Iinkqubo zoHlolo ze-PCBA ezikrelekrele: i-AOI, i-SPI, i-X-Ray, i-ICT kunye ne-FCT

1. Intshayelelo

Njengoko iimveliso ze-elektroniki ziguqukela ekudibaneni okuxineneyo nokuntsonkothileyo, ukuhlolwa komgangatho we-PCBA kujongana nemingeni eyandayo—ingakumbi ekuhlolweni kwe-micro-pitch yezinto ze-0201 (0.6×0.3mm) kunye nokuvavanywa kwamalungu e-solder afihliweyo kwiiphakheji ze-BGA/CSP. IPC-A-610H, imveliso yanamhlanje kufuneka igcine izinga leziphene lingaphantsi kwe-500 DPPM. Eli nqaku lichaza uhlalutyo olucwangcisiweyo lweenkqubo zokuhlola ezinamanqanaba amaninzi, ezidibanisa ulawulo lwenkqubo, ubuchwepheshe bokuvavanya obukrelekrele, kunye nokulandeleka ngexesha langempela.

2. Uyilo lweNkqubo yoBugcisa boHlolo

2.1 Uyilo lweeNdawo zoHlolo oluGqibeleleyo

Inkqubo yokuhlola enamanqanaba amane iqinisekisa ukugutyungelwa komgangatho opheleleyo:

• ·Inkqubo yangaphambi kokuqhutywa: I-3D SPI (±5μm) + AOI yokulungelelanisa indawo
• ·Emva kokuphinda Ubuye: I-AOI enamacala amabini + i-3D X-Ray (isisombululo se-5μm)
• ·Uvavanyo loMbane: I-ICT (ugutyungelwe ≥95%) + i-FCT
• ·Uhlolo lokugqibela: Isampuli yovavanyo olutshabalalisayo lwe-AVI +

2.2 Izalathisi Zokusebenza Eziphambili

• ·Ixesha lokuqinisekiswa kwenqaku lokuqala: ≤ imizuzu eli-15 (xa kuthelekiswa neeyure ezi-2 ngokwesiko)
• ·Izinga lokubaleka elifanelekileyo:
• ·Ukugcinwa kokulandelela idatha: ≥iminyaka eli-10

3. Uhlalutyo lweeTekhnoloji zoHlolo oluPhambili

3.1 Uthelekiso lweeTekhnoloji zoHlolo lwe-Optical

3.2 Amandla okuhlola i-X-Rey

• ·Umfanekiso we-CT Tomographic: Ifumanisa umlinganiselo we-BGA ongenanto IPC-7095
• ·Ukucutshungulwa Ngexesha Langempela: Ukucutshungulwa komfanekiso nge-≥25fps
• ·Ukuchaneka koHlelo oluPheleleyo: >98% ngee-algorithms ezisebenzisa i-AI

4. Iinkqubo zoVavanyo loMbane

4.1 Uyilo lovavanyo lwe-ICT

• ·Ubuncinane bovavanyo: ≥0.8mm
• ·Uluhlu lweVolthi: 0–50V
• ·Ukuchaneka kokulinganisa: ±1% (ukuxhathisa), ±2% (umthamo)

4.2 Izisombululo zoVavanyo lweFCT

• ·Iitshaneli ze-I/O: Ixhasa iziteshi ezingaphezu kwe-1000
• ·Uluhlu lweeFowuni: DC–6GHz
• ·Ukuchaneka kwendawo yempazamo: ±5mm

5. Inkqubo yoLawulo lweDatha esemgangathweni

5.1 Ideshibhodi yokubeka esweni ngexesha langempela

• ·Ukubeka iliso kwimveliso ephilayo (hlaziya rhoqo emva kwemizuzwana eyi-1)
• ·Uhlalutyo olugqibeleleyo lwemephu yobushushu
• ·Umboniso we-OEE wezixhobo

5.2 Inkqubo yokuLandelela

• ·Ibhakhodi eyahlukileyo okanye i-UID yebhodi nganye
• ·Unxibelelwano lwedatha olupheleleyo lwenkqubo
• ·Ukuhlanganiswa kwe-MES/QMS kulungile

6. Amatyala ezicelo zoshishino

6.1 Izixhobo zombane zeemoto

• ·Iqinisekisiwe phantsi I-AEC-Q100
• ·Isantya sokungaphumeleli se-0km
• ·Ithobela ingxelo ye-8D

6.2 Izixhobo zonyango

• ·Ukuthobela i-ISO 13485 kwizixhobo ze-elektroniki zonyango
• ·Ukuhlolwa kwe-100% kweempawu ezinobungozi obukhulu
• ·Uvavanyo lokubulala iintsholongwane kunye nokuhambelana nokusingqongileyo

7. Uhlalutyo lweNzuzo

Ngoku ka Isikolo samabanga aphakamileyo 2022, ukuphunyezwa kweenkqubo zokuhlola ezikrelekrele nezinamanqanaba amaninzi kukhokelela koku:

• ·30% ukunyuka kwesivuno sokuqala
• ·40% ukuncitshiswa kweendleko ezipheleleyo ezinxulumene nomgangatho
• ·60% izikhalazo zabathengi ezimbalwa

8. Isishwankathelo: Ixesha Elitsha Lokuhlolwa kwe-Smart PCBA

• ·Izikhokelo zokuhlola ubuchwepheshe obuninzi (i-AOI + i-SPI + i-X-Ray + i-ICT/FCT)
• ·Ii-algorithms zokugweba iziphene ezikrelekrele eziqhutywa yi-AI
• ·Ukulandeleka komgangatho wedijithali osebenza ngokupheleleyo kunye nokuhlanganiswa kwe-MES

Ngale ndlela icwangcisiweyo, abavelisi banokufikelela kumanqanaba omgangatho weSix Sigma (), ukuseta imilinganiselo emitsha yokuthembeka kwe-PCBA yehlabathi.

Iireferensi

1. 1.IPC-A-610H, 2020
2. 2. Iinkqubo zobuGcisa zeSMTA, 2022
3. 3.AEC-Q100 Rev-H, 2014
4. 4.ISO 13485:2016
5. 5.IPC-7095D, 2021