| Khoom | PCB ruaj khov (HDI) | PCB yooj ywm | PCB Rigid-Flex |
| Txheej Siab Tshaj | 2-68L | 12L | 68L |
| Sab Hauv Txheej Min Trace/Space | 1.4/1.4mil | 2/2mil | 2/2mil |
| Tawm Txheej Min Trace / Space | 1.4/1.4mil | 3/3mil | 3/3mil |
| Sab Hauv Txheej Max Tooj Liab | 6oz | 2oz | 6oz |
| Tawm Txheej Max Tooj Liab | 6oz | 3oz | 6oz |
| Kev Tshawb Fawb Mechanical Min | 0.15 hli / 6mil | 0.15 hli | 0.15 hli |
| Min Laser Drilling | 0.05 hli / 3mil | 0.05 hli | 0.05 hli |
| Max Aspect Ratio (Mechanical Drilling) | 20:1 | / | 20:1 |
| Max Aspect Ratio (Laser Drilling) | 1:1 | 1:1 | 1:1 |
| Kev Sib Tov Sib Txuas | +/-0.254 hli (1mil) | ±0.05 hli | ±0.05 hli |
| Kev kam rau siab PTH | ±0.075 hli | ±0.075 hli | ±0.075 hli |
| NPTH Kev kam rau siab | ±0.05 hli | ±0.05 hli | ±0.05 hli |
| Kev kam rau siab ntawm countersink | +0.15 hli | ±0.15 hli | ±0.15 hli |
| Pawg Thawj Coj Thickness | 0.20-12 hli | 0.1-0.5 hli | 0.4-3 hli |
| Kev kam rau siab ntawm pawg thawj coj saib xyuas ( |
±0.1 hli | ±0.05 hli | ±0.1 hli |
| Kev kam rau siab ntawm pawg thawj coj saib xyuas tuab (≥1.Omm) | ±8% | / | ±10% |
| Qhov Loj Me Me ntawm Pawg Thawj Coj | 10 * 10 hli | 5 * 5 hli | 10 * 10 hli |
| Qhov Loj Tshaj Plaws ntawm Pawg Thawj Coj | 1200mm * 750mm | 500 * 1200 hli | 500 * 500 hli |
| Kev Sib Tov ntawm Cov Qauv | +/-0.075 hli (3mil) | ±0.05 hli | ±0.1 hli |
| Kuv lub BGA | 0.125 hli (5mil) | 7 lab | 7 lab |
| Kuv tus SMT | 0.177 * 0.254 hli (7 * 10mil) | 7 * 10mil | 7 * 10mil |
| Min Solder Mask Clearance | 1.5 lab | 2 lab | 1.5 lab |
| Kuv lub Solder Mask Dam | 3 lab | 3 lab | 3 lab |
| Lus dab neeg | Dawb, Dub, Liab, Daj | Dawb, Dub, Liab, Daj | Dawb, Dub, Liab, Daj |
| Yam Tsawg Kawg Nkaus Lus Qhia Dav/Siab | 4/23mil | 4/23mil | 4/23mil |
| Qhov tsawg kawg nkaus khoov vojvoog (Ib Leeg Board) | / | 3-6 x Rooj Tswjhwm Thickness | 3-7 x Flexbile Board Thickness |
| Qhov tsawg kawg nkaus khoov vojvoog (Ob Sab Board) | / | 6-10 x Rooj Tswjhwm Thickness | 6-11 x Flexbile Board Thickness |
| Qhov tsawg kawg nkaus khoov vojvoog (Ntau txheej Board) | / | 10-15 x Rooj Tswjhwm Thickness | 10-16 x Flexbile Board Thickness |
| Qhov tsawg kawg nkaus khoov vojvoog (Dynamic Bending) | / | 20-40 x Rooj Tswjhwm Thickness | 20-40 × Rooj Tswjhwm Tuab |
| Qhov Dav ntawm Cov Nqaij Ntshav | / | 1.5 + 0.5 hli | 1.5 + 0.5 hli |
| Hneev & Ntxig | 0.005 | / | 0.0005 |
| Kev kam rau siab impedance | Ib Leeg Xaus: ± 5Ω (≤ 50Ω), ± 7% (> 50Ω) | Ib Leeg Xaus: ± 5Ω (≤ 50Ω), ± 10% (> 50Ω) | Ib Leeg Xaus: ± 5Ω (≤ 50Ω), ± 10% (> 50Ω) |
| Kev kam rau siab impedance | Qhov sib txawv: ± 5Ω (≤ 50Ω), ± 7% (> 50Ω) | Qhov sib txawv: ± 5Ω (≤ 50Ω), ± 10% (> 50Ω) | Qhov sib txawv: ± 5Ω (≤ 50Ω), ± 10% (> 50Ω) |
| Lub Npog Ncauj Solder | Ntsuab, Dub, Xiav, Liab, Matt Ntsuab, Daj, Dawb, Ntshav | Lub Npog Ncauj Ntsuab / Dub PI / Daj PI | Ntsuab, Dub, Xiav, Liab, Matt Ntsuab |
| Qhov Chaw Tiav | Eiectronic kub plating, ENIG, Hard gold plating, Gold Finger, Immersion Silver, ImmersionTin, HASL LF, OSP, ENEPIG, Mos kub plating | Kev sib xyaw kub hluav taws xob, ENIG, Kev sib xyaw kub tawv, Kub ntiv tes, Kev sib xyaw nyiaj, Kev sib xyaw kub, OSP, ENEPIG, Kev sib xyaw kub mos | Kev kub plating hluav taws xob, ENIG, Kub tawv plating, Kub ntiv tes, Immersion Silver, Immersio Tin, HASL LF, OSP, ENEPIG, Kub mos plating |
| Txheej Txheem Tshwj Xeeb | Faus/dig muag ntawm txoj kab, kauj ruam groove, loj heev, faus tsis kam/muaj peev xwm, sib xyaw siab, RF, ntiv tes kub, N + N qauv, tooj liab tuab, rov qab drilling, HDI (5 + 2N + 5) | ntiv tes kub, lamination, Cov nplaum conductive, Zaj duab xis tiv thaiv, lub dome hlau | Faus/dig muag ntawm txoj kab, kauj ruam groove, loj heev, tsis kam/muaj peev xwm faus, sib xyaw siab, RF, ntiv tes kub, N + N qauv, tooj liab tuab, drilling rov qab |
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