DPC Ceramic Substrate: khetho e ntle bakeng sa ho paka li-chip tsa LiDAR tsa likoloi
Mosebetsi oa LiDAR (Leseli le ho Lekanya le ho Lekanya) ke ho ntša matšoao a laser a infrared le ho bapisa matšoao a bonahatsoang ka mor'a ho kopana le litšitiso le matšoao a ntšitsoeng, e le ho fumana tlhahisoleseling e kang boemo, sebaka, tataiso, lebelo, maikutlo le sebopeho sa sepheo. Theknoloji ena e ka finyella ho qoba litšitiso kapa ho tsamaea ka boikemelo. Joaloka sensor e nepahetseng haholo, LiDAR e nkoa e le senotlolo sa ho fihlela ho khanna ka boikemelo boemong bo phahameng, 'me bohlokoa ba eona bo ntse bo hlahella haholoanyane.
Mehloli ea leseli la laser e hlahella har'a likarolo tsa mantlha tsa LiDAR ea likoloi. Hona joale, mohloli oa leseli oa VCSEL (vertical cavity surface emitting laser) e se e le khetho e ratoang bakeng sa LiDAR e kopaneng ea boemo bo tiileng le flash LiDAR likoloing ka lebaka la litšenyehelo tsa eona tse tlase tsa tlhahiso, ts'epo e phahameng, angle e nyane ea ho fapana, le kopanyo e bonolo ea 2D. Chip ea VCSEL e ka fihlella sebaka se selelele sa ho lemoha, ho nepahala ho phahameng ha pono, le ho latela maemo a thata a polokeho ea mahlo ho LiDAR e kopaneng ea boemo bo tiileng. Ho feta moo, li nolofalletsa Flash LiDAR ho fihlela pono e tenyetsehang le e pharaletseng haholoanyane, 'me li na le melemo e meholo ea litšenyehelo.
Lisebelisoa tsa letsopa li fetohile thepa e ntle ea ho paka li-chip bakeng sa lits'ebetso tsa LiDAR tsa likoloi.
Di-substrate tsa letsopa tsa DPC (Direct Copper Plating) di na le motlakase o phahameng, ho kenya mocheso o phahameng, ho nepahala ha potoloho e phahameng, boreledi bo phahameng ba bokahodimo, le coefficient ya katoloso ya mocheso e tsamaellanang le chip. Di boetse di fana ka kgokelo e otlolohileng ho fihlela ditlhoko tsa sephutheloana tsa VCSEL.
1. Ho qhala mocheso hantle haholo
Karolo e ka tlase ea ceramic ea DPC e na le khokahano e otlolohileng, e etsang likanale tse ikemetseng tsa ka hare tsa ho tsamaisa motlakase. Ka lebaka la hore li-ceramic ke li-insulator le li-conductor tsa mocheso, li ka finyella karohano ea thermoelectric le ho rarolla bothata ba ho qhala ha mocheso oa li-chips tsa VCSEL ka katleho.
2. Ho tšepahala ho phahameng
Botebo ba matla a di-chip tsa VCSEL bo hodimo haholo, mme ho se tshwane ha katoloso ya mocheso pakeng tsa chip le substrate ho ka lebisa mathateng a kgatello. Coefficient ya katoloso ya mocheso ya di-substrate tsa ceramic e tsamaellana haholo le VCSEL. Ho phaella moo, di-substrate tsa ceramic tsa DPC di ka kopanya diforeimi tsa tshepe le di-substrate tsa ceramic ho etsa mokoti o kwaletsweng, o nang le sebopeho se kopaneng, o se nang lera la ho kopanya le mahareng, le ho tiya ha moya ho hoholo.
3. Khokahano e otlolohileng
Sephutheloana sa VCSEL se hloka ho kenngwa ha lense ka hodima chip, ka hona ho hlokahala hore ho be le sekoti sa 3D ka hara substrate. Di-substrate tsa ceramic tsa DPC di na le monyetla wa ho hokahana ka ho otloloha ka tshepahalo e hodimo, tse loketseng ho kopanngwa ka ho otloloha ha eutectic.
Moelelong oa nts'etsopele ea likoloi tse bohlale, thepa ea letsopa e bapala karolo ea bohlokoa haholoanyane nts'etsopele e bohlale ea likoloi tse ncha tsa matla. Jwalo ka motheo oa sehlopha sohle sa theknoloji, boqapi bo tsoelang pele theknolojing ea thepa bo bohlokoa bakeng sa ho tšehetsa nts'etsopele e sebetsang hantle ea indasteri eohle.
