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RF PCB Temperature Compensation: Hybrid Stack-Up Strategy with Negative and Positive TCDk Materials

RF PCB Temperature Compensation: Hybrid Stack-Up Strategy with Negative and Positive TCDk Materials
RF PCB Spiral Inductor: Line Width Tolerance Accumulation Shifts Resonant Frequency by 5%

RF PCB Spiral Inductor: Line Width Tolerance Accumulation Shifts Resonant Frequency by 5%
RF PCB Isolation: Layer-to-Layer Registration Misalignment ±2mil vs ±4mil — 10dB Isolation Difference

RF PCB Isolation: Layer-to-Layer Registration Misalignment ±2mil vs ±4mil — 10dB Isolation Difference
Rigid-Flex Coverlay Opening Copper Protection: ENIG Thickness Requires Special Control

Rigid-Flex Coverlay Opening Copper Protection: ENIG Thickness Requires Special Control
Rigid-Flex PCB Post-Bend Testing: Real-Time Impedance Monitoring Methods During Dynamic Bending

Rigid-Flex PCB Post-Bend Testing: Real-Time Impedance Monitoring Methods During Dynamic Bending
Rigid-Flex PCB CAF Risk: CAF Pathways in the Flex Area Are Different from Those in the Rigid Area

Rigid-Flex PCB CAF Risk: CAF Pathways in the Flex Area Are Different from Those in the Rigid Area
Rigid-Flex PCB Electromagnetic Shielding: Flex Area Shield Layer Design — Critical Considerations Often Overlooked

Rigid-Flex PCB Electromagnetic Shielding: Flex Area Shield Layer Design — Critical Considerations Often Overlooked
Rigid-Flex Flex Area Routing: How Arc vs. 45° Corners Impact Dynamic Bend Life

Rigid-Flex Flex Area Routing: How Arc vs. 45° Corners Impact Dynamic Bend Life
Rigid-Flex PCB Bend Radius Limits: Dynamic vs Static Flex Life Differs by an Order of Magnitude

Rigid-Flex PCB Bend Radius Limits: Dynamic vs Static Flex Life Differs by an Order of Magnitude
Copper Grain Direction vs. Bending Axis: The First Principle Determining Dynamic Flex Life of Rigid-Flex PCBs

Copper Grain Direction vs. Bending Axis: The First Principle Determining Dynamic Flex Life of Rigid-Flex PCBs
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PCB Knowledge

Analysis of Back Drilling Technology in High Speed PCB Design

Analysis of Back Drilling Technology in High Speed PCB Design
2020-04-08

The PCB via is usually designed as through-holes (from the top surface to the bottom layer). When the PCB line connecting the via is routed closer to the top layer, a “stub”bifurcation will occur at the via of the PCB interconnect link

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