. Although the EU's RoHS directive mainly focuses on the restriction of hazardous substances, it indirectly affects the selection of solder mask plug hole materials during PCB manufacturing, ensuring that they meet environmental protection requirements and thus guaranteeing the quality of plug holes.
2.Inspection Methods
● Appearance Inspection: This is the most commonly used and intuitive method. By visual inspection or with the help of tools such as magnifying glasses and microscopes, check whether the surface of the plug hole is flat and smooth, and whether there are defects such as holes, cracks, and bubbles. If the surface of the plug hole is uneven, it may affect subsequent soldering and component installation. The presence of bubbles may lead to unstable plug holes, causing problems during subsequent use.
● Aperture and Hole Wall Inspection: Use an aperture measuring instrument to measure the aperture of the plug hole to ensure it meets the design requirements. An aperture that is too large or too small may affect the electrical and mechanical properties of the PCB. At the same time, use a microscope to observe the hole wall to check whether the connection between the plug hole and the hole wall is tight, and whether there are phenomena such as delamination and peeling. If the connection is not tight, it may lead to abnormal signal transmission or electrical short - circuit problems.
● Electrical Performance Inspection: Use methods such as flying probe testing and ICT (In - Circuit Test) to detect the electrical performance of the plug holes. Flying probe testing can check whether the electrical connection between the plug hole and the surrounding traces is normal and whether there are open - circuit or short - circuit conditions. ICT can conduct comprehensive electrical tests on numerous circuit nodes on the PCB to determine whether the electrical performance of the plug holes meets the standards in the entire circuit system. If there are electrical problems with the plug holes, it will directly affect the normal operation of the electronic components on the PCB.
● Cross - Section Inspection: Make cross - sections of the PCB and observe the internal structure of the plug holes, such as the distribution of filling materials and the presence of voids, through a metallurgical microscope or an electron microscope. Cross - section inspection can obtain detailed information about the interior of the plug holes and is an important basis for judging the quality of the plug holes. However, this method is a destructive test with high costs and is usually used for spot checks or in - depth inspections when there are doubts about the quality.
● X - Ray Inspection: Use X - rays to penetrate the PCB and observe the filling situation inside the plug holes through imaging. This method can clearly show whether there are unfilled areas, voids, and other defects inside the plug holes without damaging the PCB. It also has a fast detection speed and high efficiency, making it suitable for online inspection in large - scale producti
Versatile Applications of Our High-Performance PCBs
Our 8-layer high-performance PCBs are designed to meet the demands of various industries that require reliable and advanced circuit boards. With high-quality materials like FR-4 and TG170, precise impedance control, and metal edge reinforcement, these PCBs ensure stable signal transmission and durability in complex environments. Below are some of the key application areas:
1. 5G and 6G Communication Infrastructure
The continuous evolution of 5G and the development of 6G technologies demand high-performance PCBs with excellent signal-handling capabilities. Our 8-layer PCBs, with precise impedance control and high-density wiring, are well-suited for:
5G and 6G base stations
High-speed data transmission modules
Advanced RF front-end modules
The metal edge provides additional electromagnetic shielding, ensuring stable signal transmission in complex communication environments.
2. Aerospace and Defense Electronics
Reliability and high performance are critical in aerospace and defense applications. Our PCBs are widely used in:
Satellite communication systems
Military avionics and navigation systems
Advanced radar and electronic warfare systems
The combination of FR-4 and TG170 materials, along with the metal edge technology, ensures resistance to extreme temperatures, vibrations, and electromagnetic interference while maintaining excellent signal integrity.
3. Automotive Electronics
With the rapid development of automotive electronics, particularly in electric vehicles (EVs) and autonomous driving systems, high-performance PCBs are in high demand. Our 8-layer PCBs are used in:
Battery management systems (BMS)
In-vehicle infotainment systems
Advanced driver-assistance systems (ADAS)
The metal edge enhances durability and electromagnetic shielding, ensuring safe and reliable operation in automotive environments.
4. Medical and Healthcare Devices
Medical electronics require highly reliable PCBs to ensure accurate diagnostics and treatment. Our 8-layer PCBs are used in:
MRI and CT scanners
Patient monitoring systems
Medical imaging and diagnostic equipment
The precise impedance control and high-density interconnect design ensure stable signal transmission in critical healthcare applications.
5. Industrial Automation and Robotics
With the rise of Industry 4.0, high-performance PCBs are essential for automated systems. Our PCBs are widely used in:
Programmable logic controllers (PLCs)
Industrial sensors and actuators
Robotic control systems
Their durability, high-density wiring, and metal edge reinforcement make them ideal for harsh industrial environments.
6. High-Performance Computing and AI Servers
Data centers and AI servers require PCBs that can handle high-speed signal transmission and thermal management. Our 8-layer PCBs support:
High-performance computing (HPC) motherboards
AI server hardware
Cloud computing infrastructure
Their precise impedance control ensures optimal signal integrity for high-frequency data processing.
7. Renewable Energy Systems
Modern renewable energy solutions rely on robust electronic systems. Our PCBs are used in:
Solar inverters
Wind turbine control systems
Energy storage systems
The combination of thermal stability and high electrical performance ensures efficient energy conversion.
Our 8-layer high-performance PCBs, featuring FR-4 and TG170 materials, metal edge reinforcement, and precise impedance control, are widely used in industries requiring reliability, durability, and high-speed signal processing. Whether in telecommunications, aerospace, automotive, medical, or industrial applications, our PCBs provide a solid foundation for cutting-edge technologies.