DPC Ceramic Substrate: njira yabwino kwambiri yopangira ma chips a LiDAR zamagalimoto
Ntchito ya LiDAR (Kuzindikira ndi Kuyang'ana Kuwala) ndikutulutsa zizindikiro za infrared laser ndikuyerekeza zizindikiro zomwe zimawonetsedwa mutakumana ndi zopinga ndi zizindikiro zomwe zatulutsidwa, kuti mupeze zambiri monga malo, mtunda, komwe zimachokera, liwiro, momwe zinthu zilili, ndi mawonekedwe a cholinga. Ukadaulo uwu ukhoza kupewera zopinga kapena kuyenda pawokha. Monga sensa yolondola kwambiri, LiDAR imaonedwa kwambiri ngati chinsinsi chopezera kuyendetsa pawokha pamlingo wapamwamba, ndipo kufunika kwake kukukulirakulira.
Magwero a kuwala kwa laser ndi amodzi mwa zigawo zazikulu za LiDAR yamagalimoto. Pakadali pano, gwero la kuwala la VCSEL (vertical cavity surface emitting laser) lakhala chisankho chabwino kwambiri cha hybrid solid-state LiDAR ndi flash LiDAR m'magalimoto chifukwa cha mtengo wotsika wopanga, kudalirika kwakukulu, ngodya yaying'ono yosiyana, komanso kuphatikiza kosavuta kwa 2D. Chip ya VCSEL imatha kupeza mtunda wautali wozindikira, kulondola kwambiri kwa kuzindikira, komanso kutsatira miyezo yokhwima yachitetezo cha maso mu LiDAR yamagalimoto yosakanikirana yolimba. Kuphatikiza apo, zimathandiza Flash LiDAR kukhala ndi mawonekedwe osinthasintha komanso otakata, komanso kukhala ndi zabwino zazikulu pamtengo.
Ma ceramic substrates akhala zinthu zabwino kwambiri zosungiramo chips pa ntchito za LiDAR zamagalimoto.
Ma ceramic substrates a DPC (Direct Copper Plating) ali ndi kutentha kwambiri, kutenthetsa kwambiri, kulondola kwa ma circuit apamwamba, kusalala kwambiri pamwamba, komanso kuchuluka kwa kutentha komwe kumafanana ndi chip. Amaperekanso kulumikizana kolunjika kuti akwaniritse zofunikira za phukusi la VCSEL.
1. Kutaya kutentha kwabwino kwambiri
Chitsulo cha DPC ceramic chili ndi kulumikizana kolunjika, kupanga njira zodziyimira pawokha zoyendetsera mkati. Chifukwa chakuti ma ceramic ndi oteteza komanso owongolera kutentha, amatha kupatukana ndi thermoelectric ndikuthetsa bwino vuto la kutayika kwa kutentha kwa ma chips a VCSEL.
2. Kudalirika kwambiri
Mphamvu ya ma chips a VCSEL ndi yokwera kwambiri, ndipo kusagwirizana kwa kutentha pakati pa chip ndi substrate kungayambitse mavuto a kupsinjika. Kuchuluka kwa kutentha kwa ma substrates a ceramic kumagwirizana kwambiri ndi VCSEL. Kuphatikiza apo, ma substrates a DPC ceramic amatha kuphatikiza mafelemu achitsulo ndi ma ceramic substrates kuti apange dzenje lotsekedwa, lokhala ndi kapangidwe kakang'ono, lopanda gawo lapakati lolumikizira, komanso lolimba kwambiri.
3. Kulumikizana kolunjika
Kuyika ma CD a VCSEL kumafuna kuyika lenzi pamwamba pa chip, chifukwa chake payenera kukhazikitsidwa 3D cavity mu substrate. Ma DPC ceramic substrates ali ndi ubwino wolumikizana molunjika komanso kudalirika kwambiri, komwe ndi koyenera kulumikizidwa molunjika.
Pankhani ya chitukuko cha magalimoto anzeru, zipangizo zadothi zikuchita gawo lofunika kwambiri pakukula kwa magalimoto atsopano amphamvu mwanzeru. Monga maziko a ukadaulo wonse, kupanga zinthu zatsopano muukadaulo ndikofunikira kwambiri pothandizira chitukuko chabwino cha makampani onse.
