DPC Ceramic Substrate: ib qho kev xaiv zoo tshaj plaws rau kev ntim khoom siv LiDAR chips hauv tsheb
Lub luag haujlwm ntawm LiDAR (Kev Tshawb Pom Lub Teeb thiab Kev Ntsuas) yog tso tawm cov teeb liab laser infrared thiab piv cov teeb liab cuam tshuam tom qab ntsib cov teeb meem nrog cov teeb liab tso tawm, txhawm rau kom tau txais cov ntaub ntawv xws li qhov chaw, qhov deb, kev taw qhia, qhov ceev, tus cwj pwm, thiab cov duab ntawm lub hom phiaj. Cov thev naus laus zis no tuaj yeem ua tiav kev zam kev cuam tshuam lossis kev tsav tsheb ywj pheej. Ua ib lub sensor siab-precision, LiDAR tau suav hais tias yog qhov tseem ceeb rau kev ua tiav qib siab tsav tsheb ywj pheej, thiab nws qhov tseem ceeb tau dhau los ua qhov tseem ceeb.
Cov teeb pom kev zoo laser yog cov khoom tseem ceeb ntawm lub tsheb LiDAR. Tam sim no, VCSEL (vertical cavity surface emitting laser) lub teeb pom kev zoo tau dhau los ua qhov kev xaiv zoo tshaj plaws rau hybrid solid-state LiDAR thiab flash LiDAR hauv tsheb vim nws tus nqi tsim khoom qis, kev ntseeg siab siab, lub kaum sab xis me me, thiab kev sib koom ua ke 2D yooj yim. Lub VCSEL chip tuaj yeem ua tiav qhov deb ntev dua, kev pom tseeb dua, thiab ua raws li cov qauv kev nyab xeeb ntawm lub qhov muag hauv lub tsheb hybrid solid-state LiDAR. Tsis tas li ntawd xwb, lawv ua rau Flash LiDAR ua tiav qhov kev xav tau yooj yim dua thiab dav dua, thiab muaj txiaj ntsig zoo rau tus nqi.
Cov khoom siv ceramic tau dhau los ua cov khoom siv ntim khoom zoo tagnrho rau kev siv LiDAR hauv tsheb.
DPC (Direct Copper Plating) cov khoom siv ceramic muaj cov thermal conductivity siab, rwb thaiv tsev siab, qhov tseeb ntawm lub voj voog, qhov du ntawm qhov chaw siab, thiab cov coefficient thermal expansion uas phim cov chip. Lawv kuj muab kev sib txuas ntsug kom ua tau raws li cov kev xav tau ntim khoom ntawm VCSEL.
1. Kev kub hnyiab zoo heev
Lub DPC ceramic substrate muaj kev sib txuas ntsug, tsim cov channel conductive sab hauv. Vim tias ceramics yog ob qho tib si insulators thiab thermal conductors, lawv tuaj yeem ua tiav kev sib cais thermoelectric thiab daws tau qhov teeb meem dissipation cua sov ntawm VCSEL chips.
2. Kev ntseeg siab siab
Lub zog ceev ntawm VCSEL chips yog siab heev, thiab qhov tsis sib xws ntawm thermal expansion ntawm lub chip thiab substrate tuaj yeem ua rau muaj teeb meem kev ntxhov siab. Lub thermal expansion coefficient ntawm ceramic substrates yog sib xws nrog VCSEL. Tsis tas li ntawd, DPC ceramic substrates tuaj yeem koom ua ke cov thav duab hlau thiab ceramic substrates los tsim ib lub qhov kaw, nrog rau cov qauv compact, tsis muaj txheej txheem sib txuas nruab nrab, thiab cua nruj.
3. Kev sib txuas ntsug
VCSEL ntim khoom yuav tsum tau teeb tsa lub lens saum lub nti, yog li ntawd yuav tsum tau teeb tsa lub qhov 3D hauv lub substrate. DPC ceramic substrates muaj qhov zoo ntawm kev sib txuas ntsug nrog kev ntseeg siab, uas tsim nyog rau kev sib txuas ntsug eutectic.
Nyob rau hauv cov ntsiab lus ntawm kev txhim kho cov tsheb ntse, cov ntaub ntawv ceramic ua lub luag haujlwm tseem ceeb hauv kev txhim kho ntse ntawm cov tsheb fais fab tshiab. Raws li lub hauv paus ntawm tag nrho cov thev naus laus zis, kev tsim kho tshiab tas mus li hauv cov khoom siv thev naus laus zis yog qhov tseem ceeb rau kev txhawb nqa kev txhim kho zoo ntawm tag nrho kev lag luam.
