Kev Tshawb Fawb Txog Kev Siv Tshuab Luam Ntawv Circuit Board (PCB): Hom, Cov Khoom Siv, Cov Ntawv Thov, thiab Cov Qauv Yav Tom Ntej
Ua ib feem tseem ceeb ntawm cov khoom siv hluav taws xob, Lub Rooj Tswjhwm Luam Tawm (PCB) ua haujlwm ua lub hauv paus ntawm lub cev hluav taws xob, ua cov haujlwm tseem ceeb ntawm kev muab kev txhawb nqa thiab kev sib txuas hluav taws xob rau cov khoom siv hluav taws xob. Nrog rau kev txhim kho sai ntawm cov thev naus laus zis hluav taws xob, xws li kev nqa tau yooj yim ntawm cov xov tooj ntse mus rau kev suav lej ua haujlwm siab hauv cov chaw khaws ntaub ntawv, los ntawm kev xa xov ceev hauv kev sib txuas lus 5G mus rau kev tswj hwm nyuaj hauv kev tsav tsheb tsis siv neeg, ntau yam kev siv ua rau muaj ntau yam kev xav tau rau kev ua haujlwm, qauv, thiab txheej txheem ntawm PCBs. Qhov no tau ua rau muaj ntau hom PCB. Kev nkag siab zoo txog ntau yam ntxwv ntawm PCBs yog qhov tseem ceeb rau cov kws ua haujlwm hluav taws xob, cov kws tshawb fawb thiab cov neeg tsim khoom, nrog rau cov kws tshaj lij hauv kev lag luam cuam tshuam, kom ua kom zoo dua cov qauv hluav taws xob thiab txhim kho kev ua haujlwm ntawm cov khoom.
Ib 、 Kev Tshawb Fawb Txog PCBs Uas Muab Faib Los Ntawm Cov Khoom Siv Substrate
(Ib) Cov PCBs Rigid
Cov PCBs ruaj khov, nrog lawv qhov kev ruaj khov thiab lub zog zoo heev, tau dhau los ua qhov kev xaiv tseem ceeb rau ntau yam khoom siv hluav taws xob. Cov ntaub ntawv iav fiber, xws li E-iav thiab S-iav, yog siv dav hauv kev tsim cov PCBs ruaj khov vim lawv cov khoom rwb thaiv tsev zoo heev thiab lub zog kho tshuab. Ntawm lawv, E-iav fiber muaj kev siv nyiaj ntau thiab feem ntau pom muaj nyob rau hauv cov khoom siv hluav taws xob dav dav; S-iav fiber, ntawm qhov tod tes, muaj lub zog thiab modulus siab dua, ua rau nws haum rau cov teb uas muaj cov kev cai nruj rau cov khoom siv kho tshuab.
Cov PCBs ruaj khov ua los ntawm cov khoom polyimide (PI) muaj cov yam ntxwv xws li kev tiv taus kub siab (muaj peev xwm ua haujlwm tas mus li saum 200 ° C), kev rwb thaiv tsev siab (nrog rau qhov dielectric tas mus li qis li 3), thiab kev ruaj khov tshuaj zoo heev. Lawv feem ntau siv rau hauv cov xwm txheej xav tau siab xws li aerospace thiab tub rog hluav taws xob. FR-4, ua cov khoom siv substrate feem ntau siv rau cov PCBs ruaj khov, yog laminated los ntawm epoxy resin-impregnated iav fiber daim ntaub. Nws muaj cov khoom hluav taws xob zoo (nrog rau qhov ntim resistivity ntawm ntau dua 10 ^ 14Ω · cm) thiab nplaim taws retardancy (ua tau raws li UL94V-0 nplaim taws retardant qib), thiab siv dav hauv cov khoom siv hluav taws xob pej xeem xws li khoos phis tawj thiab cov khoom siv sib txuas lus.
Raws li cov khoom sib xyaw ua ke tooj liab-clad laminates, CEM-1 thiab CEM-3 muaj lawv tus kheej cov yam ntxwv. CEM-1, muaj kev sib xyaw ua ke ntawm cov iav lev thiab daim ntawv hauv paus, muaj tus nqi qis dua thiab qee yam khoom siv hluav taws xob, ua rau nws tsim nyog rau cov khoom siv hluav taws xob uas tsis tshua muaj nqi. CEM-3, raws li lub hauv paus iav fiber, zoo heev hauv kev ua kom nyias thiab kev ua haujlwm kho tshuab, thiab feem ntau siv rau hauv cov khoom siv hluav taws xob me me.
(Ob) Cov PCBs Yooj Yim (FPCs)
Cov PCBs uas yooj ywm (FPCs), nrog lawv qhov tshwj xeeb uas khoov tau thiab nyias nyias, tuav txoj haujlwm tseem ceeb hauv cov khoom siv hluav taws xob uas muaj qhov chaw tsawg. Polyimide (PI) yog ib qho ntawm cov khoom siv tseem ceeb rau FPCs. Nws muaj kev ywj pheej zoo heev (muaj peev xwm tiv taus ntau lab lub voj voog khoov), tiv taus kub siab (nrog rau qhov kub ua haujlwm ntev tshaj 150 ° C), thiab cov khoom siv hluav taws xob zoo (nrog rau dielectric loss tangent qis li 0.002).
Cov ntaub ntawv zaj duab xis polyester xws li polyethylene terephthalate (PET) thiab polyethylene naphthalate (PEN) kuj feem ntau siv rau hauv FPCs. Lawv muaj qhov zoo ntawm tus nqi qis thiab kev ua haujlwm zoo, tab sis qis dua PI me ntsis hauv kev tiv taus kub thiab cov khoom siv hluav taws xob. Cov yam ntxwv tseem ceeb rau kev ntsuas kev ua tau zoo ntawm FPCs, xws li lub vojvoog khoov thiab tus lej ntawm cov voj voog khoov uas nws tuaj yeem ua tau, cuam tshuam ncaj qha rau kev ntseeg tau thiab lub neej ua haujlwm ntawm FPCs hauv kev siv tiag tiag.
(Peb) Cov PCBs Rigid-Flex
Cov PCBs uas ruaj khov thiab yoog tau sib xyaw ua ke cov txiaj ntsig ntawm cov PCBs ruaj khov thiab cov PCBs uas yoog tau yooj yim. Hauv cov cheeb tsam ruaj khov, cov khoom siv substrate zoo ib yam li cov uas siv hauv cov PCBs ruaj khov, xws li FR-4 lossis PI cov laug cam ruaj khov, feem ntau yog siv los muab kev txhawb nqa thiab kev ruaj khov rau lub rooj tsavxwm circuit, kom ntseeg tau tias muaj kev teeb tsa ntawm cov khoom siv hluav taws xob thiab kev sib txuas hluav taws xob. Hauv cov cheeb tsam ruaj khov, cov khoom siv substrate ruaj khov, xws li PI cov yeeb yaj kiab ywj pheej, yog siv los ua kom lub rooj tsavxwm circuit khoov tau.
Cov thev naus laus zis tseem ceeb ntawm cov PCBs rigid-flex yog nyob rau hauv cov txheej txheem kev sib txuas ntawm cov cheeb tsam rigid thiab flexible. Cov txheej txheem kev sib txuas feem ntau suav nrog laser vuam thiab nplaum sib txuas. Kev ntseeg tau ntawm cov khoom sib txuas thiab kev tsim qauv ntawm kev txo kev ntxhov siab yog cov yam tseem ceeb rau kev ua kom ntseeg tau tias cov PCBs rigid-flex ua haujlwm tau zoo. Kev tsim qauv tsim nyog tuaj yeem tiv thaiv cov teeb meem xws li kev sib txuas tsis ua haujlwm lossis kev xa xov tsis zoo thaum lub sijhawm khoov.
2, Cov yam ntxwv ntawm PCBs faib los ntawm tus naj npawb ntawm cov txheej txheem conductive
(Ib) Ib Sab PCBs
Ua ib hom PCB yooj yim, PCB ib sab muaj cov ntawv ci tooj liab ntawm ib sab xwb thiab ua tiav cov haujlwm ntawm lub voj voog los ntawm kev sib txuas ib sab. Nws cov qauv voj voog yooj yim heev, ua rau nws haum rau qee cov khoom siv hluav taws xob uas tsis tas yuav ua haujlwm ntau, xws li cov laug cam tswj cov khoom siv hauv tsev yooj yim thiab cov laug cam ua si. Cov txheej txheem tsim cov PCB ib sab yog qhov yooj yim heev, feem ntau suav nrog cov kauj ruam xws li kev kos cov ntawv ci tooj liab, kev luam ntawv lub ntsej muag solder, thiab kev luam ntawv cim, thiab tus nqi qis heev. Txawm li cas los xij, vim yog qhov chaw sib txuas tsawg, qhov nyuaj ntawm lub voj voog thiab kev nthuav dav ntawm cov PCB ib sab yog qee yam txwv.
(ob) Cov PCBs Ob Sab
Ib lub PCB ob sab muaj cov ntawv ci tooj liab rau ob sab ntawm lub rooj tsavxwm thiab ua tiav kev sib txuas hluav taws xob ntawm ob sab los ntawm vias (metallized vias). Cov txheej txheem tsim khoom ntawm vias feem ntau suav nrog cov kauj ruam xws li drilling, electroless tooj liab plating, thiab electroplating kom ntseeg tau tias muaj kev coj hluav taws xob zoo ntawm phab ntsa sab hauv ntawm vias. Qhov nyuaj ntawm lub voj voog thiab kev ua haujlwm ntawm ob sab PCBs tau zoo dua piv rau ib sab PCBs, thiab lawv tuaj yeem siv rau hauv cov motherboard computer, qee cov modules ntawm cov khoom siv sib txuas lus, thiab lwm yam.
Hauv kev tsim cov PCBs ob sab, kev npaj cov xov hlau thiab kev teeb tsa ntawm cov xov hlau yog cov yam tseem ceeb. Kev tsim qauv zoo tuaj yeem txo qhov cuam tshuam ntawm cov teeb liab thiab txhim kho kev ncaj ncees thiab kev ruaj khov ntawm kev xa cov teeb liab.
(Peb) Cov PCBs ntau txheej
Cov PCBs ntau txheej muaj ntau txheej conductive (feem ntau yog 4 txheej lossis ntau dua), uas tau sib cais los ntawm cov txheej insulating (xws li cov ntawv prepreg, cov ntawv PP). Ntxiv nrog rau cov qhov through holes, cov thev naus laus zis blind via thiab buried via kuj tau siv dav hauv cov PCBs ntau txheej. Blind via yog lub qhov conductive uas txuas ntxiv los ntawm qhov chaw ntawm lub rooj tsavxwm circuit mus rau ib txheej sab hauv thiab tsis nkag mus rau tag nrho lub rooj tsavxwm circuit; buried via yog lub qhov txuas conductive ntawm cov txheej sab hauv thiab tsis raug nthuav tawm ntawm qhov chaw ntawm lub rooj tsavxwm circuit.
Kev siv cov thev naus laus zis dig muag thiab faus ntawm qhov chaw ua haujlwm txo cov vias ntawm qhov chaw ntawm lub rooj tsavxwm thiab txhim kho qhov ceev ntawm cov xov hlau thiab kev ua haujlwm ntawm kev xa cov teeb liab. Cov PCBs ntau txheej tuaj yeem ua tiav cov xov hlau ceev thiab kev xa cov teeb liab ua haujlwm tau zoo, thiab siv dav hauv cov khoom siv hluav taws xob siab, xws li cov motherboard server, cov motherboard smartphone, thiab cov duab ua haujlwm tau zoo. Hauv cov txheej txheem tsim khoom ntawm cov PCBs ntau txheej, cov yam xws li cov txheej txheem lamination, qhov tseeb ntawm kev khawb, thiab qhov zoo ntawm electroplating muaj qhov cuam tshuam loj rau kev ua haujlwm thiab kev ntseeg siab ntawm lub rooj tsavxwm.
peb,Cov Ntsiab Lus Tseem Ceeb ntawm PCBs Faib Los Ntawm Cov Txheej Txheem Tshwj Xeeb
(Ib) Cov PCBs Zaus Siab
Cov PCBs uas muaj zaus siab feem ntau yog siv rau hauv cov khoom siv hluav taws xob uas tswj cov teeb liab zaus siab, xws li kev sib txuas lus wireless, radar, thiab lwm yam. Thaum lub sijhawm xa cov teeb liab zaus siab, cov teeb meem xws li kev poob teeb liab thiab kev cuam tshuam theem yog qhov tseem ceeb heev. Yog li ntawd, cov PCBs uas muaj zaus siab yuav tsum siv cov khoom siv tshwj xeeb los txo qhov poob teeb liab thiab txhim kho qhov zoo ntawm kev xa cov teeb liab.
Cov khoom siv Rogers yog ib qho ntawm cov khoom siv substrate feem ntau siv rau cov PCBs siab zaus. Nws muaj qhov dielectric tsis tu ncua qis heev (Dk tuaj yeem qis li ntawm 2.2) thiab poob tangent (Df qis li 0.0009), uas tuaj yeem txo qhov teeb liab poob thiab kev cuam tshuam thaum lub sijhawm kis. Polytetrafluoroethylene (PTFE) thiab nws cov ntaub ntawv puv kuj feem ntau siv rau hauv cov PCBs siab zaus, vim lawv muaj cov khoom hluav taws xob zoo thiab kev ruaj khov tshuaj lom neeg.
Hauv kev tsim thiab tsim cov PCBs uas muaj zaus ntau, ntxiv rau kev xaiv cov khoom siv, kev tsim cov yam xws li kev teeb tsa lub voj voog, kev sib phim impedance, thiab kev tiv thaiv hluav taws xob kuj tseem ceeb heev. Kev teeb tsa lub voj voog tsim nyog tuaj yeem txo qhov cuam tshuam ntawm cov teeb liab, kev sib phim impedance meej tuaj yeem ua kom muaj kev xa cov teeb liab zoo, thiab kev tiv thaiv hluav taws xob zoo tuaj yeem tiv thaiv cov teeb liab zaus ntau los ntawm kev cuam tshuam rau cov voj voog ib puag ncig.
(ob) Cov PCBs Ua Los Ntawm Hlau
Cov PCBs ua los ntawm hlau, nrog lawv cov kev ua haujlwm zoo heev ntawm kev ua kom sov, tau dhau los ua qhov kev xaiv zoo tshaj plaws rau cov khoom siv hluav taws xob muaj zog heev. Cov ntaub ntawv siv hlau feem ntau suav nrog txhuas thiab tooj liab. Cov khoom siv txhuas muaj kev ua haujlwm zoo ntawm kev ua kom sov thiab tus nqi qis, thiab siv dav hauv cov teb xws li teeb pom kev zoo LED thiab cov khoom siv fais fab. Cov khoom siv tooj liab muaj kev ua kom sov siab dua (kwv yees li 1.6 npaug ntawm txhuas) thiab tsim nyog rau cov xwm txheej uas xav tau kev ua kom sov siab heev, xws li cov voj voog tsav tsheb muaj zog siab.
Lub hauv paus ntsiab lus ntawm kev tshem tawm cua sov ntawm cov PCBs uas ua los ntawm hlau yog kom sai sai coj cov cua sov uas tsim los ntawm cov khoom siv hluav taws xob los ntawm cov hlau substrate. Txhawm rau txhim kho qhov ua tau zoo ntawm kev tshem tawm cua sov, ib txheej rwb thaiv tsev thermally conductive, xws li cov ntaub qhwv silicone thermally conductive lossis cov nplaum thermally conductive insulating, feem ntau yog ntxiv rau ntawm cov hlau substrate thiab cov khoom siv hluav taws xob. Hauv cov txheej txheem tsim cov PCBs uas ua los ntawm hlau, kev tswj qhov tuab ntawm cov txheej rwb thaiv tsev thiab lub zog sib txuas nrog cov hlau substrate yog cov yam tseem ceeb rau kev ua kom lawv ua tau zoo.
(Peb) HDI PCBs (High-Density Interconnect PCBs)
HDI PCBs (High-Density Interconnect PCBs), nrog lawv cov yam ntxwv ntawm kev sib txuas lus ceev ceev thiab miniaturization, ua tau raws li cov kev cai nruj ntawm cov khoom siv hluav taws xob niaj hnub rau qhov chaw thiab kev ua tau zoo. Cov thev naus laus zis tseem ceeb ntawm HDI PCBs yog nyob rau hauv kev tsim cov micro-vias (Micro-Vias) thiab kev etching ntawm cov kab zoo. Lub cheeb tsam ntawm micro-vias feem ntau tsawg dua 0.1 hli thiab yog tsim los ntawm kev siv cov thev naus laus zis siab heev xws li laser drilling lossis plasma etching.
Kev txiav cov kab zoo yuav tsum muaj cov khoom siv txiav zoo thiab kev tswj cov txheej txheem kom ua tiav cov xov hlau zoo nrog qhov dav ntawm kab / kab suab tsawg dua 30μm / 30μm. HDI PCBs feem ntau siv cov thev naus laus zis tsim, ua tiav kev sib txuas lus siab los ntawm kev sib sau ua ke ntawm cov khaubncaws sab nraud povtseg rwb thaiv tsev thiab cov khaubncaws sab nraud povtseg hluav taws xob txheej los ntawm txheej. HDI PCBs siv dav hauv cov khoom siv hluav taws xob me me xws li xov tooj ntse, ntsiav tshuaj, thiab cov khoom siv hnav tau, thiab yog ib qho ntawm cov thev naus laus zis tseem ceeb rau kev ua tiav kev ua tau zoo thiab me me ntawm cov khoom siv no.
Cov Rooj Tsav Tsheb IC (IC Carrier Boards)
Cov khoom siv IC (IC carrier boards) feem ntau yog siv rau kev ntim khoom rau hauv chip, xws li BGA (Ball Grid Array) ntim, QFN (Quad Flat No-Lead) ntim, thiab FC (Flip Chip) ntim, thiab lwm yam. Cov khoom siv IC yuav tsum muaj cov yam ntxwv ntawm kev sib txuas ceev ceev thiab kev ua haujlwm siab kom ua tiav kev sib txuas ntawm lub chip thiab lub voj voog sab nraud.
Feem ntau cov IC substrates siv cov qauv tsim ntau txheej, thiab muaj cov kev cai nruj rau kev ua kom raug ntawm kab, qhov loj me, thiab qhov chaw thaum lub sijhawm tsim khoom. Tib lub sijhawm, IC substrates kuj yuav tsum xav txog kev tswj hwm kev tso cua sov thiab kev ua haujlwm hluav taws xob kom ntseeg tau tias muaj kev ruaj khov thiab kev ntseeg siab ntawm lub nti thaum lub sijhawm ua haujlwm. Nrog rau kev txhim kho tas mus li ntawm cov thev naus laus zis nti, cov kev cai rau kev ua tau zoo thiab kev ua kom raug ntawm IC substrates kuj tseem nce ntxiv tas li.
5, Cov yam ntxwv ntawm PCBs raug cais los ntawm cov qauv ntawm Conductive Vias
(Ib) Cov Rooj Sib Tham Txog Qhov
Lub rooj tsavxwm through-hole yog ib hom PCBs uas siv ntau tshaj plaws. Nws cov conductive vias nkag mus rau hauv txheej sab saud mus rau txheej hauv qab ntawm lub rooj tsavxwm circuit, thiab kev sib txuas hluav taws xob ntawm cov txheej yog ua tiav los ntawm cov txheej txheem electroplating via. Lub via diameter thiab tooj liab tuab ntawm phab ntsa via ntawm lub rooj tsavxwm through-hole yog cov yam ntxwv tseem ceeb uas cuam tshuam rau nws cov kev ua haujlwm hluav taws xob thiab lub zog kho tshuab.
Ib txoj kab uas hla loj dua yog qhov zoo rau kev teeb tsa cov khoom siv plug-in, tab sis nws yuav siv ntau qhov chaw xov hlau; qhov tuab tooj liab tsis txaus ntawm phab ntsa via yuav ua rau muaj kev sib txuas hluav taws xob tsis txhim khu kev qha. Thaum lub sijhawm tsim khoom ntawm lub rooj tsavxwm through-hole, qhov kev txiav txim siab ntawm qhov vias thiab qhov zoo ntawm electroplating muaj qhov cuam tshuam tseem ceeb rau kev ua haujlwm ntawm lub rooj tsavxwm circuit. Tsis tas li ntawd, lub rooj tsavxwm through-hole kuj tseem tuaj yeem siv cov txheej txheem via filling, xws li resin filling, los txhim kho nws qhov kev ntseeg tau thiab kev tiv thaiv dej noo.
(ob) Micro-Via Boards
Cov laug cam Micro-via siv cov vias conductive nrog cov kab uas me me (feem ntau tsawg dua 0.15 hli), xws li cov micro-vias dig muag thiab cov micro-vias faus. Kev tsim cov micro-vias feem ntau siv laser drilling lossis plasma etching technology, thiab cov thev naus laus zis no tuaj yeem ua tiav kev tsim cov micro-vias nrog qhov tseeb siab kom ua tau raws li qhov xav tau ntawm cov xov hlau ceev.
Cov micro-vias ntawm micro-via boards muaj cov kab uas me me thiab muaj ntau tus lej, uas tuaj yeem ua tiav ntau qhov kev sib txuas hluav taws xob hauv qhov chaw tsawg thiab txhim kho qib kev sib koom ua ke thiab kev ua tau zoo ntawm lub rooj tsavxwm circuit. Thaum lub sijhawm tsim thiab tsim cov txheej txheem ntawm micro-via boards, cov txheej txheem sau thiab kho qhov chaw ntawm micro-vias yuav tsum tau txiav txim siab kom ntseeg tau tias muaj kev ua haujlwm hluav taws xob thiab kev ntseeg siab ntawm micro-vias.
(III) Cov Rooj Tswjhwm Dig Muag
Cov qhov txuas hluav taws xob ntawm cov laug cam dig muag tsuas yog txuas ntxiv los ntawm qhov chaw ntawm lub rooj tsavxwm mus rau ib txheej sab hauv thiab tsis nkag mus rau hauv tag nrho lub rooj tsavxwm. Qhov muaj cov qhov txuas dig muag tuaj yeem txo cov qhov txuas ntawm qhov chaw ntawm lub rooj tsavxwm, ua rau cov xov hlau ntom ntom dua, thiab tseem txo qhov cuam tshuam ntawm cov teeb liab thaum lub sijhawm xa xov.
Cov txheej txheem tsim ntawm cov vias dig muag suav nrog laser drilling, electroplating tom qab mechanical drilling, thiab lwm yam. Cov txheej txheem sib txawv muaj qhov cuam tshuam sib txawv rau qhov zoo thiab tus nqi ntawm cov vias dig muag. Hauv kev tsim cov laug cam dig muag, qhov chaw thiab qhov ntau ntawm cov vias dig muag yuav tsum tau npaj kom zoo kom muab kev ua si tag nrho rau lawv cov txiaj ntsig thiab txhim kho kev ua tau zoo ntawm lub rooj tsavxwm.
(Tom qab) High-Density Interconnect (HDI) Boards
Cov laug cam High-Density Interconnect (HDI) yog cov yam ntxwv los ntawm kev sib txuas ua ke siab, me me ntawm txoj kab uas hla, thiab cov kab zoo, thiab yog ib qho ntawm cov thev naus laus zis tseem ceeb rau kev ua tiav qhov me me thiab kev ua tau zoo ntawm cov khoom siv hluav taws xob. Ntxiv nrog rau kev siv cov vias conductive me me, HDI boards kuj ua tiav cov xov hlau zoo nrog qhov dav kab / kab suab tsawg dua 30μm / 30μm los ntawm cov thev naus laus zis zoo etching.
Feem ntau HDI boards siv cov thev naus laus zis los tsim cov khoom siv hluav taws xob, ua kom muaj kev sib txuas ceev ceev los ntawm kev sib sau ua ke ntawm cov khaubncaws sab nraud povtseg rwb thaiv tsev thiab cov khaubncaws sab nraud povtseg hluav taws xob. Thaum lub sijhawm tsim cov HDI boards, cov khoom siv, cov khoom siv, thiab cov txheej txheem yuav tsum tau ua kom zoo heev, thiab qhov zoo ntawm txhua qhov txuas yuav tsum tau tswj hwm kom ntseeg tau tias lub rooj tsavxwm muaj kev ua haujlwm thiab kev ntseeg siab.
Xaus lus
Ua ib lub hauv paus tseem ceeb ntawm kev siv tshuab hluav taws xob, ntau hom thiab qhov nyuaj ntawm cov thev naus laus zis ntawm cov laug cam luam tawm muab kev txhawb nqa zoo rau kev tsim kho tshiab thiab kev txhim kho ntawm cov khoom siv hluav taws xob. Txij li kev xaiv cov ntaub ntawv substrate mus rau kev tsim cov txheej txheem conductive, los ntawm kev siv cov txheej txheem tshwj xeeb mus rau kev txiav txim siab ntawm cov txheej txheem kho qhov chaw, thiab tom qab ntawd mus rau qhov xav tau kev siv tshuab ntawm ntau daim ntawv thov thiab cov yam ntxwv ntawm cov qauv ntawm conductive vias, txhua qhov txuas muaj cov ntsiab lus nplua nuj.
Nrog rau kev nce qib tas mus li ntawm cov thev naus laus zis hluav taws xob, xws li kev txhim kho sai ntawm cov thev naus laus zis tshiab xws li kev txawj ntse ntawm lub tshuab, Is Taws Nem ntawm Yam, thiab cov ntaub ntawv loj, cov kev xav tau siab dua yuav raug muab tso rau pem hauv ntej rau kev ua tau zoo thiab kev ua haujlwm ntawm PCBs. Yav tom ntej, cov thev naus laus zis PCB yuav txhim kho mus rau qhov kev coj ua ntawm qhov ceev dua, kev ua tau zoo dua, tus nqi qis dua, thiab kev tiv thaiv ib puag ncig zoo dua, txuas ntxiv txhawb nqa kev me me, kev txawj ntse, thiab kev txhim kho kev ua tau zoo ntawm cov khoom siv hluav taws xob. Cov kws ua haujlwm hluav taws xob thiab cov kws tshaj lij hauv kev lag luam cuam tshuam yuav tsum tau ua tib zoo saib xyuas cov qauv kev txhim kho ntawm cov thev naus laus zis PCB, txuas ntxiv tsim kho tshiab thiab ua kom zoo dua cov qauv tsim kom tau raws li kev thov kev lag luam thiab cov teeb meem kev siv tshuab.
Cov Lus Nug Feem Ntau:
Q1. Cov ntaub ntawv substrate feem ntau rau cov PCBs rigid yog dab tsi?
Cov ntaub ntawv siv rau cov PCBs ruaj khov suav nrog cov iav fibers (xws li E-iav, S-iav, thiab lwm yam), polyimide (PI), FR-4 (lub laminate tooj liab-clad uas tsis muaj hluav taws kub uas muaj epoxy resin thiab daim ntaub iav fiber), CEM-1 (lub laminate tooj liab-clad uas muaj daim lev iav thiab daim ntawv), thiab CEM-3 (lub laminate tooj liab-clad uas muaj lub hauv paus iav fiber).
Q2. Vim li cas cov PCBs uas yoog tau thiaj li tsim nyog rau cov khoom siv hnav tau?
Cov PCBs uas yooj ywm tau zoo rau cov khoom siv hnav tau vim lawv cov khoom siv tseem ceeb xws li polyimide (PI), polyethylene terephthalate (PET), thiab lwm yam ua rau lawv yooj ywm tau zoo, ua rau lawv khoov tau, quav tau, thiab nkhaus tau hauv qee qhov ntau, uas tuaj yeem hloov kho rau cov duab nyuaj ntawm cov khoom siv hnav tau uas haum rau tib neeg lub cev. Tib lub sijhawm, lawv kuj muaj cov yam ntxwv ntawm kev nyias thiab lub teeb, thiab yuav tsis ua rau tus neeg hnav hnyav dhau, ua tau raws li qhov xav tau ntawm cov khoom siv hnav tau rau qhov chaw thiab kev nplij siab.
Q3. Cov haujlwm ntawm thaj chaw nruj thiab thaj chaw ywj pheej hauv PCB nruj-flex yog dab tsi?
Hauv thaj chaw nruj ntawm PCB nruj-flex, cov ntaub ntawv tawv tawv xws li FR-4 lossis PI tawv boards feem ntau yog siv los muab kev txhawb nqa thiab kev ruaj khov, ua kom muaj zog ntawm lub rooj tsavxwm thaum lub sijhawm teeb tsa thiab siv. Thaj chaw ywj pheej, ntawm qhov tod tes, siv cov ntaub ntawv tawv tawv xws li PI cov yeeb yaj kiab ywj pheej los ua tiav qhov kev ua haujlwm khoov, yog li hloov kho rau cov duab hloov pauv ntawm lub cuab yeej hauv ntau qhov xwm txheej siv thiab ua tau raws li qhov xav tau ntawm kev ua haujlwm kho tshuab thiab hluav taws xob nyuaj.
Q4. Qhov txawv tseem ceeb ntawm cov PCB ib sab thiab cov PCB ob sab yog dab tsi?
Ib lub PCB ib sab muaj cov ntawv ci tooj liab ntawm ib sab xwb thiab siv rau kev txuas hluav taws xob ib sab. Nws qhov nyuaj ntawm lub voj voog tsis tshua muaj, thiab nws tsim nyog rau cov khoom siv hluav taws xob yooj yim. Cov txheej txheem tsim khoom yooj yim thiab tus nqi qis, tab sis nws cov haujlwm thiab qhov chaw txuas hluav taws xob muaj tsawg. Ib lub PCB ob sab muaj cov ntawv ci tooj liab ntawm ob sab, thiab kev sib txuas hluav taws xob ntawm ob sab yog ua tiav los ntawm vias (feem ntau yog metallized vias). Qhov nyuaj ntawm lub voj voog yog nruab nrab, thiab nws tuaj yeem ua tiav ntau yam haujlwm nrog ntau yam kev siv dav dua, xws li cov motherboard computer, cov khoom siv sib txuas lus, thiab lwm yam.
Q5. Cov haujlwm ntawm cov vias dig muag thiab cov vias faus hauv cov PCBs ntau txheej yog dab tsi?
Cov vias dig muag hauv cov PCBs ntau txheej yog cov qhov uas txuas ntxiv los ntawm qhov chaw mus rau ib txheej sab hauv thiab tsis nkag mus rau hauv tag nrho lub rooj tsavxwm. Lawv tuaj yeem siv rau kev sib txuas hluav taws xob ntawm cov txheej tshwj xeeb, txo cov teeb liab cuam tshuam thiab txhim kho kev ua haujlwm ntawm cov teeb liab. Cov vias faus yog kev sib txuas ntawm cov txheej sab hauv thiab tsis raug nthuav tawm ntawm qhov chaw. Lawv tuaj yeem ua tiav kev sib txuas ntawm cov txheej yam tsis siv qhov chaw saum npoo, uas pab kom paub txog cov xov hlau ceev ceev thiab txhim kho kev ua tau zoo thiab qib kev koom ua ke ntawm lub rooj tsavxwm.
Q6.Vim li cas cov PCBs uas muaj zaus siab thiaj li yuav tsum siv cov ntaub ntawv tshwj xeeb?
Cov PCBs uas muaj zaus siab feem ntau yog siv los ua cov teeb liab zaus siab, xws li cov kab hluav taws xob microwave thiab cov kab hluav taws xob millimeter-wave, thiab cov teeb liab yuav poob thaum lub sijhawm xa xov. Cov ntaub ntawv tshwj xeeb xws li cov ntaub ntawv Rogers, polytetrafluoroethylene (PTFE), thiab cov ntaub ntawv ceramic-filled yog siv vim tias cov ntaub ntawv no muaj cov yam ntxwv ntawm dielectric constant qis (Dk) thiab tangent poob qis (Df), uas tuaj yeem txo qhov poob ntawm cov teeb liab, xyuas kom meej tias cov teeb liab muaj kev ncaj ncees, thiab ua tau raws li qhov yuav tsum tau ua ntawm kev xa xov teeb liab zaus siab.
Q7. Cov khoom siv hluav taws xob muaj zog twg uas siv cov hlau PCBs tsim nyog rau?
Cov PCBs uas ua los ntawm hlau yog qhov tsim nyog rau ntau yam khoom siv hluav taws xob muaj zog heev. Piv txwv li, hauv cov modules fais fab, muaj cua sov ntau heev thaum lub sijhawm ua haujlwm, thiab cov PCBs uas ua los ntawm hlau tuaj yeem tso cua sov tawm kom ntseeg tau tias lawv ua haujlwm ib txwm. Rau cov khoom siv teeb pom kev zoo LED, lawv tuaj yeem tso cua sov tawm los ntawm LEDs sai sai, txhim kho kev ua haujlwm ntawm lub teeb thiab lub neej ntawm lub teeb. Rau cov circuits tsav tsheb, lawv tuaj yeem pab tso cua sov tawm thaum lub sijhawm ua haujlwm ntawm lub cev muaj zog, kom ntseeg tau tias lub voj voog ua haujlwm ruaj khov.
Q8. Cov yam ntxwv tseem ceeb ntawm HDI PCBs yog dab tsi?
Cov yam ntxwv tseem ceeb ntawm HDI PCBs suav nrog kev siv cov kab me me (Micro-Via, feem ntau tsawg dua 0.1 hli), uas tau tsim los ntawm cov thev naus laus zis siab heev xws li laser drilling thiab plasma etching; muaj cov kab zoo (Fine Line), uas tuaj yeem ua tiav cov xov hlau zoo nrog qhov dav kab / kab suab tsawg dua 30μm / 30μm; txais yuav cov thev naus laus zis tsim kom nce tus lej ntawm cov khaubncaws sab nraud povtseg thiab ua tiav kev sib txuas ceev ceev; thiab muaj kev sib raug zoo nrog cov txheej txheem sib dhos saum npoo (SMT), uas yog qhov tsim nyog rau cov kev xav tau ntawm cov khoom siv hluav taws xob me me.
Q9. Cov txheej txheej tin saum npoo rau cov PCBs uas muaj tin-sprayed yog dab tsi?
Cov hom txheej tin saum npoo rau cov PCBs uas muaj tin-sprayed muaj xws li pure tin (Pure Tin), tin-lead alloy (Tin-Lead Alloy), thiab lead-free tin spray, xws li Sn-Cu (tin-tooj liab alloy), Sn-Ag-Cu (tin-silver-tooj liab alloy), thiab lwm yam. Lead-free tin spray yog ib hom uas tau maj mam nrov kom ua tau raws li cov kev cai tiv thaiv ib puag ncig.
Q10. Vim li cas cov PCBs uas muaj kub feem ntau siv rau hauv cov khoom siv hluav taws xob siab?
Cov PCBs uas muaj kub plated feem ntau siv rau hauv cov khoom siv hluav taws xob zoo vim tias cov kub hlau uas npog lawv qhov chaw (muab faib ua kub tawv thiab kub mos) tuaj yeem muab kev coj hluav taws xob zoo, txo qhov tsis kam tiv tauj, thiab xyuas kom muaj kev ntseeg siab ntawm kev sib txuas hluav taws xob. Tib lub sijhawm, kub muaj kev ua tau zoo tiv thaiv kev oxidation, uas tuaj yeem tiv taus kev xeb ib puag ncig thiab kev xeb tshuaj lom neeg, txuas lub neej ua haujlwm ntawm lub rooj tsavxwm circuit, thiab ua tau raws li cov kev cai nruj ntawm cov khoom siv hluav taws xob zoo xws li aerospace, khoom siv kho mob, thiab chaw sib txuas lus rau kev ntseeg siab thiab kev ruaj khov.
Q11. Yuav tsum tau them sai sai rau dab tsi thaum khaws cia OSP PCBs?
Cov PCB OSP raug kho nrog cov zaj duab xis organic uas tiv thaiv tau solderability. Lawv lub neej khaws cia luv luv, thiab yuav tsum tau ceev faj txog kev tiv thaiv dej noo. Lawv yuav tsum tau khaws cia rau hauv qhov chaw qhuav thiab qis-av noo kom tsis txhob ua puas tsuaj ntawm cov zaj duab xis organic solderability vim dej noo, uas yuav cuam tshuam rau kev solderability ntawm lub rooj tsavxwm circuit. Tib lub sijhawm, yuav tsum tau ceev faj txog kev ntxuav qhov chaw kom tiv thaiv cov hmoov av thiab cov khoom tsis huv los ntawm kev ua qias tuaj rau ntawm qhov chaw ntawm lub rooj tsavxwm circuit, uas yuav cuam tshuam rau kev vuam thiab kev siv tom qab.
Q12. Cov kev cai ua haujlwm dab tsi uas cov laug cam hauv computer muaj rau PCBs?
Cov laug cam computer xws li motherboards, graphics cards, thiab server boards muaj cov kev cai rau kev ua cov ntaub ntawv ceev ceev thiab kev xa cov ntaub ntawv ntawm PCBs. Lawv yuav tsum txhawb nqa cov txheej txheem xa cov teeb liab ceev ceev xws li PCI-E bus, USB interfaces, thiab SATA interfaces. Lawv yuav tsum muaj kev ua haujlwm hluav taws xob zoo kom ntseeg tau tias cov teeb liab muaj kev ncaj ncees thiab ruaj khov. Lub motherboard yuav tsum tau koom ua ke ntau yam khoom tseem ceeb, xws li chipset, BIOS chip, thiab lub zog fais fab, thiab lwm yam, uas yuav tsum tau ua kom PCB muaj qhov layout tsim nyog thiab qib kev koom ua ke siab. Server boards kuj yuav tsum txhawb nqa ntau lub CPUs thiab lub cim xeeb loj, ua rau muaj kev xav tau ntau dua rau kev nqa lub peev xwm thiab kev ntseeg siab ntawm PCB.
Q13. Vim li cas cov laug cam tsheb thiaj li yuav tsum muaj kev ntseeg siab siab?Cov laug cam tsheb siv rau cov tshuab hluav taws xob hauv tsheb. Thaum lub sijhawm tsav tsheb, cov tsheb yuav ntsib ntau yam teeb meem ib puag ncig nyuaj, xws li kev co, kev cuam tshuam, thiab kev hloov pauv ntawm qhov kub thiab txias siab thiab qis (feem ntau yuav tsum ua haujlwm ib txwm nyob rau hauv qhov kub ntawm -40 ° C txog 125 ° C). Yog tias lub laug cam tsheb tsis muaj kev ntseeg siab txaus, nws yuav ua rau lub tshuab hluav taws xob hauv tsheb tsis ua haujlwm, cuam tshuam rau kev ua haujlwm ib txwm ntawm lub tsheb thiab kev nyab xeeb tsav tsheb. Yog li ntawd, cov laug cam tsheb yuav tsum muaj kev ntseeg siab siab kom ntseeg tau tias kev ua haujlwm ruaj khov hauv qhov chaw ib puag ncig hnyav.
Q14. Lub IC substrate (IC carrier board) ua lub luag haujlwm dab tsi hauv kev ntim khoom chip?
Ib lub IC substrate (IC carrier board) feem ntau ua lub luag haujlwm txuas lub chip thiab lub circuit sab nraud hauv kev ntim khoom chip. Piv txwv li, cov txheej txheem ntim khoom xws li BGA (Ball Grid Array) ntim khoom, QFN (Quad Flat No-Lead) ntim khoom, thiab FC (Flip Chip) ntim khoom txhua yam yuav tsum ua tiav kev sib txuas txhim khu kev qha los ntawm IC substrate. Nws yuav tsum muaj cov yam ntxwv ntawm kev sib txuas ceev ceev thiab kev raug siab kom ua tau raws li qhov xav tau ntawm ntau lub teeb liab xa tawm ntawm lub chip thiab lub circuit sab nraud. Tib lub sijhawm, kev tswj hwm kev tshem tawm cua sov thiab kev ua haujlwm hluav taws xob kuj yuav tsum tau xav txog kom ntseeg tau tias cov cua sov tsim tawm thaum lub sijhawm ua haujlwm ntawm lub chip tuaj yeem tshem tawm tau zoo thiab lub teeb liab tuaj yeem xa tau ruaj khov, kom ntseeg tau tias kev ua haujlwm ib txwm ntawm lub chip.
Q15. Cov micro-vias ntawm cov micro-via boards tau tsim li cas?
Cov micro-vias ntawm micro-via boards feem ntau yog tsim los ntawm laser drilling lossis plasma etching technology. Laser drilling siv lub zog laser siab los irradiate lub circuit board, ua rau cov khoom siv vaporize tam sim ntawd los ua micro-vias. Plasma etching, ntawm qhov tod tes, siv plasma los tshuaj lom neeg react nrog cov khoom siv ntawm lub circuit board kom tshem tawm cov khoom tsis tsim nyog, yog li tsim cov me me via diameters, xws li dig muag micro-vias thiab faus micro-vias, thiab lwm yam, kom ua tiav high-density wiring.
