DPC Ceramic Substrate: uburyo bwiza bwo gupakira utwuma twa LiDAR tw'imodoka
Akamaro ka LiDAR (Kumenya no Gupima Umucyo) ni ugusohora ibimenyetso bya lazeri ya infrared no kugereranya ibimenyetso byagaragaye nyuma yo guhura n'imbogamizi n'ibimenyetso byasohotse, kugira ngo haboneke amakuru nk'aho ibintu biri, intera, icyerekezo, umuvuduko, imiterere, n'imiterere y'ikintu kigamije. Iri koranabuhanga rishobora kugera ku kwirinda inzitizi cyangwa kugenda mu buryo bwikora. Nk'icyuma gipima neza cyane, LiDAR ifatwa nk'urufunguzo rwo kugera ku gutwara mu buryo bwikora ku rwego rwo hejuru, kandi akamaro kayo kararushaho kugaragara.
Inkomoko y'urumuri rwa laser igaragara mu bice by'ingenzi bya LiDAR y'imodoka. Kuri ubu, isoko y'urumuri ya VCSEL (vertical cavity surface emitting laser) yabaye amahitamo meza kuri LiDAR y'ubwoko bwa hybrid solid-state na flash LiDAR mu modoka bitewe n'igiciro cyayo gito cyo gukora, kwizerwa cyane, inguni nto yo gutandukana, no guhuza kwayo mu buryo bworoshye bwa 2D. Chip ya VCSEL ishobora kugera ku ntera ndende yo kumenya, kumenya neza, no kubahiriza amahame akomeye y'umutekano w'amaso muri LiDAR y'ubwoko bwa hybrid solid-state y'imodoka. Byongeye kandi, bituma Flash LiDAR igera ku buryo bworoshye kandi bwagutse, kandi ikagira inyungu zikomeye ku giciro.
Ibikoresho bya ceramic byahindutse ibikoresho byiza byo gupfunyikamo ibice binini bya LiDAR mu modoka.
Ibyuma bya DPC (Direct Copper Plating) bifite ubushobozi bwo gutwara ubushyuhe bwinshi, ubushyuhe bwinshi, ubuziranenge bwo kuzenguruka, ubushyuhe bwinshi, hamwe n'uburyo bwo kwagura ubushyuhe bujyanye na chip. Bitanga kandi uburyo bwo guhuza imiterere kugira ngo bihuze n'ibisabwa mu gupfunyika bya VCSEL.
1. Gukwirakwiza ubushyuhe neza cyane
Igice cya DPC ceramic gifite aho gihurira gihagaze, kigakora imiyoboro yigenga y’imbere itwara umuriro. Bitewe n’uko ceramic ari insulators na conductors z’ubushyuhe, zishobora gutandukanya ubushyuhe no gukemura neza ikibazo cyo gushonga k’ubushyuhe bwa VCSEL chips.
2. Kwizerwa cyane
Ubucucike bw'ingufu za VCSEL burakabije cyane, kandi kudahuza kw'ubushyuhe hagati ya chip na substrate bishobora gutera ibibazo by'stress. Ingano y'ubushyuhe bwa substrate za ceramic irahuye cyane na VCSEL. Byongeye kandi, substrate za ceramic za DPC zishobora guhuza ibyuma n'ingufu za ceramic kugira ngo bikore umwobo ufunze, ufite imiterere mito, nta gice cyo hagati cyo gufatanya, kandi ufite umwuka mwinshi.
3. Guhuza imiterere y'aho uhagaze
Gupfunyika VCSEL bisaba gushyiraho lens hejuru ya chip, bityo rero hagomba gushyirwamo umwobo wa 3D muri substrate. Substrate za DPC ceramic zifite akarusho ko guhuza vertical hamwe n'ubwizerwe bwo hejuru, bikaba bikwiye gukoreshwa mu guhuza vertical eutectic.
Mu rwego rwo guteza imbere imodoka zifite ubwenge, ibikoresho bya ceramic birimo kugira uruhare runini mu iterambere ry’imodoka nshya zikoresha ingufu. Nk’ishingiro ry’ikoranabuhanga ryose, guhanga udushya mu ikoranabuhanga ni ingenzi cyane mu gushyigikira iterambere ryiza ry’inganda zose.
