High-Layer Thick-Copper PCB: The Future of Power Modules in Industrial and Medical Applications
In today's era, strategic emerging industries are booming rapidly, much like rockets taking off, while the degree of industrial automation is rising steadily, similar to an ascending ladder. In the vast expanse of the manufacturing industry, advanced production equipment and automated production lines are widespread, just like stars in the sky. Intelligent robots work nimbly on the production lines, CNC machine tools precisely carve every single part, and automated storage systems operate with high efficiency. The efficient and precise operation of these devices all hinges on a stable and reliable power supply. The high - power DC power circuit board, as the core foundation of power drive, has seized an unprecedented development opportunity amidst this booming tide and plays a pivotal role in modern advanced electronic devices and industrial systems.
- Unveiling the High - power DC Power Supply
The high - power DC power supply is a remarkable "veteran" in the field of electricity. It can output high - power DC electrical energy, with an extremely wide power output range, typically starting from several kilowatts and going up to hundreds of kilowatts or even higher. Its output current and voltage are as stable and precise as well - trained soldiers, and it has an adjustable output voltage and current range. This feature not only perfectly meets users' stringent requirements for high - current and high - voltage DC power supplies but also demonstrates outstanding advantages in voltage and current regulation, making it extremely convenient to use. In industrial production workshops, it provides a continuous stream of power for various large - scale equipment. In the precision instruments of scientific research experiments, it ensures stable power output to support research. In the vast field of new energy, such as in the conversion and storage of solar and wind energy, it is an indispensable part. In the communication field, it guarantees the stable operation of base stations and other equipment. In the medical industry, it provides reliable power support for various medical devices.
- The Company's Brilliant Achievement - High - layer Thick - copper Power Module Circuit Board
Recently, the company successfully delivered a high - layer thick - copper power module circuit board, which can be regarded as a masterpiece. With its advanced production technology and excellent performance, this product, like a masterful conductor, has successfully achieved stable power supply management for high - power DC power supplies, building a reliable power protection line for high - power DC power equipment.
- The Product's Outstanding Technical Advantages
(1) High - quality Materials Lay a Solid Foundation
The Taiyo Tu865 board is selected, which is a high - quality board with a good reputation in the field of electronic materials. Coupled with the thick copper foil design, it is like a warrior wearing solid armor, capable of calmly withstanding the high - voltage and high - current loads brought by high - power DC power supplies. The low - resistance current path provided by the thick copper foil is like a highway, allowing the current to pass smoothly, greatly reducing power loss and heat generation, thus maintaining good stability and reliability and laying a solid foundation for the stable operation of the entire circuit board.
(2) High - precision Circuit Layout Highlights Technological Charm
The design of two - time pressing, resin - filled buried blind holes, and asymmetric pressing is adopted, which is a highly innovative technology. The minimum requirement for hole copper reaches 50μm, and the aspect ratio is as high as 15:1. The high - density wiring is like a precise neural network, meeting the stringent requirements of high - power output of DC charging piles. This high - precision circuit layout can achieve more stable and accurate signal transmission. Like a reliable messenger, it can deliver power signals accurately to every corner, ensuring the efficient operation of the equipment.
(3) High - efficiency Conductive Performance Releases Strong Power
It has a 22 - layer high - thermal - conductivity thick copper plate structure, with an inner - layer copper thickness of 4oz and an outer - layer copper thickness of 2oz, and a minimum line width and line spacing of 7.87mil/7.87mil. The thick copper layer not only has good electrical conductivity but also excellent heat - dissipation characteristics. Like an efficient cooling fan, it can quickly dissipate heat, effectively improving the power conversion efficiency. It provides a stable power supply for high - power equipment. Just as a reliable heart supplies blood to the body, it achieves precise power management and meets the diverse power demands of complex electronic systems.
- Wide and Important Application Fields
This high - layer thick - copper power module circuit board has extensive and important applications in numerous fields. In the new energy field, especially in aspects such as solar energy, wind energy, and energy storage, like in DC charging piles, it is like a loyal guard, ensuring the stable transmission and supply of electricity. In the industrial automation field, it is like a tough warrior, capable of withstanding high - power loads and harsh working environments, providing strong power support for industrial robots, CNC machine tools, automated production lines, and other equipment, facilitating the efficient progress of industrial production. In the medical field, it transforms into a reliable protector, providing reliable power protection for medical imaging equipment, life - support systems, diagnostic instruments, and other medical devices, contributing to the protection of human health.
Facilitating the Success of Clients' Projects
Cracking the Code of Thick Copper Boards: Overcoming Press - Lamination Hurdles
In the dynamic realm of printed circuit board (PCB) manufacturing, the pursuit of high - performance components like thick copper boards has become a focal point, especially in applications demanding high - power handling capabilities, such as high - power DC power modules. Our recent encounter with a client's arduous journey to achieve a successful thick copper board production perfectly encapsulates the challenges and triumphs in this field.
The client, having endured multiple setbacks, finally turned to us. Their prior attempts at manufacturing 22 - layer thick copper printed circuit boards had been marred by consistent failures. These failures predominantly stemmed from issues within the press - lamination process, which is a critical stage in PCB manufacturing.
During press - lamination, the resin between the copper layers flows to bond them together. In the case of thick copper boards, the control of this resin flow becomes extremely tricky. One of the main culprits behind the client's failures was the problem of excessive or uneven resin flow, commonly known as "resin bleeding." When the resin flows too much or in an uncontrolled manner, it can lead to several issues. For instance, it may cause short - circuits between adjacent copper layers if the resin bridges the gaps between them. Uneven resin distribution can also result in inconsistent dielectric properties across the board, affecting its electrical performance.
Another crucial factor contributing to the failures was the delicate balance between the thick copper layers and the resin flow at the edges of the copper and the dielectric materials. The edges are particularly vulnerable areas during the press - lamination process. If the amount of resin flowing at the edges is not precisely controlled, it can lead to issues such as delamination at the edges of the copper layers. This is because insufficient resin may not provide enough adhesion, while excessive resin can create stress points that weaken the bond over time.
Temperature also plays a pivotal role in the press - lamination process. The temperature during lamination needs to be carefully regulated. If the temperature is too low, the resin may not flow adequately, leading to poor bonding between the layers. On the other hand, if the temperature is too high, it can cause the resin to over - flow, exacerbating the resin bleeding problem. Additionally, high temperatures can also cause thermal stress within the board, which may lead to warping or even cracking of the copper layers.
Our team of experts, with in - depth knowledge and extensive experience in PCB manufacturing, took on the challenge. We started by conducting a thorough analysis of the client's previous manufacturing processes. We examined the press - lamination parameters, including temperature profiles, pressure settings, and the type of resin used. Based on this analysis, we made several adjustments to the process.
We optimized the temperature profile during press - lamination, ensuring that the resin reached the optimal viscosity for proper flow without over - flowing. We also adjusted the pressure settings to ensure even distribution of the resin across the board. Additionally, we selected a resin with better flow characteristics and compatibility with the thick copper layers.
After implementing these changes, we successfully produced the 22 - layer thick copper printed circuit boards for the client. The boards met all the required specifications in terms of electrical performance, mechanical integrity, and dimensional accuracy. This success not only solved the client's production issues but also highlighted the importance of a meticulous approach to the press - lamination process in thick copper board manufacturing.
In conclusion, the manufacturing of thick copper boards is a complex process that requires precise control over multiple variables, especially during the press - lamination stage. By understanding the root causes of failures and implementing targeted improvements, we can overcome these challenges and produce high - quality thick copper boards that meet the demanding requirements of modern electronic applications.